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Effects of Indium on Wetting and Interfacial Features of a Sn-40Bi Alloy in a Copper Substrate

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Abstract

The influence of In on the solidification path, microstructure, wettability, tensile properties, and interfacial features of a Sn-40Bi alloy was studied using Computer Coupling of Phase Diagrams and Thermochemistry (CALPHAD) calculations, differential scanning calorimetry, scanning electron microscopy, x-ray diffraction, wettability testing and tensile testing. The microstructures were composed of Sn-rich matrixes with Sn-Bi and BiIn-Bi constituents. Significant sensitivity of the microstructural scale to the solidification cooling rate was also demonstrated by employing different processing conditions. Because of the relatively high BiIn fraction on the microstructure, a limited elongation of approximately 7% was achieved, with ultimate tensile strength of 65 MPa. Cu6(Sn, In)5 was the intermetallic phase of the reaction film for the Sn-Bi-In/Cu interface under all tested conditions, including as-soldered and aged at 100°C and 120°C for 120 h, 240 h, and 360 h. Wetting angles for the ternary Sn-Bi-In alloy were maintained at approximately 20°, which is smaller than usual for Sn-Bi alloys. The new phase, Cu6(Sn, In)5, produced instead of Cu6Sn5, showed a lower growth rate than that observed in In-free couples. The mechanisms of wetting and the Cu6(Sn, In)5-layer growth are discussed.

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Acknowledgments

The authors acknowledge FAPESP (grants #2019/23673-7 and #2021/08436-9) and CNPq. This study was financed in part by the Coordenação de Aperfeiçoamento de Pessoal de Nível Superior—Brasil (CAPES)—Finance Code 001.

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Authors and Affiliations

  1. Federal University of São Carlos, Graduate Program in Materials Science and Engineering, São Carlos, SP, 13565905, Brazil

    Jaderson Rodrigo da Silva Leal, Rodrigo André Valenzuela Reyes & Guilherme Lisboa de Gouveia

  2. Department of Materials Engineering, Federal University of São Carlos – UFSCar, São Carlos, SP, 13565905, Brazil

    Francisco Gil Coury & José Eduardo Spinelli

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  1. Jaderson Rodrigo da Silva Leal
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Correspondence to José Eduardo Spinelli.

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da Silva Leal, J.R., Reyes, R.A.V., de Gouveia, G.L. et al. Effects of Indium on Wetting and Interfacial Features of a Sn-40Bi Alloy in a Copper Substrate. J. Electron. Mater. 52, 2957–2970 (2023). https://doi.org/10.1007/s11664-023-10258-4

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