Revision E-20'0 Supersades Revision D Febuary 2005 a IPC-A-610 YY | Acceptability of Electronic Assemblies ‘Developed by Association Connecting Flectronies industries CiPc.CiPc. \Gupersedes: IPO-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983 IPC-A-610E-2010 Acceptability of Electronic Assemblies Develuped Ly thts IPC-A-610 Uevelupiient (ean incluuing Task Group (7-910), Task Group Asla (7-3 1DCN) and Task Group Nordic (7-31DND) of the Product Assurance Committees (7-30 and 7-30CN) of IPC Users of this publication are encouraged to participate in the development of [ulure revisions. Contact: Ire. NNN | akasida Nrive, Suite 3nS Bannockbum, tlinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105IPC-A610 ADOPTION NOTICE IPC-A610, "Acceptability of Electronic Assemblies", was adopted on 12-FEB-02 for use by the Department of Defense (DoD). Proposed changes by DoD activities must be submitted to the DoD Adopting Activity: Commander, US Army Tank-Automotive and armaments Command, AVN: AMSYA-rk-E/18, Warren, ML 4¥8497-SUUU. Copies of his ducument way be purchased from Uke The Tustilule for Intcrconnecting and Packaging Electronic Circuits, 2215 Sanders Rd, Suite 200 South, Northbrook, IL 60062 http://www. ipc.org/ Custodians: adopting Activity: Army — AT Aemy - AT Navy - as (Project SOLD-0060) Mir Force - 11 Reviewer Activities: Army - AV, MI AREA SOLD DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited,Acknowledgment ‘Any standard involving a complex technology draws material rom a vast number of sources across many continents. Shown bbelow are the principal members of the IPC-A-610 development learn including Task Group (7-310), Task Group Asia (7-31CN) land Task Group Nordic (7-31bND) of tho Procluet Accuranco Commtoce (7 80 and 7 20CN). Ia not possible to include all of those who assisted in the evolution ofthis standard, To each af them. the members of tha IPC aviendl their ratiids Product Assurance Committee Chair Met Parish STI Elootonice IPC-A-610 Task Group (7-31b) Co-Chairs Constantino J. Gonzalez ‘ACME Training & Consulting Jennifer Day Sianiey Assucies IPe-8-6410 Tack Group (7-21bNN) Co-Chairs ‘Alex Christensen HYTEK Mari Paakkénen Nokia Siemens Networks Oy Technical Liaisons of the IG woara or Lirectors eter tigelow sammy ¥1 IM Ine. ‘Aatina Imaging Qorporation IPG-A-610 Task Group (7-31bCN) Co-Chairs ack Zhao Emerson Network Power Co. Ltd Weng Renhua, abi Grout Members of IPC-A-610 Task Group (7-31b) ‘Acye Grushka, A. A. Trainina Consuitina and Trade A.G. Lid. Teresa Rowe. AAI Corporation Constantina Ganvalar. ACME Training & Cansuiting ary Morris, Arvancad Rawnrke Tarhnolngy-A RT Susan Mois, Advanced Rework Technalagy-& RT Debbie Wada, Advanced Rawork Technolagy-A.R.T Darrin Dodson, Alcatel-Lucent Russell Nowland, Alcatel-Lucent Joseph Smetana, Alcatel-Lucent Michaal Aldrich, Analog Dovicee Ine. Richard Brown, Ancraw Corporation Chrictophor Sattler, AGS All Quality & Sonviooe, Ino. Soot Vonhaus, “row Eloctronioe Ino Mark Shiraman, ATK Advanead Woapane Division Grog Hurot, BAE Syatame Mark Hoylman, BAE Systems CNI Div. Joseph Kane, BAE Syeteme Platform Solutione \Jacbir Bath, Bath Technical Coneuitancy Gorald Loco Bogert, Bechtel Plant Machinery, ne. Linda Tuaker, Blaolfox Training Inotute Kart Mucller, Docing Company Mary Beton, Decing Satellite Development Contor Michael Jawite, Dosing Eatelite Development Cocter Jock Olgon, Caterpillar Ine. IPC-A-610E-2010 Andre Baune. CEFOPS Kimberly Aube-Juroens. Celestica Zeneida Valian, Celestion | avarya Grnalakishnan, Clann Systems Ine Ken Hubbard, Cison Systems ine Steven Perng, Cisco Systems Ine. Robert Scott Prove, Cisco Systems Inc. Francisco J, Bricaho Z., Continental José Ma. Servin O., Continental Holona Pasquito, Cobham Dofonee Eloctronic Systeme Jack MeCsin, Continontal Automotive Systeme US, Ino. Paul Lotecky, Cookeon Eloctrenice Mary Muller, Crane Aeroepace 8. Eloctronice Roggio Mall, Creation Tachnalogize Incorporated Danial Fecter, Defence Acquistion Ine Lowell Sherman, Defenes Supply Center Columbus Walace Ables, Del Inc. ‘Michael Blazier, Delphi Electronice and Safty John Boreman, Delphi Electronics and Safety Glonn Dody, Dodly Conoutting ‘Anne Lomente, Dracger Medical Systeme, no. Wooley Melowias, Draoger Medioal Systema, Ino. Wiliam MeManoa, ONE Teot & Energy Management Jon Moberta, NG Test & Energy Management Apel 2010. iAcknowledgment (cont,) Gabriel Rosin, Elbit Systoms Lis. Pam MoCord, Ebi Syetoms of Amorioa cls Zhao, Emerson Networks Power Oo. Lich L2o Lambert, CPTA Corporation Bean Hissin, Biss AB ‘Nesny Chisn, lexiunics Hector Laros, exons Longkai snangguan, Hextronies Vicky (Fortunata) Freeman, Flextronics Amora, LLG Michael Yuen, Foxconn CMMS-NVPD Terry Bumstte, Freascale Semiconductor, In. Stephen Fribbins, Fribbins Training Services Fy Davison, FS! Gary Ferra, FTG Circuits Frederick Santos, General Dynamics - C4 Systems Doug Rogers, Hers Corporation, GOSD Eizabeth Benedetto, Hewlett-Packard Company Helen Holder, Hewett Packard Company ston Troxel, Hewlett-Packard Company Robert Zak, Honeywell John Mastordes, Honeywell Aerospace Electronic Systems Fichard Rumas, Honeywell Canada Wiliam Novek, Honeywel Intemational Gordon Sutivan, Huntsman Advanced Technology Center Donald McFarland, Inovar, nc Ficherd Pond, tron, inc. Luca Moitemi Istituto itlano dela Saldatura CQuyen Chu, Jab Circuit, nc. ‘Thomas Ciclowski,Jabi Gui, Inc Gish Wable, Jail Grout, Ine. (HO) Reza Ghafaian, Jet Propusion Laboratory ‘Nan Young, Jet Propulsion Laboratory ‘Akikazu Shibata, JPCA-Jepan Electronies Packanina and Grcuits Association Nancy Bulock-Ludwig, Kimball Electronics Group Frederick Beltran, L-3 Communications Byron Case, L-3 Communications Norma Moss, L- Communications Bien Taboo, L-3 Communications Peter Menuez, L-3 Communications - Cincinnati Electronics Bruce Bryia, L-8 Communications, Nerd Viay Kumar, Lockheed Martin Missile & Fire Control Linda Woody, Lockheed Martin Missie & Fire Control ‘Sam Pok, Lockheed Martin Missiles and Fire Control Hue Green, Lockheed Martin Space Systems Company Michael Green, Lockheed Martin Space Systems Company v April 2010. David Ma, Lockhoed Martin Space Syetome Company Donnie Fite, MacDermid, Ine He Yun, Manson Chgineering Insti), Lid eines Muffil, Mui Oursutiny vives Bl Kaspreak, Muuy 1 Mary Lou Saunentk, tog in. oven Humpnrey, NASA Goodera Space Hight Venter Hobert Gooke, NASA Johnson Space Uenter ‘James blanche, NASA Marshall Space Fight Cantor Charles Gamble, NASA Mershall Space Fight Genter Christopher Hunt, National Physical Laboratory Wade MoFaddin, Nextek, Inc Nil Treford, Nortel Networks ‘Clarence Knapo, Northrop Grumman Mahendra Gandhi, Northrop Grumman Aerospace Systems ene Martinez, Northrop Grumman Aerospace Systems Randy MeNut, Northrop Grumman Corp. Mac Butler, Northrop Grumman Corporation Tana Soffa, Northrop Grumman Corporation ‘Andrew Viardo, Northrop Grumman Corporation Wiliam Rasmus, Northrop Grumman SES Peggi Blakley, NSW Crane Andrew Ganster, NSWC Crane Wiliam May, NSWC Crane Joseph Sherfick, NSWC Crane Ken Moore, Omni Training Corp. Matt Garrett, Phonon Corporation Rob Walls, PIEK International Education Centre BV Timotty Pisch, Plexus Corp. Lule Pisch, Precus Corp, Guy Ramsey. R&D Assembly James Daggett, Raytheon Company Gerald Frank, Raytheon Company Amy Hagnauer, Raytheon Company Lynn Krueger, Raytheon Company Lisa Macidlek, Raytheon Company Kenneth Manning, Raytheon Company Foger Miedioo, Raytheon Company David Nelson, Raytheon Company Wiliam Ontot, Raytheon Company Peter Patalano, Raytheon Company Fonda Wu, Reytheon Company kathy Johnston, Raytheon Missie Systems Patrick Kane, Raytheon System Technoloay Steven Herrberg, Raytheon Systems Company Paula Jackson, Raytheon Systems Ltd IPC-A-G10E-2010Acknowledgment (cont.) overly Mac laggart, Rockwell Coins LLougtas Pauls, Rockwell Colins ‘Gaston Hidalgo, Samsung Telecommunications America Fichard Henvick, Sanmina-SCi rent Sayer, Schlumiberger Well Services [Dan Kelsey, Scienscope International Corporation Finn Skaanning, Skaanning Quality & Certfcation-SQC Bob Wilis, SMART Group Terry Citherve, Solder Technologies Roger Bel, Space Systerns/Loral Jennifer Day, Stanley Associates Frank Hules, Stelar Microelectronics Inc. Mel Parish, STI Electronics ‘Members of IPC-A-610 Task Group (7-31bCN) lack Zhan, Fmarsnn Natwevie Pawar C4 Wang Ranh, Jah Cirvit (Shangha) Thang Vian, Hawai Tachnnlagies An Ue He Yun, Manson Engineering Ind Ltd LU Liy, Jail Circuit Shangha) Zhou Hung, Huawel Technologies Co,, Ltd Patricia Scott, STI Electronics Bee-Eng Serafyn, Strtatiex Corporation Kel Sauter, Sun Microsystems, Inc. ‘Tracy Clancy, Technical Training Center Cary Schmit, Teknetix nc. Bruce Hughes, U.S, Army Aviation & Missile Command ‘Sharon Ventress, U.S. Army Avation & Missile Command Constantin Hudon, Varitron Technologies Inc. Denis Barbini, Vtronics Sottec David Zuack, Western Dicital Corporation Lionel Fullwood, WKK Distribution La. Stevan Sauer Xatron Coen Ha Mepang, Husa Technalagiae Ca, | Jia Bianfon, ZTE CORPORATION ‘Tang Muomei, ZTE CORPORATION Luo Jincong, Shenzhen KAIFA Technology Co,, Ltd ‘Charlo Zhao, Emeraon Network Power Co. Ltd. Members of IPO-A-G10 Task Group (7-O1END) ‘Turi Bach Roslund, Bang & Olutsen A/S Keld Maaloe, BB Electronics A'S Benny N. Nisson, Ericsson AB. Olt Richard Cramer, Flextronics A/S Mona Johannesen, Flextronics A/S Jesper Konge, Gasdal Bygringsindusti WS Michael Lassen, Grundios AS Palle Lund Pedersen, Grundfos A/S Svein Kolbu, Hadetand Produkter Jens Andersen, HYTEK ‘Alex Christensen, HYTEK Christian Houmann, HYTEK Poul Juul, HYTEK IPC-A-610E-2010 ‘Anny Benthe Emmerud, Kongsberg Defence & erospuce AS Gregers Uyooa, Unak AVS ‘Man Paackonen, Nokia Siemens Networks Uy Jorge Nordhus, Norautron Ass Jens R. Gotler, OU Electronics WS Finn Skaanning, Skeamning Qualty & Certification Kai-Lykke Mathiasen, Syromatio A'S Bian Jakobsen, Terma A/S Michael Pouisen, Terma A/S Torben Kruse, Vestas Control Systems AS Jan Vind, WesternGeco April 2010,Acknowledgment (cont.) SPECIAL ACKNOWLEDGMENT Wa wuld laa to provice special acknowledgment to the folowing members for providing pictires and ilustrations that are used in tis revision ‘Conetantino Gonzales, ACME Training & Consulting Darrin Daccon, Aloatal Lucent Danial Foster, Dofenco Acqucition in. Jock Zhao, Emorson Notworks Powor Co. Lt Ho DaPong, Huawoi Toshnalagioe Co.,LTD. Zhou HuLing, Huawei Technologies Co..LTD. Zhang Yuan, Huawei Tectnologies Co.,LTD. ‘Alex Cvietenean, HYTEK Donald MeFarland, Inova, Ine Luca Molitor, lttuto Halane dots Galdatura Wang Fenhua, Jail Cxoult, Shanghai Nanay Bullook Ludwig, Kimball Bootronioa Croup Notma Mose, L:@ Communications Bon Tabbot, L 3 Communication C. Don Dupricst, Looldhoed Martin Miasloe and! Fro Contra Linda Woody, Lookheed Marin Misa & Fire Contr Hue Groen, Lockheed Martin Space Syctoms Company He Yun, Manson Engineoring Indusval, Lc. 6-86, 687, 6-96, 6-100, 101, 6102, 6108, 6-104, 6.107, 108, 10, 110 111, 11S, 6174, 6195, 117, B18, 119, 129, Tanne by pemison, ‘erigues ou) ees we, WU, 81, 8.764, 18, 1B, 8-167, TE, vw April 2010 Bil Keoprzake, Moog Ine. Meri Pinon, Nokia Giomona Netiworke Oy Poggi Blodey, NEWC Crane Kon Moora, Omni Training Corp." Rob Wallo, PIEK Intomational Eduostion Centro BY Julio Pitech, Ploxus Corp Kathy Johnaton, Raytheon Miscile Systems Marcin Sudomir, RENEX David Hillman, Rockwell Colina Douglas Paulo, Neciewell Coline Bob Wille, EMATT Group? encifor Day, Glenley Associates Mel Parish, GTI Clectronies Patricia Scott, CTI Clectronico Bee Cng Seralyn, Ctratalex Conporation Kee Dautes, Gun Microsystems, ne: Philipp Hechenberger, TidonicAtoo Gmbl! & Co KG IPC-A-610E-2010Table of Contents 1 Foreword 4st Scope 19° Purpoce 1.8. Classification 14 Definition of Requirements 1.4.1 Acceptance Criteria 4.4.11 Target Condition 1.4.12 Acceptable Condition 1.4.1.3 Detect Gonaition 481.94 Diguusiion 444.4 Process Inckoator Coneition 4141.41 Prana Inekeatar Methodalogins 1.4.15 Combined Conditions 1.4.16 Conditions Not Specified .. 4.41.7 Specialized Designs 1.5. Terms & Definitions 1.5.1 Board Orientation 1.8.1.1 "Primary Side 1.5.1.2 “Secondary Side 4.5.1.0 Gokter Gource Olde 1.6.1.4 Soldor Destination Sido 452 *Cald Snider Connection 1.53 Electrical Clearance 1.5.4 High Voltage 1.55 Intrusive Sokier 156 “Leaching 1.5.7 Meniscus (Component) 4.5.8 *Nonfunctional Land 15.9 Pin-inPasto ... 1.5.10 Wire Diameter 1.5.11 Wire Overwrap 15.12 Wire Overlap 1.6 Examples and illustrations 1.7. Inspection metnoaoiogy 4.8 Verification of Dimensions 4.9 Magnification Aids 4.40. Lighting 14 12 18 2 Applicable Documents £4 10 Documents 2.2 Joint Industry Documents 28 EOSIESD Association Documents 24 electronics industries alliance Documents 2.5 International Electrotechnical Commi Documents: 2.6 ASTM 2.1 Technical Publications 2. Hondling Elostronie Acoomblice 3.1 EOS/ESD Prevention BA1 lentrical Querstrass (FOS) 8.1.2 Electrostatic Discharge (ESD) 3.1.3 Waming Labels 8.1.4 Protective Materials 3:2 ROS/ESD Sate Wornstauon/EPA 2.2 Handling Considerations 2.84 Guidelines 2.32 Physinal Ramage 8.33 Contamination 2.34 — Bectronic Assembies 835 After Solberg 83.6 Gloves and Finger Cots .. 4 Hardware 1 Hardware Installation 444 Bloctical Clearance 44.2 Interference 41.3 Heatsinks 4.1.3.1 Insulators and Thermal Compounds 4.1.3.2. Contact . 4.1.4 Threaded Fasteners 4.14.1 Torque 41.4.2 Wires 4.2 Jackpost Mounting Apel 2010 24 2a 22 22 or eo ata 340 310 at a2 41 42 49 43 43 46 48 AD an viTable of Contents (cont.) 4.3. Connector Pins 4.4 Edge Connector Pins 452 Press Fit Ping 4824 Soldering 4.4 Wire Bundle Securing 444 General 442 Lacing 4.42.1 Lacing Vamage 4.8 Routing . 4.51 Wre Crossover .. 4.2 Bend Rade 452 Coanial Cable 4.54 Unused Wire Termination 455 Ties over Splices and Ferules 5 Soldering 2.1 Sulteriny Acveptability Meyulrenments 5.2 Soldering Anomalies 524 522 528 524 525 526 Ber sara 5270 5273 528 529 52.10 52M Date 219 Exposed Basic Metal Fin Holes/low Holes Retlow of Solder Paste Nonwetting a ‘Cold/Rosin Connection Dewetting Excess Soiaer Sublet Bally Suider Fines Bridging i Soller Wehing/Spiashes Disturbed Solder Fractured Solder Solder Projections Lead Free Filet Lit Lega Free Hot lear/Shnnk Hole Poly Moths and Ouler Sink Surface Conditions in Calder Jointo 6 Terminal Connections 6.1 Swaged Hardware 614 eata 611.2 6113 onze va Terminals Terminal Base ~ Pad Gap Terrinals - Turet Terminais ~ Biturcated Pte Faye oo ‘April 2010. 6.1.8 Flared Flange 6 6.1.4 Controlled Spit 67 6.1.5 Solder 68 6.2 Insulation 610 621 Damage 6-10 62.1.1. Presoider 610 62.1.2 Post-Solder 612 022 Glewance ols 623° Flexiole Sleeve sn BAS 62.3.1 Placement... om B15 62.32 Damage 6-17 6.3 Conductor 648 68.1 Deformation ... 618 632 — Strand Damage su 619 633 Strand Separation (Birdcaging) ~ resoloer : 620 034 Strand Separattun (GruGaylY) ~ Poot Solder oot 685 Timing 622 6.4 Service Loops 624 6.5 Terminals ~ Stress Relief 625 65.1 Bunde 6-25 8.02 Leauwire Bend oz 5 Torminale - Lead/Wire Placement — General Reauirements oR, 6.7 Terminals - Solder ~ General Requirements ... 6-30 ©.8 Terminals ~ Turrots and Straight Pins 6a 681 LeadWre Placement 6-81 082 Soder 6-33 6.0 Torminale Bifurcated ons 0.9.1 LeadWiiy Plaustiesil— Side Rue Attaohmente : o-04 69 | aaeiMtiea Placamont ~ Battom and ‘Too Route Attachments aa7 693 LeadMire Placement - Staked Wires 6-38 694 Solder 6-39 6.10 Terminals - Siotted 642 6.10.1 Lead/Wire Placement 642 bu Soler 6-43 IPC-A-610E-2010[ Table of Contents (cont.) 16.11 Terminals - Piercod/Porforated 644 7.2 Component Securing Hi 7:25 6.11.1 LeadiWire Placement “ 644 7.2.1 Mounting Cips 725 BINZ SOEF enn . 6-46 7.22 Adhesive Bonding 72 (-2:2.1 _Adnesve Bonding - Nonelovated G12 Terminals ~ Hook oar Sonpurents Panels 12.1 Leau/Whe Pacerent var 7228 Adhesive Donding — Clveted BABE older von secre OD ‘Components ee won 784 7.23 Wire Hold Nown 7.20 13 Terminale - Solder Cups 50 7.8. Supported Hotes 138 6.19.1 LeadWire Placement 650 7.3.1 Ail Leaded — HotZont nn 738 6132 Solder z 6527.82 Aral Leacked ~ Vertical 735 7.88 Wro/Load Protrusion pore 707 44 Torminale ~ AWG 20 and Sm 74 — Whroflaad Cinchos 7-38 Diameter Wires Ass 735 Solder 740 ttl Less ee seme 64 735A Vertical fil (A) — sun TA, 7.35.2 Primary Side ~ Lead to Barrel 8) acess 745 7.3.5.3 Primary Side ~ Lend Area Coverage (G) ..... 7-47 a aaa SSS (3.0.4 Secondary Side — Lead to Bar (D) sons TAB 7.9.5.9 Seanlay Side — Lana Area Coverage (E) «1-49 6.16 Terminals - Edge Clin ~ Position FER 7.9.5.8 Baldor Conditions ~ Calder in Leas! Den «7-60 7857 Solder Conditions ~ Touching Through-Hiole 7 Through Hole Technology TA Component Body 7st 7.88 Solder Conditions — Meniscus in Solder... 7-52 TA Component MotmntINg scien 7.2 7.359 Lead Cutting eter Soldering nse T-5B pliner cst 79 75410 Coated Wite Insulation in Solder 754 Caterer <2) £88.71 interacial Connection without Lead = Vis. 7-55 ee eee 798.12 Boudin Bows itn OH 7.4.2 Lead Forming «. einer 7-6 7.4 Unsupported Holes . 1-59 24.21 Bends swe 7-8 7.4.4 Axl Leads — Horizontal 7-59 Ti22 Suess Rete T3742 Arial Leads ~ Vertical cnsncnsnssnsnrnne 7-60 7ABB_ Damage eves “ «740 7.43 Wire/Lead Protrusion a 761 7.4.3 Leads Crossing Conductors oT 3d. Wwelectomches: 782 7.4.4 Hole Obstruction 742 745 Solder eee 7-04 7.1.5 DIPISIP Devos and S00KeIS rnin 7137146 Lead Cutting ater Soldering 785 71.8 Radial Leads ~ Vertical nnn 745 71181 Spacers 4678. Jumper WHERE 767 7.7 Racal Leads ~ Horizontal 748 7.5.1. Whe Selection... 7-67 TAB COMECOS sewn 13 652 We Houtng . 1-88 TAO. ight Angle Tet 7.5.9 Wie Stanly 1-70 7.1.8.2 Vertical Shrouded Pin Hoadore and 7.6.4 Bupportod Holo wn gee Vertical Rerentade Connectors 7.99 TRAY lead in Hole 772 71.9 High POWER snes 7-23 7.5.5 Wrapped Attachment snus se FB 7.1.10 Conductive Cases 724 758 Lap Soldered — 773 April 2010 ixTable of Contents (cont.) 2 Surface Mount Accomblice 81 Staking Adhesive 84.1 Comsonant Bonding 81.2 Mechanical Strenath 8.2 SMT Leads 82.1 Damage 822 — Flattening 8.3. SMT Connections 8.8.1 Chip Components ~ Bottom Only Terminations 891.1 Side Overy (A) 9.2.1.8 End Overhang (@) RATA Fd lint With (7) 83.1.4 Side Joint Lenath (D) 83.1.5 Maximum Filet Height ©) 83.1.6 Minimum Filet Height (F) 83.1.7 Solder Thickness (G) 83.1.8 End Overap (i) 8.3.2 Rectangular or Square End Chip Componente — 4, 2 oF 5 Sida Terminations: 2.2.2.1 Side Overhang (A) 832.2 — End Overhang (8) 832.3 End Joint Width (©) 83.2.4 Side Joint Length (D) 83.2.5 Maximum Fillet Height (©) 83.2.6 — Minmnum Filet Height (+) 832.7 Thickness () 8.8.2.8 — End Overiap (J) 822.9 Termination Varations 8829.1 Mounting on Sida (Bithoarriing) 83.2.9.2 Mounting Upside Down 832.93 Stacking 832.94 Tombstoning 882.10 3 lerminations 0.9.2.10.1 3 Teninains ~ Soker wt! 10.9.2.10.2 0 Terminations ~ Minimurn Filet | light 8.3.3. Cylindrical End Cap Terminations 83.3.1 Side Overhang (A) 83.8.2 Ferd Ovehang (R) os 810 att B12 B13 B13 B14 Bla 8.33.3 End Joint Width (©) 1 896 RAR4 —Side.toint length () 837 8.3.3.5 Maximum Filet Height (E) 838 8338 Minimum Filet Height (F) 239 8337 Solder Thickness (6) 8-40 8338 End Overlan () eat 0.04 Castellated Terminations era 8.9.1 Side Overly (A) oo 8.3.4.2 End Overhang (8) ed 349 Minimum End int Wath (3) Baa 83.44 Minimum Side Joint Lenath (0) B45 8345 Maximum Filet Height () B45 83.46 Minimum Fiket Height (F) B48 83.47 Solder Thickness (G) 846 0.0.5 Flat ull Wing Leads oar 839.1 Sty Ovaleng ear 0.05.2 Toe Ovethang ©) eet 8.9.5.3 Minimum End Joint Weth (C) 2.59 8354 Minimum Side Joint Lenath D} 8.64 8355 Maximum Hee! Filet Height €) se 856 835.6 Minimum Heel Filet Height (F) 887 835.7 Solder Thickness (G} 858 8358 Copanenty wey 2.2.6 Round or Flattoned (Coinod) Gaull Wing tad nan 2.9.6.1 Sido Overhang (A) set RABI —ToaCnevharg AA? 8.9.63 Minimum End Joint Wiath (C1 8-62 83.6.4 — Minimum Side Joint Length (0) 863 8.38.5 Maximum Hee Filet Heght (E) 8-64 8.3.66 Minimum Hea! Filet Height () 865 838.7 Solder Thickness (3) 8.68 8.8.6.8 Minimum Side Joint Height (Q) 8-00 8.9.6.0 — Coplonerity i eer 7 J Leads 868 8.3.7.1 Side Overhana (A) 8.68 83.72 Toe Overhang (8... 8-70 83.73 End Joint With (C) 870 837.4 Side Joint Length (0) ou BB 83.0 Maximum Filet Height (&) 873 8.3.78 Mair Heel Fill Height © ara 887.7 Soddor THokneas (0) 076 837.8 Coplanerity 876 IPC-A-G10E-2010 April 2010Table of Contents (cont.) 8.3.8 Butt/I Connections 83.8.1 Maximum Side Overhang (A) 83.8.2 Maxim Toe Overhang @) 8.3.5.3 Minmum End Joint Wath (G) 0.0.04 Misia Sik Lui Leet ©) 8.2.8.6 Meximum Filot Hight (©) RARA Minimum Filet Height (F) 83.87 Solder Thickness (G) 8.3.9 Flat Lug Leads 8.3.10 Tall Profile Components Having Bottom Only Terminations .A.44 Inward Formed L-Shapod Ribbon Loade 8.3.12 Surface Mount Area Array 8.12.1. Alignment 83.122 Solder Ball Soacna 8.3.12.3. Solder Connections 8.12.4 Voids 83.125. UndortivStaking 83.12.6 Package on Package 2.2.12. Bottom Termination Componente (BTC) 8.3.14 Components with Bottom Thermal Plane Terminations 8.3.15 Flattened Post Connections 8.3.15.1 Maximum Termination Overhang ~ ‘Square Solder Land 8.3.15.2. Maximum Termination Qverhang — ound Solder Land 8.3.15.3 Maximum Filet Haight 8.4 Specialized SMT Terminations IPC-A-610E-2010 eq 877 8-78 878 ore O78 2.0 AN a1 aw 885 808 es7 8.07 898 8.5 Surface Mount Connectors 8.6 Jumper Wires 2.0.1 8611 0.1.2 ae10 Bata 86.1.5 om (Chip ana Gyindrcal End Cap Components Gul wg J Lead Castellations Land 9 Component Damage 9.1 Loss of Metallization ¥.2 Chip Resistor Element 2.9 Leadeu/Leaulees Devices 0.4 Coramic Chip Capacitors 9.5 Connectors 9.6 Relays 9.7. Transformer Core Damage 9.8 Connectors, Handles, Extractors, Latches 2.9 Eage connector Fins 0.40 Prose Fit Pins 9.11 Backplane Connector Pins 9.12 Heat Sink Hardware April 2010. 209 8400 Baul 8101 seu 6-105, 8 103 B14 on 92 03 o8 a0 043 13 ond wo eG a2Table of Contents (cont.) 40 Printed Cirouit Boarde and Ascomblice 10.1 Gold Surtace Contact area 10.2 Laminate Conditions 10.2.1 Meesiing and Crazing 10.2.2 _Bistering and Delamination 10.2.3 Weave TextureWeave Exposure 10.2.4 Haloing and Edge Delamination 102.5 Buns 10.2.6 Bow arc Twist 102.7 Depaneization 10.3. Conductors/Lands .. 1031 Reduetionin Grass Seconal Aa 103.2 Lited Pads/Lands 1Uis.s Mechanical Lamage 40.4 Flexible and 10.4.1 Damage 40.4.2 Delamination 40.4.3 Discoloration 10.4.4 Solder Wicking qa.d attachment 10.5 Marking .. 105.1 Etched thucng Hand Pe) 10.5.2 SoFOENEM enn 10.58 Stamped ... 10.5.8 LA9@F vanuns 105.5 Labas 105.5.1 Bar Cudiy 40.5.5.2 Neadatitty 40.6.6.2 Adhooion and Domage 4055.4 Position 10.56 Using Rarfo Fraquency Identification (RFID) Taos 10. 10.6.1 Flux Residues . 108.2 Particulate Mattor Cleanliness xi Flex Printed Circuitry . 104 we 10-4 105 10-7 10-9 10-10 10-12 10413 1014 1-16 10-16 1017 lu-ty 10-20 10-20 10-22 10-28 10-24 12 10-28 10-28 10-30 10-31 10-32 1a 10-34 10-04 10.95 10-95 10-38 1037 10-38 10-39 April 2010 10.8.3 Chlorides, Carbonatas and White Residues 10-401 40.4 Fh Residues — No-Clean Process ~ Aopearance 10-42 10.85 Surface Appearance 10-43 10.7. Solder Mask Coating 10.44 40.7.4 Wrinkling/Cracking 40.45 4072 Voids, Fister, Soratches 10-47 10.7.8 Breakdown 10-48 10.7.4 Discoloration 10-49 10.9 Conformal Coating 10.40 40.0.1 General 40-49 10.8.2 Covorago 10 50 1089. Thicknose 40-52 10.9 Envapoulation 10-00 411. Discrete Wiring 14 11.4 Solderless Wrap 112 11.4.1 Number of Tums 113 44.4.2 Tum Spacing od 1113 End Tals, Insuiation Wrap 115 11.1.4 Raised Tums Overlap ALT 41.4.5 Connection Position 118 11.1.6 Wre Dress 11-10 11.17 Wre Stack wt 11.4.8 Wee Plaliny 1112 11.4.9 Damaged Insulation 11-49 11.1.40 Damaged Conductors & Terminal 1444 11.2 Component mounting - Gonnector Wire Dress Strain/Stress Pellet hte 12 igh vonage le Appendix A Electrical Conductor Spacing al Index Index IPC-A-610E-2010| Acceptability of Electronic Assemblies. Foreword ‘The folowing topics are addressed inthis saction: 1.1 Scope 4.2 Purpose 261 4.4 Definition of Requirements 1.4.1. Acoeptanae Criteria 4.4.11 Target Condition 1.4.1.2 Acceptable Condition 4.4.1.3 Detect Condition 1.41.34 Disposition 1.4.14 FTocess inaicator Uonarton Atte Pruvess Inuicalur Mell udlugees 14.5 Combinod Consitions 1416 Conitione Not Sponifed 4.4.1.7 Soecialzed Desions 1.5 Terms & Definitions 1.5.1. Board Orientation 1.5.1.1. "Primary Side IPC-A-610E-2010 1.5.1.2 “Secondary Side 1.5.1.3 Solder Source Side 1.5.1.4 Solder Destination Side 1.9.2 “Cold Sader Gonnecton 1.6.0 Clectical Cleorance 1.5.4 High Voltage 1.5.5 Intrusive Salctor 15.6 “Leaching 1.5.7 Meniscus (Component) 1.58 *Nonfunctional Land 159 Pin-in-Paste 1.5.10 We Diameter 1.5.11 Wire Overwrap 4.6.12 Wire Overlap 4.6 Examples and illustrations 4.7 Inspection Methodology 148 verincation oF Dimensions 4.9 Magnification Aide 4.40 Lighting April 2010 141 Acceptability of Electronic Assemblies Foreword If a conflict occurs between the English and translated versions of this document, the English ver- sion will take precedence. 11 Scope This standard is a collection of visual qualty acceptabi requirements for electronic assembles. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies, Histori= cally, electronic assembly standards contained @ more com- prehensive tutorial addressing principles and techniques. For ‘a more complete understanding of this document's recom= vnndlons ad neyo, Une ay use Wiss cute conjunction with IPC LIDDK 001, IRC AY 820, and IPC. J-STD.001. ‘The citeria in this standard are not intended to define pro- ‘c0ss0s to accomplish assombly operations nor is it intended to authorize repair/modification or charge of the customer's product. For inctanco, tho presence of criteria for adhesive ponding of components does nat imply/auterizeftaquie the use of adhesive bonding. and the depiction of a lead wrapped Clockwise around a terminal does not imply/authorize/require that al eads/wires be wrapped in the clockwise direction. Users of this standard should be knowledgeable of the appi- ‘cable requirements of the document and how to apply them. ‘Objective evidence of the demonstration of this knowledge shoud be maintained. Where objective evidence is unaval- blo, the organization should consider penodtc revew ot per sonal skils to determine visual auceplance clea app opt ately. IPC-A-610 has callers outside Une scope of IPC J-STD-001 defining hendling, mechanical and other worlemanchip, requirements. Tabla 1-1 is a summary of rolated dacumonts IPC AU 020 fa a cupporting document thet provideo informe tion regarding the intent of thie specifietian santant and explains or amoities the technical rationale for transition of limits through Target to Defect condition criteria. in action supporting information is provided to give a broader under- standing of the process considerations that are related to par- formance but not commonly distinguishable through visual asses elhuds Table 1-1 Summary of Related Documente Detintion ‘Design requirements reticcing ree leves of Compenxty (loves A, 8, and O) nar cating finer goomatio, groator donation, mote preaace slope to produce tho prod. Component and Assembly Process Guidelines to assist in the design of the bare board and the assemoly where the bare board processes concentrate on land pal- tems ‘or aurlace mount anc the assembly concentrates on surface mount and through-ole principles which ere usualy incorporated into the desian process and ‘Documentation depicing Gare board specie endl product requirements Gesioned bby the ustrier oF wie lean assembly regular ens. Det ay Or ry HL ree fe inchisry speciieatios or weekemanshin steadarcs ac weil as comers pwn preferences or internal standard requirements, Foquirements for soldered electrical and electronic assembles depicting minimum fend procuct aocepiane charactensics as Wel 2s methods Tor evauation (lest rmethace), frequency of testing and applicable abity of procose control roqure Pictorial interpretive document indicating various cheracteristics of the board andor asserrbly as appropriate relaing to desrable conditions that exceed the mrimum facceptable charectritcs incicsted by the end item performance standard and reflect various out-of-control (process indicator or defect) conctions to assist the ‘shop process evaluators in judging need for corectve action Documented Waning requirements for teaching and learning process procedures and techniques fr inplenentey atplarice requis of eier 81d ier a= ars, accantehiity stancaris, er eayikemente detailed on the enetomar Aoe- Documentation providing the procedures to accomplish conformal coating andl ‘Component removal and replacement, Soder ress repar, and) modcation/tepar ‘of laminate materia, condustore, and platod Uiough holes Document Purpose spect Design Standard 20 (8 IPC 7054 IPC-CM-770 uct the documentation. End item Documentation | PO-D-325 End item Standards IPC J-STD-001 mens. Acceptability Standard | PO-A-610 Training Programs (Optional mentation. Rework and Repair Po-rri7721 1-2 April 2010 IPC-A-G10E-2010