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Diffusion of Cu and interfacial reactions during reflow of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga alloy on Ni/Cu substrate

Published online by Cambridge University Press:  14 March 2012

Jagjiwan Mittal  and
Kwang Lung Lin
Jagjiwan Mittal
Affiliation:
Department of Material Science and Engineering, National Cheng Kung University, Tainan Taiwan, 701, Republic of China
Kwang Lung Lin*
Affiliation:
Department of Material Science and Engineering, National Cheng Kung University, Tainan Taiwan, 701, Republic of China
*
a)Address all correspondence to this author. e-mail: matkllin@mail.ncku.edu.tw
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Abstract

Reflow behavior of a Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga (five-element) solder on the Ni/Cu substrate was investigated under different heating rates. Reflowed samples show decreased Zn and increased AgZn3 in the solder with a reduction in the heating rate. The Zn at the solder/substrate interface was found to be much lower than that in the Sn–Zn solder systems. Cu was observed to be diffused through the electroplated Ni layer and noticed only with the Ag–Zn compound in the solder. Ga was spotted at the interface in the Ag–Zn matrix, whereas Al was detected with the Zn at the interface. Small intermetallic compound (IMC) layer was formed at the interface; however, its amount enhanced with the reduction in the heating rate. Present study relates the reflow behavior of the five-element solder with the reactivity of different elements in the system and its influence on the formation of IMCs in the solder and at the solder/substrate interface.

Keywords

DiffusionScanning electron microscopySoldering
Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 8 , 28 April 2012 , pp. 1142 - 1148
Copyright
Copyright © Materials Research Society 2012

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