Vision & Mission
To offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems. ASE will act as an extension of our customers’ own operations in achieving the maximum business objectives with minimum resources and smart manufacturing.
To stay ahead of the semiconductor technology curve, ASE maintains a highly experienced and skilled engineering team that continuously research and develop the very latest in assembly technology.
ASE leverages on AI, Big Data and Smart Automation to enable smart manufacturing.
Global Leadership
ASE Malaysia is part of Advanced Semiconductor Engineering (ASE) Group, the world’s largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader, ASE provides a complete scope of services for the semiconductor market; driven by superior technologies, breakthrough innovations, and advanced development program.
Innovation
Our innovation products consist of a wide range of advanced and legacy semiconductor packaging and testing services.
ASE Malaysia assembly deploys either leadframes or substrates as packaging interconnect materials. Gold /Copper wire is adopted in wirebonding.
ASE Malaysia is one of the pioneers in adopting copper wire bonding technology.
We offer copper wire to support our valued customer in lowering the packaging cost.
We also provide backend 12"/8' wafer level chip scale package (WLCSP).
Certified
ASE Malaysia is certified to ISO9001, ISO/TS16949, ISO14001 and IECQQC080000 standards.