Complete Catalog

® 

2015 

Catalog 

HOW TO ORDER 

Payment Terms 

• Credit Terms (Net 30) for established customers. 

• American Express, Mastercard and VISA accepted. 

Confirming Purchase Orders 

• Confirming purchase orders are required for all orders over $500. 

Minimum Per Order 

• USA/Canada $50 minimum. • Export $1000. 

F.O.B. Point and Shipping 

• F.O.B. ex-works TopLine USA. Please specify preferred method of shipment when placing order. 

e-mail sales@topline.tv 

www.topline.tv 

95 Highway 22 W. 

Milledgeville, GA 31061 USA 

Toll Free USA/Canada 1-800-776-9888 

Tel 1-478-451-5000 

Fax 1-478-451-3000 

© 2015. TopLine. All Rights Reserved 

This catalog, or any parts thereof, must not be reproduced in any form without written permission of TopLine. 

1 

Jan 2015 

300dpi

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Series Description View WebCode Page 

SC Ceramic Chip Capacitor XD1 7 

SD Molded Tantalum XD1 8 

SE Aluminum Capacitor XD1 9 

SR Resistor Chip XD1 10 

SRM Melf Resistor XD1 11 

Edge 

90˚ 

Edge 90˚ 

SCC Black & White Chips XD1 12 

SSL Solderable Spacers XD1 13 


SOT Transistor XD1 14 

DPAK Power Plastic Device XD1 15 

SMD Power CERAMIC Device XL1 15 

SOD Melf Diode/Rectifier XD1 16 

SMA~SMC Rectangular Diode/Rectifier XD1 17 

2

TM 

TM 

Find It Fast 


PLCC Chip Carrier XP1 18 

LCC Chip Carrier XL1 19 

SOIC Gull Wing XS1 20 

SOJ J-Lead XS1 21 

TopLine 

FP Flat Pack XF1 22 

TopLine 

MSOP Mini Small Outline Package XS1 23 

SSOP Shrink Small Outline Package XS1 24 

TSSOP Thin Shrink Outline Package XS1 25 

TSOP Type 1 XO1 26 

TSOP Type 2 XO1 27 

TQFP Thin Quad Flat Pack 1.0mm XQ1 28 

LQFP Low Quad Flat Pack 1.4mm XQ1 29 

QFP Quad Flat Pack XQ1 30-31 

CERQUAD Ceramic Quad Flat Pack XC1 32 

3

Find It Fast 

Ball Devices 


W Silicon Wafers & Die XE1 33 

TD Test (Si) Die for Practice XE1 156-157 

FC Flip Chip Xi1 34-35 

WLP - CSP 0.3mm Pitch Flip Chip 36 

WLP - CSP 0.4mm Pitch 37-38 

WLP - CSP 0.5mm Pitch 39-41 

BGA 0.65mm, 0.75mm, 0.8mm Pitch 42-43 

BGA 1.0mm Pitch 44-45 

BGA 1.27mm Pitch BGA XJ1 46-47 

CBGA Ceramic 1.27mm Pitch 48-49 

CCGA Column Grid Array 50 

BGA 1.5mm Pitch 51 

BGA Ball Count Chart 52 

eWLP Embedded CSP Cu Post QFN 53 

QFN Quad Flat Lead XU1 54-56 

M-QFN Open Cavity QFN XH1 151-155 

Throughhole Devices 


DIP Dual Inline Package XN1 57 

TO Transistor XT1 58 

Terminal Solder Terminals XR1 59 

CF & DO Resistors & Diodes CF XA1 60 

DO 

Trays 


Waffle Pack for Bare Die 2" and 4" XZ1 61 

JEDEC Matrix Component Trays XZ1 62-64 

4

Find It Fast 

5 

Solder Practice Kits 


--- General Kit Information 65-67 

901~909 Flip Chip Kit 70-71 

921 BGA46 0.75mm pitch 72-73 

963 Universal CSP 0.5/0.75/0.8mm 74-75 

981 Universal BGA 0.8/1.0mm pitch 76-77 

9981 BGA 1.0mm & 0.8mm pitch 78-79 

976 BGA256 1.0mm/SBGA560 1.27mm pitch 

80-81 

XK1 

974 LBGA1600/1936 Very Large 1.0mm Ball & Bump 

82-83 

947 Universal BGA Daisy Chain Kits 

84-85 

937 BGA 256/272 1.27mm pitch 86-87 

967 BGA169/225 88-89 

946 Universal BGA 1.27/1.5mm pitch 90-91 

958 LBGA1225 Very Large 1.27mm 92-93 

951 Ceramic CBGA 94-95 

986 Lead Free Multicomponents 96-97 

919 Large Machine Run 98-99 

928 Challenger 2 100-101 

950 SMTA SABER Array Fine Pitch Kits XK1 102-103 

935/936 Stencil Evaluation 104-105 

975 QFN Daisy Chain 136-137 

965 Rework 1 Practice 106-107 

944 Rework 2 Practice Rework Kits XK1 108-109 

977 Rework 3 Practice 110-111 

925 SMD Introductory 112-113 

926 Practical Mixed Technology 114-115 

9696 Mixed Technology 1 Mixed Technology 

116-117 

914 Mixed Technology 2 Kits 

118-119 

938 Econo Kit II 142-143 

939 Econo Kit III 144-145 

912 Econo IV Recertification 146-147 

949 0201/0402 Chip Shooter 

XK1 

120-121 

Machine 

980 01005 / 0201 Chip Shooter 68-69 

Diagnostic Kits 

964 0402/0603 Chip Shooter 122-123 

968 0805/1206 Chip Shooter 124-125 

9618 Rotational Placement 134-135 

931 Advanced QFP Assortment 126-127 

962 QFP Assortment 

Quad Flat Pack XK1 

128-129 

9625 QFP256 .4mm Pitch Kits 

130-131 

9621 QFP208 .5mm Pitch 138-139

Find It Fast 

Solder Practice Kits 


910 Beginners Throughhole 138-139 

913 12 Layer Daisy Chain Throughhole Kits XK1 148-149 

915~916 Multipurpose Throughhole 140-141 

979 NASA Solder Practice 150 

Series Description View 

NN-SOL 

CCGA Pin 

Non-Collapsible Elastomer 

Core Solder Ball 

Column Grid Array 

Solder Column 

Page 

151 

Tools & Accessories 


900000 QFP Lead Straightener XY1 160 

Open Cavity QFN Air Cavity 


M-QFN 

CAP 

Open (Air) Cavity QFN Package 

Dome Lid Cover 

Cavity 

XH1 

XH9 

151-153 

154 

LID Flat Lid Cover XH9 155 

TD Test (Si) Die for Practice Attach die XE1 156-157 

6

Ceramic Chip 

Capacitor 

RoHS 

Pb-Free 

Standard Terminal 

Dummy Component Ordering Information 

Chip Size 

Tape Info 

I nch Metric Width Pitch XM1 Qty XD1 Qty 

Standard Terminal Lead-Free 

Pb 

Sn100 

01005* 0402 4mm 1mm SC01005E-W4P1 5000 SC01005E7A-W4P1 40,000 

01005** 0402 8mm 2mm SC01005P4A-TIN 1000 SC01005P7A-TIN 20,000 

0201 0603 8mm 2mm SC0201P4A-TIN 1000 SC0201P7A-TIN 15,000 


0603 1608 8mm 4mm SC0603P4A-TIN 500 SC0603P7A-TIN 4000 



1210 3225 8mm 4mm SC1210E4A-TIN 500 SC1210E7A-TIN 3000 



*W4P1 New carrier for 01005 chips. Width 4mm. Component pitch 1mm 

**W8P2 Traditional tape width 8mm. Component pitch 2mm 

Wide Terminal Lead-Free 

Pb 

Sn100 

Wide Terminal 





Dimension Tolerance L x W 

0201 ± 0.03mm 0805 ± 0.15mm 

0402 ± 0.05mm 1206 ± 0.15mm 

0603 ± 0.1mm 1210 ± 0.30mm 

Height (H) Height (H) height (H) 

01005 0.2mm ± 0.03 0603 0.8mm ± 0.1 1210 1.25~1.5mm 

0201 0.3mm ± 0.03 0805 0.6~1.25mm 1812 2.0mm MAX 

0402 0.5mm ± 0.1 1206 0.6~1.25mm 2225 2.0mm MAX 

I 

N 

F 

O 

Other sizes such as 0504, 1805, 1806, 2220 are available on special order 

The chip size code is the component’s LxW dimensions. Example: 0805 = .08” x .05”. 

Chip size may also be expressed in metric code. Example: 2012 = 2.0mm x 1.2mm. 

Pb Lead Free Option: Sn100 add -TIN to end of part number. 

7

Tantalum Capacitor 

Molded Case 

+ 

RoHS 

Pb-Free 


chip Size tape Info 

Metric code Width pitch XM0 Qty XM1 Qty XD1 Qty 

3216 A 8mm 4mm SD3216X-100 100 SD3216E4A 250 SD3216E7A 2000 

3528 B 8mm 4mm SD3528X-100 100 SD3528E4A 250 SD3528E7A 2000 

6032 C 12mm 8mm SD6032X-50 50 SD6032E4A 100 SD6032E7A 500 

7343 D 12mm 8mm SD7343X-50 50 SD7343E4A 100 SD7343E7A 500 

1608 J 8mm 4mm - - - - SD1608E7A 4000 

2012 P/R 8mm 4mm - - SD2012E4A 250 SD2012E7A 2500 

D i m e n s i o n s 

Case Length Width Height 

A 3.2mm 1.6mm 1.6mm 

B 3.5mm 2.8mm 1.9mm 

C 6.0mm 3.2mm 2.5mm 

D 7.3mm 4.3mm 2.8mm 

J 1.6mm 0.8mm 0.8mm 

P/R 2.0mm 1.2mm 1.2mm 

I 

N 

F 

O 

Molded tantalum capacitors are available in six standard footprints. All sizes meet EIA/IECQ dimensions. 

The positive (+) terminal is oriented away from the sproket holes. 

Nomenclature: The metric code specifies the LxW dimensions in millimeters. Example 3528 = 3.5mm x 2.8mm 


8

Aluminum Capacitor 

+ 

RoHS 

Pb-Free 


Case maximum tape Info 

Diameter height Width pitch XM1 Qty XD1 Qty 

3mm 5.5mm 12mm 8mm SE3E7A 100 SE3E13A 2000 



6.3mm 5.5mm 16mm 12mm SE6E7A 100 SE6E13A 1000 


8mm 10mm 24mm 16mm SE9E7A 100 SE9E13A 500 

10mm 10mm 24mm 16mm SE10E7A 100 SE10E13A 300-500 

10mm 17mm 32mm 20mm - - SE11E13A 250-300 

12.5mm 14mm 32mm 24mm - - SE12E13A 200-250 

12.5mm 17mm 32mm 24mm - - SE13E13A 150-200 

16mm 17mm 44mm 28mm - - SE16E13A 125-150 

16mm 22mm 44mm 28mm - - SE17E13A 75-100 

18mm 17mm 44mm 32mm - - SE18E13A 125-150 

18mm 22mm 44mm 32mm - - SE19E13A 75-100 

20mm 17mm 44mm 36mm - - SE20E13A 50 

I 

N 

F 

O 

Aluminum electrolytic capacitors are available in 16 case sizes. Aluminum capacitors are polarized devices and 

require proper orientation during placement. The negative terminal (black mark on top of component) faces the 

sprocket holes on the carrier tape. For 15” (380mm) reel change “E13A” to “E15P” 

Pb Lead Free Option: Sn97/Bi3.0 add -SnBi to end of part number for 3mm ~ 10mm case diameter. 

9

Resistor Chip 

RoHS 

Pb-Free 

Standard Terminal 

Wide Terminal 

Embedded Terminal 


Chip Size 

Tape Info 

I nch Metric Width Pitch XM1 Qty XD1 Qty 

Standard Terminal Lead Free 

01005 0402 8mm 2mm eSR01005P4A-ZERO-Cu 1000 eSR01005P7A-ZERO-Cu 20,000 



Dimension Tolerance 

Height (H) 

01005 0.12mm ± 0.02 0603 0.45mm ± 0.10 1210 0.55mm ± 0.15 

0402 ± 0.05mm 

0201 0.23mm ± 0.03 0805 0.55mm ± 0.1 2010 0.55mm +/-0.15 

0603 ~ 2512 ± 0.15mm 

0402 0.35mm ± 0.05 1206 0.55mm ± 0.1 2512 0.55mm +/-0.15 

I 

N 

F 

O 

Pb 

Sn100 

01005 0402 4mm 1mm SR01005E4A-W4P1 1000 SR01005E7A-W4P1 40,000 

01005 0402 8mm 2mm SR01005P4A-TIN 1000 SR01005P7A-TIN 20,000 







1812 4532 12mm 4mm SR1812E4A-TIN 500 SR1812E7A-TIN 4,000 



Wide Terminal - Zero Ohm Lead Free Pb 

Sn100 

0306 0816 8mm 4mm SR0306P4A-ZERO-T 1000 SR0306P7A-ZERO-T 5000 



0815 2037 12mm 4mm SR0815E4A-ZERO-T 1000 SR0815E7A-ZERO-T 5000 






Embedded Resistor - Zero Ohm - Copper Terminal (150um Height) 

Resistor chips are available in seven standard sizes. Bulk Feeder cassettes are for placement by high-speed 

chip shooters. Zero ohm jumpers available for continuity checking. 

The chip size code approximates the LxW dimensions in inches. Example: 0805 = .08” x .05”. 


10

MELF Resistor 

RoHS 

Pb-Free 


Size Code Size tape Info 

Inch name Length x Dia. Width pitch XM1 Qty XD1 Qty 

Lead Free 

Pb 

Sn100 Plastic Tape 

0604 1.6 x 1.0mm 8mm 4mm SRM0604E4A-TIN 500 SRM0604E7A- TIN 3000 

0805 Micro 2.2 x 1.1 mm 8mm 4mm SRM0805E4A-TIN 500 SRM0805E7A- TIN 3000 

1206 Mini 3.2 x 1.6mm 8mm 4mm SRM1206E4A-TIN 500 SRM1206E7A- TIN 3000 

1406 Mini 3.5 x 1.4mm 8mm 4mm SRM1406E4A-TIN 500 SRM1406E7A- TIN 3000 

2308 MELF 5.9 x 2.2mm 12mm 4mm SRM2308E4A-TIN 250 SRM2308E7A- TIN 1.5~2K 

3512 Maxi 8.5 x 3.0mm 16mm 8mm SRM3512E7A-TIN 500 SRM3512E13A-TIN 2500 

4213 Maxi 10.5 x 4.0mm 16mm 8mm SRM4213E7A- TIN 500 SRM4213E13A- TIN 2000 

Zero OHM 

0805 Micro 2.2 x 1.1mm 8mm 4mm SRM0805E4A-ZERO 500 SRM0805E7A-ZERO 3000 

1206 Mini 3.2 x 1.6mm 8mm 4mm SRM1206E4A-ZERO 500 SRM1206E7A-ZERO 3000 

2308 MELF 5.9 x 2.2mm 12mm 4mm SRM2308E4A-ZERO 250 SRM2308E7A-ZERO 1.5~2K 

3512 Maxi 8.5 x 3.0mm 16mm 8mm SRM3512E7A-ZERO 500 SRM3512E13A-ZERO 2500 

4213 Maxi 10.5 x 4.0mm 16mm 8mm SRM4213E7A-ZERO 500 SRM4213E13A-ZERO 2000 

Cross Reference 

Code TopLine 

0102 SRM0805 

0204 SRM1206 

0207 SRM2308 

201 SRM3513 

301 SRM4213 

I 

N 

F 

O 

MELF resistors are cylindrical. Extra care is required during placement to prevent rolling during assembly. These 

devices are often called by their nicknames relative to size such as micro-melf, mini-melf and melf. Nomenclature: 

MELF = Metal Electrode Face Bonded. Lead Free version is tin over nickel plating. 


11

RoHS 

Pb-Free 

Black & White 

Ceramic Chips 

For Calibration 

Edge 90˚ 

White 

W 

L 

H 

Edge 90˚ 

Edge 

90˚ 

Black 

White 

W 

H 

L 

W 

L 

H 

Edge 

90˚ 

Black 


chip Size tape taping Info 

Inch metric Mat’l Width pitch XD1 Qty 

White Chips 

0201 0603 Paper 8mm 2mm SCC0201P7A-WHITE 15,000 



0805 2012 Plastic 8mm 4mm SCC0805P7A-WHITE 4,000 


Black Chips 

0201 0603 Paper 8mm 2mm SCC0201P7A-BLACK 15,000 



0805 2012 Plastic 8mm 4mm SCC0805E7A-BLACK 4,000 


Inch Dimensions: 

Inch Code L W H Tol 

0201 0.0225 0.0115 0.0115 +/- 0.001 

0402 0.036 0.019 0.019 +/- 0.003 

0603 0.058 0.031 0.029 +/- 0.003 

0805 0.075 0.052 0.037 +/- 0.003 

1205 0.119 0.060 0.048 +/- 0.003 

Metric Dimensions: 

Metric Code L W H Tol 

0603 0.57 0.29 0.29 +/- 0.025 

1005 0.91 0.48 0.48 +/- 0.076 

1608 1.47 0.79 0.74 +/- 0.076 

2012 1.91 1.32 0.94 +/- 0.076 

3216 3.02 1.52 1.22 +/- 0.076 

I 

N 

F 

O 

Placement Ceramic Chips are available in 6 case sizes and in 2 colors: White and Black. 

Right angle 90˚ edges for accurate placement by vision equipment. No terminations. Non-Solderable. 

White chips are mounted on a dark substrate such as blue Nitto tape. 

Black chips are mounted on a light substrate. Excellent contrast. Easy for vision equipment to see. 

12

Solderable Spacers 

standoff insulator 

Bottom Terminal 

SSL 

Series 

RoHS 

Pb-Free 


l w body height (H) 

Metric metric Mat’l Inch metric XD1 Qty 

+/- 10% 

0.050 1.3mm SSL120650E7A-T 1000 

0.060 1.6mm SSL120660E7A-T 1000 

3.2mm 1.6mm FR4 0.075 1.9mm SSL120675E7A-T 1000 

0.080 2.0mm SSL120680E7A-T 1000 

0.095 2.4mm SSL120695E7A-T 1000 

0.120 3.2mm SSL1206120E13A-T 1000 

SOD123FW 

SMAF 

SMBF 

SMCF 

L W Mat’l H - Inch h - mm Part Number Qty 

3.5 ~3.9mm 1.5 ~ 1.9mm 0.050 - 0.067 1.3~1.7mm SOD123FW-E7A-T-ISO 2500 

4.5 ~ 4.9mm 2.3 ~ 2.7mm 0.060~0.070 1.5~1.8mm 

SMAF-E7A-T-ISO 2000 

Molded SMAF-E13A-T-ISO 7500 

5.0 ~ 5.4mm 3.2 ~ 3.6mm Plastic 0.067~0.075 1.7~1.9mm SMBF-E13A-T-ISO 4000 

6.3 ~ 6.9mm 4.2 ~ 4.8mm 0.075~0.10 1.9~2.5mm SMCF-E13A-T-ISO 3000 

I 

N 

F 

O 

SSL solderable spacers are constructed with high grade RoHS FR4. Bottom tin (Sn) plated copper (Cu) terminals 

provide compact footprint. Custom sizes available. 

SOD, SMA, SMB and SMC (ISO suffix) solderable spacers are fully isolated open circuit - no internal connections . 

Constructed with wide tin (Sn) copper (Cu) terminals to provide strong attachment to PCB. Optional (DC12 suffix ) 

fully shorted zero ohm jumpers are available. 

13

TopLine 

TopLine 

TopLine 

TopLine 

TM 

SOT Transistor 

RoHS 

Pb-Free 

TopLine 

TopLine 

RoHS 

SOT723 SOT 323 SOT 353 SOT 363 

Pb-Free 

Ultra mini 

mini 

SOT 23 SOT 143 SOT 25 SOT 26 

Standard 

SOT 89 SOT 223 

High Power 


body Size 

Nbr tape Info Device Reference Nominal (mm) 

Leads Width pitch SOT SC TO A B S H XM1 Qty XD1 Qty 

3 8mm 4mm SOT723 - - 1.2 0.8 1.2 0.5 - - SOT723E7A 8000 

3 8mm 4mm SOT346 SC59 TO236AA 2.9 1.6 2.8 1.1 - - SC59E7A 3000 

3 8mm 4mm SOT323 SC70 - 2.0 1.25 2.1 0.9 - - SC70E7A 3000 

3 8mm 4mm SOT416 SC75A/SC90 - 1.6 0.8 1.6 0.7 - - SC90E7A 3000 

3 8mm 4mm SOT523F - - 1.6 0.8 1.6 0.7 - - SOT523E7A 3000 

3 8mm 4mm SOT23 - TO236AB 2.9 1.3 2.4 .95 SOT23E4A 500 SOT23E7A 3000 

5 8mm 4mm SOT23-5 SC74A - 2.9 1.6 2.8 1.1 SOT25E4A 500 SOT25E7A 3000 

6 8mm 4mm SOT23-6 SC74 SOT457 2.9 1.6 2.8 1.1 SOT26E4A 500 SOT26E7A 3000 

3 12mm 8mm SOT89 SC62 TO243AA 4.5 2.5 4.0 1.5 SOT89E4A 200 SOT89E7A 1000 

4 8mm 4mm SOT143 - TO253AA 2.9 1.6 2.8 .95 SOT143E4A 500 SOT143E7A 3000 

3 16mm 8mm SOT223 SC73 TO261AA 6.5 3.6 7.0 1.6 SOT223E4A 100 SOT223E13A 2500 

3 8mm 4mm SOT323 SC70 - 2.0 1.25 2.1 0.9 SOT323E4A 500 SOT323E7A 3000 

4 8mm 4mm SOT343 SC82A - 2.0 1.25 2.1 0.9 - - SOT343E7A 3000 

5 8mm 4mm SOT353 SC88A - 2.0 1.25 2.1 0.9 SOT353E4A 500 SOT353E7A 3000 

6 8mm 4mm SOT363 SC88 - 2.0 1.25 2.1 0.9 SOT363E4A 500 SOT363E7A 3000 

8 8mm 4mm SOT23-8 - - 2.9 1.6 2.9 1.2 - - SOT28E7A 3000 

Daisy Chain - TopView 

Top View 

Side View 

I 

N 

F 

O 

TopLine offers a full range of SOT devices conforming to JEDEC (TO) and EIAJ (SC) standards. 3-lead devices are 

commonly used for diodes or transistors. 5- and 6-lead devices are used for integrated circuits or diode arrays. 

Nomenclature: SOT = Small Outline Transistor. AEC-Q100 are MIL-S-883 standards available. 


14

TM 

® 

DPAK Power Device (Plastic) 

RoHS 

Pb-Free 

DPAK 

D2PAK 


7" (180mm) 

pacakge Size 

nominal (mm) JEDec tape Info 

l w h S SMD Device Width pitch XM1 Qty XD1 Qty 

6 6.5 2.3 10 TO-252AA 16mm 8mm DPAK-E7A 100 DPAK-E13A 2500 

9.2 10 4.4 15 TO-263AB 24mm 16mm D2PAK-E7A 100 D2PAK-E13A 500~800 

9.2 10 4.4 15 5-LEAD 24mm 16mm - D2PAK-5-E13A 500~800 

Top View 

2 

Daisy Chain Options 

2 

2 

3 

W 

L 

S 

Side View 

H 

1 

2 

3 

DC12 

DPAK 

D2PAK 

1 

3 

DC123 

DPAK 

D2PAK 

1 

3 

DC13 

DPAK 

D2PAK 

1 2 3 4 5 

DC1245 

D2PAK5 

I 

N 

F 

O 

DPAKs are large packages used for power devices such as rectifiers and transistors. The D 2 PAK is the Surface Mount 

equivalent of the TO-220. 

Pb 

Lead Free Option: Sn100 add -TIN to end of part number. 

SMD Power Device (CERAMIC) 


pacakge Size O open Cavity Dummy with Lid Daisy Chain Package 

nominal (mm) JEDec without Lid Attached Lid Attached 

l w h SMD Device XL1 XL1 Qty XL1 Qty 

I 

10.16 

N 

F15.88 O17.52 7.52 

11.43 

13.34 

2.8 

3.3 

3.3 

TO-276AA 

TO-276AB 

TO-276AC 

SMD.5-N 

SMD1-N 

SMD2-N 

SMD.5 

SMD1 

SMD2 

1 

1 

1 

SMD.5-DC123 

SMD1-DC123 

SMD2-DC123 

1 

1 

1 

15

MELF & mini MELF 

Diodes 

RoHS 

Pb-Free 


Size tape Info 

Device Dia. x L Width pitch XM1 Qty XD1 Qty XD1 Qty 

mini MELF 

DO-213AA 1.6 x 3.5mm 8mm 4mm SOD80E4A 500 SOD80E7A 2500 SOD80E13A 10,000 

(LL34) 

MELF 

DO-213AB 2.5 x 5mm 12mm 4mm SM1E4A-GLASS 250 SM1E7A-GLASS 1500 SM1E13A-GLASS 5000 

(LL35/LL41) 

MELF 

DO-213AB 2.5 x 5mm 12mm 4mm SM1E4A-PLASTIC 250 SM1E7A-PLASTIC 1750 SM1E13A-PLASTIC 5000 

(SM1) 

Daisy Chain 

(Optional) 

DC12 

I 

N 

F 

O 

MELF and Mini Melf diodes are cylindrical cases constructed of glass or plastic. The SOD80 glass package is 

commonly used lower power diodes. The SM1 package is used for high current rectifiers and zener diodes. 

Nomenclature: DO = Diode Outline 

Pb Lead Free Option: Sn100 add -TIN to end of part number. For Daisy Chain, add -DC12 to end of part number. 

16

Rectangular Diode 

Flat-Wide 

J-Lead 

leads 

RoHS 

Pb-Free 

Flat-Narrow 

leads 

Gull-Wing 

Lead 


Package Size 

Nominal (mm) JEDEC Tape Width 

L W H S B Device Width Pitch XD1 Qty XD1 Qty 

Flat-Narrow Leads 

0.8 0.6 0.4 1.0 0.2 SOD923 8mm 2mm SOD923E7A 8000 - - 

1.0 0.6 0.5 1.4 0.3 SOD723 8mm 2mm SOD723E7A 8000 - - 

1.2 0.8 0.6 1.6 0.3 SOD523 8mm 4mm SC79E7A 3000 - - 

1.2 0.8 0.6 1.6 0.3 SOD523 8mm 4mm SOD523E7A 3000 - - 

Flat-Wide Leads 

3.2 1.6 1.5 3.6 1.6 DO219AA 8mm 4mm SOD 123FW-E7A 2500 - - 

4.0 2.5 1.6 4.7 2.5 SOD128 12mm 4mm SMAF-E7A 2000 SMAF-E13A 7500 

4.5 3.5 1.8 5.2 3.5 - 12mm 8mm - - SMBF-E13A 4000 

6.0 4.5 2.3 6.7 4.5 - 12mm 8mm - - SMCF-E13A 3000 

Gull Wing Leads 

1.7 1.25 0.7 2.5 0.3 SOD323 8mm 4mm SOD323E7A 3000 - 10,000 

2.7 1.5 1.3 3.6 0.7 SOD123 8mm 4mm SOD123E7A 3000 - - 

4.3 2.6 2.2 6.1 1.4 DO215AC 12mm 4mm SMAG-E7A 1800 SMAG-E13A - 

4.3 3.6 2.3 6.2 2.0 DO215AA 12mm 8mm SMBG-E7A 1000 SMBG-E13A 2500 

7.0 6.0 2.3 10 3.0 DO215AB 16mm 8mm SMCG-E7A 900 SMCG-E13A 2500 

J-Lead 

4.3 2.6 2.2 5.0 1.5 DO214AC 12mm 4mm SMAJ-E7A 1800 SMAJ-E13A 5000 - 7500 

4.3 3.6 2.3 5.4 2.0 DO214AA 12mm 8mm SMBJ-E7A 750 SMBJ-E13A 3000 - 3200 

7.0 6.0 2.3 8.0 3.0 DO214AB 16mm 8mm SMCJ-E7A 850 SMCJ-E13A 3000 - 3500 

W 

L 

W 

L 

H 

TopLine 

S 

H 

TopLine 

S 

B 

B 

J-LEAD 

Side View 

Gull Wing Lead 

Side View 

I 

N 

F 

O 

Daisy Chain, add -DC12 to end of part number. 

Rectangular diodes Gull-wing, J-LEAD or Flat Leads (Narrow and wide versions) 

Pb 

Lead Free Option add -TIN to end of part number. 

17

PLCC 

Plastic Leaded 

Chip Carrier 

TM 

J-Lead 50mil pitch 

RoHS 

Pb-Free 


19 

20 

1 

3 

Nbr Body Size tape Info 

Leads Inches Width pitch XP1 Qty XM1 Qty XP1 Qty 

*18 .29” x .43” 24mm 12mm PLCC18SM 36 - - - - 

18 .29” x .49” 24mm 12mm PLCC18M 36 PLCC18E7A 100 PLCC18E13A 1000 

20 .35” sq. 16mm 12mm PLCC20M 46~50 PLCC20E7A 100 PLCC20E13A 1000 

28 .45” sq. 24mm 16mm PLCC28M 37~40 PLCC28E7A 100 PLCC28E13A 500-1000 

32 .45” X .55” 24mm 16mm PLCC32M 30~34 PLCC32E7A 100 PLCC32E13A 500-750 

44 .65” sq. 32mm 24mm PLCC44M 25~28 PLCC44E7A 100 PLCC44E13A 400-500 



84 1.15” sq. 44mm 36mm PLCC84M 14~17 PLCC84E7A 50 PLCC84E13A 250 

*PLCC18S short version is an obsolete design. 

60 

44 

PART NUMBER 

43 

39 29 

Options Suffix 

40 

28 

Standard Blank 

18 14 

PLCC20 

Daisy Chain 

13 

9 

44 

1 

PLCC44 

Daisy Chain 

68 

1 

PLCC68 

Daisy Chain 

74 

Daisy Chain 

Isolated 

Lead Free 

-DE 

-ISO 

-TIN (Sn100) 

54 

4 

8 

6 

7 

17 

18 

9 

27 

75 

53 

10 

26 

46 34 

25 19 

29 21 

47 

33 

26 

18 30 

20 

84 

1 

PLCC84 

Daisy Chain 

28 

1 

PLCC28 

Daisy Chain 

1 

PLCC32 

Daisy Chain 

52 

1 

PLCC52 

Daisy Chain 

4 

12 

4 

14 

5 11 

5 13 

7 

21 

11 

33 

I 

N 

F 

O 

Standard plating on leads is Sn85/Pb15. Lead pitch is 50 mils (1.27mm). Tube and reel quantities may vary. 

For completely isolated (no internal connections) add - ISO to the end of part number. 

Pb 

Lead Free. Add suffix to part number: -Tin = Sn100 

18 

8 

20 

12 

32

LCC 

Leadless Chip Carrier 

TopLine 

RoHS 

Pb-Free 


L lead Pitch C case Sizes 

Nbr Leads Inch metric Inch metric XL1 

3 75 mils 1.90mm .12 x 10 3.05 x 2.54 LCC3R.12x10 

4 50 mils 1.27mm .22 x .15 5.6 x 3.8 LCC4R.15x.22 

6 50 mils 1.27mm .25 x 17 6.22 x 4.32 LCC6R.17x.25 

20 50 mils 1.27mm .35” SQ 8.89mm LCC20B50SQ.35 


32 50 mils 1.27mm .45” x .55” 11.3 x 14mm LCC32B50R.45x.55 




84 50 mils 1.27mm 1.15” SQ 29.2mm LCC84B50SQ1.15 

Optional Daisy Chain 

19 

20 

1 

3 

26 

18 14 

4 

LCC20 

Daisy 

Chain 

Option 

8 

25 19 

13 

9 

18 

40 

44 

1 

6 

39 29 

7 

LCC44 

Daisy Chain 

Option 

3 

17 

28 

18 

6 

60 

61 

68 

1 

9 

10 

LCC68 

Daisy Chain 

Option 

5 

44 

43 

27 

26 

75 

84 

1 

74 

LCC84 

Daisy Chain 

Option 

54 

53 

28 

1 

LCC28 

Daisy Chain 

Option 

1 

2 

4 

3 

11 

12 

32 

33 

4 

30 

1 

I 

N 

F4 

O 

5 11 

LCC32 

Daisy Chain 

Option 

12 

29 21 

5 13 

20 

14 

2 

LCC3 

47 

52 

1 

7 

46 34 

8 

1 

LCC52 

Daisy Chain 

Option 

20 

33 

21 

LCC6 

Part Number 

Options 

part Nbr Suffix 

With Lid 

Blank 

Without Lid -N 

Gold Leads 

Blank 

Solder Coat Leads 

-SC 

Completely Isolated 

-ISO 

Daisy Chain 

-DE 

19

TM 

SO - Small Outline 

Gull Wing 

50 mil Pitch (1.27mm) 

RoHS 

Pb-Free 


I 

N 

F 

O 

Nbr body Width tape Info 

Leads Mils metric Width pitch XS1 Qty XM1 Qty XS1 Qty 

8 150 3.9mm 12mm 8mm SO8M 96~100 SO8E7A 100 SO8E13A 2500 

8 210 5.3mm 16mm 12mm SOP8M 100 - - SOP8E13A 2000 


14 208 5.3mm 16mm 12mm SOP14M 46~58 - - SOP14E13A 2000 

14 220 5.6mm 24mm 12mm SOM14M 46~58 - - SOM14E13A 2000 


16 208 5.3mm 16mm 12mm SOP16M 42 - - SOP16E13A 2000 

16 220 5.6mm 24mm 12mm SOM16M 42 SOM16E7A 100 SOM16E13A 2000 

16 300 7.5mm 16mm 12mm SOL16M 47 SOL16E7A 100 SOL16E13A 1000 

18 300 7.5mm 24mm 12mm SOL18M 41~42 - - SOL18E13A 1000 

20 300 7.5mm 24mm 12mm SOL20M 38 SOL20E7A 100 SOL20E13A 1000 

24 300 7.5mm 24mm 12mm SOL24M 31~33 SOL24E7A 100 SOL24E13A 1000 

28 300 7.5mm 24mm 12mm SOL28M 26~27 SOL28E7A 100 SOL28E13A 1000 

28 330 8.4mm 24mm 16mm SOW28M 26~27 - - SOW28E13A 1000 

32 300 7.5mm 32mm 16mm SOL32M 22~25 - - SOL32E13A 1000 

44 525 13.3mm 44mm 24mm SOZ44M 17 - - SOZ44E13A 500 

QUICK GUIDE BODY WIDTH 

series mils mm series mils mm 

SO 150 3.9 SOW 330~350 8.4~8.9 

SOP 208 5.3 SOX 400 10.16 

SOM 220 5.6 SOY 450 11.4 

SOL 300 7.5 SOZ 525 13.3 

TopLine supplies gull-wing packages with 50mil (1.27) lead pitch in a variety of pin counts and body widths. 

Standard plating on leads is Sn85/Pb15. For completely isolated (no internal connections) add -ISO to end of part number. 

Lead Free. Add suffix to part number: -Tin = Sn100 

Pb 

20 

N 15 14 13 12 11 10 9 

1 2 3 4 5 

6 7 8 

PART NUMBER 



Daisy Chain -DE 

Isolated -ISO 

Lead Free -TIN (Sn100)

SOJ - Small Outline 

J-Lead 

TopLine 

RoHS 

Pb-Free 

50 mil Pitch (1.27mm) 

SOLJ20 

TopLine 

SOLJ20/26 


13” 4” (100mm) (330mm) 

Nbr body Width Tape Info 

Leads Mils metric Width pitch XS1 Qty XM1 Qty XS1 Qty 

20 300 7.5mm 24mm 12mm SOLJ20M 33~37 - - SOLJ20E13A 1000 

24 300 7.5mm 24mm 12mm SOLJ24M 31 - - SOLJ24E13A 1000 

20/26 300 7.5mm 24mm 12mm SOLJ20/26M 27 SOLJ20/26E7A 100 SOLJ20/26E13A 1000 

24/26 300 7.5mm 24mm 12mm SOLJ24/26M 25~30 - - SOLJ24/26E13A 1000 

28 300 7.5mm 24mm 12mm SOLJ28M 25~27 SOLJ28E7A 100 SOLJ28E13A 1000 

28 400 10.0mm 24/32mm 16mm SOXJ28M 25~26 - - SOXJ28E13A 1000 

32 300 7.5mm 32mm 16mm SOLJ32M 22~23 - - SOLJ32E13A 1000 

32 400 10.0mm 32mm 16mm SOXJ32M 22~23 - - SOXJ32E13A 500~1000 



44 400 10.0mm 44mm 16mm SOXJ44M 17 - - SOXJ44E13A 500~1000 

N 15 14 13 12 11 10 9 

PART NUMBER 




Isolated -ISO 

Lead Free -TIN (Sn100) 

1 2 3 4 5 

6 7 8 

I 

N 

F 

O 

TopLine supplies a variety of SOJ packages with 50 mil (1.27mm) lead pitch. The DRAM package uses 20 leads 

on. Tube quantities may vary. For completely isolated (no internal connections) add -ISO to end of part number. 

Solder plating on leads is Sn85/Pb15. 


21

Flat Pack 

RoHS 

Pb-Free 


Nbr Leads Case Size Lead Shape Lead Braze XF1 Part Number 

50 mil Pitch 

25 mil Pitch 

8 .25” SQ FLAT Bottom FP8F50SQ.25B 

10 .25” SQ FLAT Bottom FP10C50SQ.25B 

10 .25” SQ FLAT Side FP10F50SQ.25S 

14 .26” x .34” FLAT Side FP14C50R.26x.34S 

14 .26” x .34” GULL Side FP14G50SQ.26S-3.2 

16 .25” x .38” GULL Side FP16G50R.25X.38S-S 


20 .27” x .50” FLAT Side FP20F50R.27X.50S 


24 .40” x .50” FLAT Bottom FP24F50R.40X.50B 


28 .40” x .72” FLAT Side FP28F50R.40x.72S 

28 .50” x .72” FLAT Side FP28F50R.50x.72S 



42 .64” x 1.06” FLAT Top FP42F50R.64x1.06T 

48 .64” x 1.31” FLAT Top FP48F50R.64x1.21T 

52 .64”x1.31” FLAT Top FP52F50R.64x1.31T 

48 .40”x76” FLAT Bottom FP48F25R.40x.72B 

56 .40”x76” FLAT Bottom FP56F25R.40x.72B 

Lead Locations 

Side/Sandwich bottom Brazed top Brazed 

code S code b code T 

Part Number 

I 

N 

F 

O 

Packaging Code Lead Plating Part Nbr Suffix 

Carrier C Gold Blank 

Lead Frame F Solder Coat -SC 

Daisy Chain 

-DE 


ALLOY 42 -A 

22

MSOP 

Gull Wing 

1.0mm 

Miniature Small 

Outline Package 

RoHS 

Pb-Free 


7" (180mm) 

Nbr body Width tape Info Lead Pitch 

Leads Mils metric Width pitch mils mm XS1 Qty XS1 Qty 

8 118 3mm 12mm 8mm 25.6mils 0.65mm MSOP8M 50~98 MSOP8E7A 3000 

10 118 3mm 12mm 8mm 19.7mils 0.50mm MSOP10M 50~98 MSOP10E7A 3000 

Daisy Chain available 

add -DE to end of part number 

8 7 

6 5 

10 9 

8 7 

6 

Daisy Chain 

Option 

1 2 

3 4 

Daisy Chain 

Option 

1 2 

3 4 

5 

PART NUMBER 




Isolated -ISO 


I 

N 

F 

O 

Solder plated leadsSn85/Pb15. For Daisy Chain add -DE to end of part number 

For completely isolated (no internal connections) add -ISO to end of part number. 

Pb Lead Free. Suffix -Tin = Sn100 

23

SSOP 

Shrink Small 

Outline Packages 

RoHS 

Pb-Free 


Body nbr Lead tape Info 

Width Leads pitch Width pitch XS1 Qty XS1 Qty 

16 0.636mm 12mm 8mm QSOP16M25 99 QSOP16E13A25 1000 

20 0.636mm 16mm 8/12mm QSOP20M25 55 QSOP20E13A25 1000 

24 0.636mm 16mm 8/12mm QSOP24M25 55 QSOP24E13A25 1000 

150mil (3.9mm) 28 0.636mm 16mm 8/12mm QSOP28M25 48 QSOP28E13A25 1000 

40 0.5mm 16mm 8mm QVSOP40M19.7 48 QVSOP40E13A19.7 1000 



208 mil (5.3mm) 

8 12mm 8mm SSOP8M25 160 SSOP8E13A25 2500 

14 12/16mm 12mm SSOP14M25 77 SSOP14E13A25 1000 


20 .65mm 16mm 12mm SSOP20M25 66 SSOP20E13A25 1000 

24 16mm 12mm SSOP24M25 59 SSOP24E13A25 1000 


36 0.8mm 24mm 12/16mm SSOP36M30 31 SSOP36E13A30 1000 

300 mil (7.5mm) 48 0.636mm 32mm 12/16mm SSOP48M25 30 SSOP48E13A25 1000 

56 0.636mm 32mm 12/16mm SSOP56M25 26 SSOP56E13A25 1000 

20 1.27mm 44mm 24mm HSOP20M 30 HSOP20E13A 500 

433mil (11mm) 24 1.0mm 44mm 24mm HSOP24M40 30 HSOP24E13A40 500 

Exposed 30 0.8mm 44mm 24mm HSOP30M30 30 HSOP30E13A30 500 

Heat Sink 36 0.65mm 44mm 24mm HSOP36M25 30 HSOP36E13A25 500 

44 0.65mm 44mm 24mm HSOP44M25 30 HSOP44E13A25 500 

I 

N 

F 

O 

SSOP - Shrink Small Outline Packages in 0.65mm (25.7 mil) and 0.80mm (31.5 mil) lead pitch. 

Package height is 1.63mm for 150 mil wide body, 1.75mm for 208 mil wide body and 2.3mm high for 300 mil wide 

body. The QSOP package is a true 25.0 mil lead pitch (0.636mm). Standard plated leadsSn85/Pb15. 

Pb Lead Free Option. F = NiPd. Suffix -TIN = Sn100. 

24

TSSOP 

Thin Shrink 

Small Outline Package 

RoHS 

Pb-Free 


Body nbr Lead tape Info 

Length Leads pitch Width pitch XS1 Qty XS1 Qty 

173 mil (4.4mm) Wide 

3.0mm 8 0.65mm 12/16mm 8mm TSSOP8M25 100 TSSOP8E13A25 1000-3000 

5.0mm 14 0.65mm 12/16mm 8mm TSSOP14M25 96 TSSOP14E13A25 1000-3000 

5.0mm 16 0.65mm 12/16mm 8mm TSSOP16M25 90-96 TSSOP16E13A25 1000-3000 

6.5mm 20 0.65mm 16mm 8/12mm TSSOP20M25 74-76 TSSOP20E13A25 1000-3000 

7.8mm 24 0.65mm 16mm 8/12mm TSSOP24M25 62-63 TSSOP24E13A25 1000-3000 

9.7mm 28 0.65mm 16mm 8/12mm TSSOP28M25 50 TSSOP28E13A25 1000-3000 

7.8mm 30 0.5mm 16mm 8/12mm TSSOP30M19.7 62 TSSOP30E13A19.7 1000-3000 

9.7mm 38 0.5mm 16mm 8/12mm TSSOP38M19.7 49-50 TSSOP38E13A19.7 1000-3000 

11.3mm 44 0.5mm 24mm 12mm TSSOP44M19.7 42 TSSOP44E13A19.7 1000-3000 

9.7mm 48 0.4mm 16mm 8/12mm TSSOP48M15.7 50 TSSOP48E13A15.7 1000-3000 


240 mil (6.1mm) Wide 

11.0mm 32 0.65mm 24mm 12mm TSSOP32M25 44 TSSOP32E13A25 1000-3000 

12.5mm 38 0.65mm 24mm 12mm TSSOP38M25 39 TSSOP38E13A25 1000-3000 




N 15 14 13 12 11 10 9 

PART NUMBER 




Isolated -ISO 


1 2 3 4 5 

6 7 8 

I 

N 

F 

O 

TopLine supplies TSSOP - Thin Shrink Small Outline Packages in 1.0mm height. Tape width and pitch may vary. Tube 

quantities may vary. Call TopLine for details. Standard plated leads Sn85/Pb15. 

Pb 

Lead Free. Suffix -TIN = Sn100. 

25

TSOP - Type 1 

Thin Small 


RoHS 

Pb-Free 


lead case Size tape Info 

Nbr pitch Includes Leads Width Pitch XO1 Qty XO1 Qty 

28 0.55mm 8 x 13.4mm 24mm 12mm TSOP28ST21.6-T1 234 TSOP28SE13A21.6-T1 1000 

32 0.5mm 8 x 20mm 32mm 12/16mm TSOP32T19.7-T1 156 TSOP32E13A19.7-T1 1000 

32 0.5mm 8 x 13.4mm 24mm 12mm TSOP32ST19.7-T1 234 TSOP32SE13A19.7-T1 1000 

40 0.5mm 10 x 14mm 24mm 16mm TSOP40ST19.7-T1 160 TSOP40SE13A19.7-T1 1000 

40 0.5mm 10 x 20mm 32mm 16mm TSOP40T19.7-T1 120 TSOP40E13A19.7-T1 1000 



1 

2 

3 

4 

5 

6 

Daisy Chain 

Option 

N 

11 

10 

9 

8 

7 

PART NUMBER 




Isolated -ISO 

Alloy42 A 

Lead Free -T (Sn100) 

I 

N 

F 

O 

TopLine offers TSOP-Type 1 packages in lead counts from 28 to 56. Package thickness is 1.0mm with maximum 

seated height of 1.2mm. Type 1 indicates leads extending from narrow end of body. For Daisy Chain available 

on special order, add -DE to end of part number. For completely isolated (no internal connections) add -ISO to 

end of part number. TSOP contain internal die. Tin Lead (SnPb) special order. 

Pb Lead Free. Suffix -TIN = Sn100. 

26

TSOP - Type 2 

Thin Small 


RoHS 

Pb-Free 


lead case Size T ape Info 

Nbr pitch Excludes Leads Width pitch XO1 Qty XO1 Qty 

32 1.27mm 10 x 21.0mm 32mm 16mm TSOP32T50-T2 117 TSOP32E13A50-T2 500~1000 

40/44 0.8mm 10 x 18.4mm 32mm 16mm TSOP40/44T30-T2 135 TSOP40/44E13A30-T2 500~1000 


44/50 0.8mm 10 x 21mm 32mm 16mm TSOP44/50T30-T2 117 TSOP44/50E13A30-T2 500~1000 

50 0.8mm 10 x 21mm 32mm 16mm TSOP50T30-T2 117 TSOP50E13A30-T2 500~1000 


66 0.65mm 10 x 22.2mm 32mm 16mm TSOP66T25-T2 108 TSOP66E13A25-T2 500-1000 

86 0.5mm 10 x 22.2mm 32mm 16mm TSOP86T19.7-T2 108 TSOP86E13A19.7-T2 500-1000 

N 15 14 13 12 11 10 9 

PART NUMBER 




Isolated -ISO 

Alloy42 A42 


1 2 3 4 5 

6 7 8 

I 

N 

F 

O 

TSOP Type II have leads protruding from the wide side of the package. Maximum seated height is 1.2mm. 

Tray and tape quantities may vary. TSOP contain internal die. Solder plated leadsSn85/Pb15. 

Pb Lead Free. Suffix -TIN = Sn100. 

27

TQFP 1.0mm Thick 

Thin Quad Flat Pack 

1.0mm 

RoHS 

Pb-Free 


Nbr lead Pitch Body Size tape Info 

Leads mm mils A x B Width pitch XQ1 Qty XQ1 Qty 

32 0.5 19.7 5mm 16mm 12mm TQFP32T19.7 360 TQFP32E13A19.7 2500 

32 0.8 31.5 7mm 16mm 12mm TQFP32T30 250 TQFP32E13A30 1000 















N 23 22 21 20 19 

1 

2 

3 

4 

5 

6 

Daisy 

Chain 

Option 

7 8 9 10 11 12 

18 

17 

16 

15 

14 

13 

PART NUMBER 




Isolated -ISO 


For “C” and “D” dimensions add 

2.0mm to dimension “A” or “B” 

Daisy Chain 

available on special order 

Add -DE to end of part number 

I 

N 

F 

O 

Thin Quad Flat Packs (TQFP) are 1.0mm thick. Lead length is 1.0mm per side. Add 2.0mm to body dimension for tip to 

tip of leads. For Daisy Chain “Even” add -DE to end of part number. For completely isolated (no internal connections) 

add -ISO to end of part number. Solder plating Sn85/Pb15. 

Pb Lead Free. Suffix TIN = Sn100. 

28

LQFP 1.4mm Thick 

Low Profile 

Quad Flat Pack 

1.4mm 

RoHS 

Pb-Free 


Nbr Lead Pitch Body Size tape Info 

Leads mm mils A x B Width pitch XQ1 Qty XQ1 Qty 

32 0.8 31.5 7mm 16mm 12mm LQFP32T30 250 LQFP32E13A30 1000 

44 0.8 31.5 10mm 24mm 16/24mm LQFP44T30 160 LQFP44E13A30 1000 

48 0.5 19.7 7mm 16mm 12mm LQFP48T19.7 250 LQFP48E13A19.7 1000 



64 0.5 19.7 10mm 24mm 16/24mm LQFP64T19.7 160 LQFP64E13A19.7 1000 






100 0.65 25.6 14x20mm 44mm 24mm LQFP100T25 72 LQFP100E13A25 1000 



128 0.5 19.7 14x20mm 44mm 24mm LQFP128T19.7 72 LQFP128E13A19.7 1000 








A 

B 

P 

For dimension “C” or “D” add 

2.0mm to dimension “A” or “B”. 

PART NUMBER 




Isolated -ISO 


L 

L 

I 

N 

F 

O 

LQFPs are slightly thicker than TQFPs. Leads are 1.0mm long. Add 2.0mm to body size for total overall dimensions. 

For Daisy Chain “Even,” add -DE to end of part number. For completely isolated (no internal connections) add -ISO 

to end of part number. Standard plating Sn85/Pb15. 

Pb Lead Free. Suffix TIN = Sn100. 

29

QFP 


TopLine 

Rectangular Body 

RoHS 

Pb-Free 

Square Body 


2xL 

FootPrint 

Nbr Adder Lead Pitch 

Leads mm mils mm XQ1 Qty XM1 Qty XQ1 Qty 

10mm Square Body 

44 3.2mm 31.5 0.8 QFP44T30-3.2 96 QFP44E7A30-3.2 50 QFP44E13A30-3.2 750 


52 3.2mm 25.6 0.65 QFP52T25-3.2 96 - - QFP52E13A25-3.2 750 

52 3.9mm 25.6 0.65 QFP52T25-3.9 96 - - QFP52E13A25-3.9 750 

64 3.2mm 19.7 0.5 QFP64T19.7-3.2 96 - - - - 


44 3.2mm 40 1.0 QFP44T40-3.2 84 - - QFP44E13A40-3.2 500 

52 3.2mm 40 1.0 QFP52T40-3.2 84 - - QFP52E13A40-3.2 500 

64 3.2mm 31.5 0.8 QFP64T30-3.2-2.0H 84 - - QFP64E13A30-3.2-2.0H 500 




100 2.0mm 19.7 0.5 SQFP100T19.7-2.0 50 - - - - 

14mm x 20mm Rectangular Body 

64 3.2mm 40 1.0 QFP64T40-3.2 60 QFP64E7A40-3.2 QFP64E13A40-3.2 200 

64 3.9mm 40 1.0 QFP64T40-3.9 66 QFP64E7A40-3.9 50 QFP64E13A40-3.9 200 




100 5.6mm 25.6 0.65 QFP100T25-5.6 60 - - - - 

128 3.2mm 19.7 0.5 QFP128T19.7-3.2 66 - - - - 

typical 

Tape Info 

Body Size Thickness Width Pitch 

B 

B 

I 

N 

F 

O 

10mm Sq. 2.0mm 24mm 16/24mm 

14mm Sq. 2.0mm 32mm 24mm 


14 x 20mm 2.7mm 44mm 32mm 



40mm Sq. 3.8mm - - 

A 

L 

A 

L 

30

QFP 


RoHS 

Pb-Free 


2xL 

FootPrint 

Nbr Adder Lead Pitch 

Leads mm mils mm XQ1 Qty XM1 Qty XQ1 Qty 


120 3.2mm 31.5 0.8 QFP120T30-3.2 24 - - QFP120E13A30-3.2 200 


128 3.2mm 31.5 0.8 QFP128T30-3.2 24 - - QFP128E13A30-3.2 200 

128 3.9mm 31.5 0.8 QFP128T30-3.9 24 - - QFP128E13A30-3.9 200 

136 3.2mm 25.6 0.65 QFP136T25-3.2 24 - - QFP136E13A30-3.2 200 

144 2.6mm 25.6 0.65 QFP144T25-2.6 24 - - QFP144E13A25-2.6 200 


144 3.9mm 25.6 0.65 QFP144T25-3.9 24 - - QFP144E13A25-3.9 200 

160 2.6mm 25.6 0.65 QFP160T25-2.6 24 - - QFP160E13A25-2.6 200 



184 2.6mm 19.7 0.5 QFP184T19.7-2.6 24 - - QFP184E13A19.7-2.6 200 

208 2.6mm 19.7 0.5 QFP208T19.7-2.6 24 QFP208E7A19.7-2.6 50 QFP208E13A19.7-2.6 200 

256 2.6mm 15.7 0.4 QFP256T15.7-2.6 24 QFP256E7A15.7-2.6 50 QFP256E13A15.7-2.6 200 


240 2.6mm 19.7 0.5 QFP240T19.7-2.6 24 - - QFP240E13A19.7-2.6 200 


304 2.6mm 19.7 0.5 QFP304T19.7-2.6 12 - - - - 

Daisy Chain 



See page 35 

PART NUMBER 




Isolated -ISO 


I 

N 

F 

O 

TopLine supplies a wide assortment of Quad Flat Packs in metric packages. Add 2 x L foot print to the body size for total 

tip-to-tip dimension. Coplanarity guaranteed to 4 mils (0.1mm). Tray quantities may vary. Some QFP contain internal die. 

For completely isolated (no internal connections) add -ISO to end of part number. Standard plating Sn85/Pb15. 

Pb Lead Free option suffix TIN = Sn100. 

31

CERQUAD & CLCC 

Ceramic Quad Flat Pack 

CERQUAD 

RoHS 

Pb-Free 

CLCC 


Square 

Nbr Lead Pitch Lead body Size 

Leads mils mm Style Inch Metric (mm) XC1 

28 50 1.27 J-lead 0.45 11.5 CLCC28J50 

44 50 1.27 J-lead 0.65 16.5 CLCC44J50 

52 50 1.27 J-lead 0.75 19.0 CLCC52J50 

68 50 1.27 J-lead 0.95 24.1 CLCC68J50 

84 50 1.27 J-lead 1.15 29.3 CLCC84J50 

44 50 1.27 Flat 0.562 14.3 CERQUAD44F50 

52 50 1.27 Flat 0.75 19.0 CERQUAD52F50 

68 50 1.27 Flat 0.95 24.1 CERQUAD68F50 

84 25 0.635 Flat 0.65 16.5 CERQUAD84F25 

84 50 1.27 Flat 1.06 27.0 CERQUAD84F50 

132 25 0.635 Flat 0.95 24.1 CERQUAD132F25 

132 25 0.635 Flat 0.87 22.1 CERQUAD132F25 

132 25 0.635 Gull-wing 0.87 22.1 CERQUAD132G25 

172 25 0.635 Flat 1.15 29.3 CERQUAD172F25 

196 25 0.635 Flat 1.26 32.0 CERQUAD196F25 

208 19.7 0.5 Flat 1.10 28.0 CERQUAD208F19.7A 

208 19.7 0.5 Gull-wing 1.10 28.0 CERQUAD208G19.7 



304 19.7 0.5 Gull-wing 1.54 39.1 CERQUAD304G19.7 

340 15 0.38 Flat 1.39 35.3 CERQUAD340F15 


Note: To assure an accurate quotation, please complete the order form on next page. Lids sold separately. 

Leads may be solder coated or gold. Add -DE to end of part number for daisy chain. 

I 

N 

F 

O 

TYPE F (Flat) TYPE F (Flat) TYPE F (Flat) 

Ceramic 

Glass 

Ceramic 

Glass 

TYPE J TYPE J TYPE J 

Ceramic 

Glass 

TYPE 2 (Gull TYPE Wing) 2 (Gull TYPE Wing) 2 (Gull Wing) 

Flat Lead J-lead gull-Wing 

on lead frame clcc with tie-bar 

Part Number 

Options 

part Nbr Suffix 

With Lid 

Blank 


Gold Leads 

Blank 

Solder Coat Leads 

-SC 

Completely Isolated 

-ISO 

Alloy 42 Body 

A 

32

Mechanical Grade 

Dummy Wafer and Die 

Dummy Wafer Ordering Information 

Wafer 

Wafer 

in in Die 

Wafer wafer Jar Cassette Tape & Ring 

Diameter type part Number Part Number Part Number 

Mirrored/Polished Wafer WM4-J WM4-C - 

4-inch Wafer with Etched Pattern WE4- mm x mm - J WE4- mm x mm -C - 

(100mm) Wafer with Sawn Mirror Die - - WMD4- mm x mm -NTR 

Wafer with Sawn Etched Die - - WED4- mm x mm -NTR 














12-inch Wafer with Etched Pattern - WE12-mm x mm-C - 


Wafer with Sawn Etched Die - - WED12-mm x mm-NTR 

18-inch Glass Wafer WM18-J CALL - 

(450mm) 

Options 

Typical Wafer Thickness 

Before Back Grinding 

4” wafer = 525µm (20 mils) 




12” wafer = 775µm (31mils) 

18” wafer = 925um (36mil) 

33 

Back Grinding: Add suffix -BG after wafer size 

in part number 

Blue Nitto Tape = NT suffix 

Blue Nitto Tape & Ring = NTR suffix 

Ultra Violet Tape & Ring = UVR suffix 

Die in 2” Waffle Pack: Add -WP2 to part number 

Etch Die: ED (sawn) 

Mirror Die = MD (sawn)

Flip Chip 

Silicon Die 

RoHS 

Pb-Free 


Die per 

Waffle 

bumped 

Nbr Bump Information Die Size 5” Wafer 

Bumps Pitch High Ø Dia Material Metric Notes Qty XI1 Qty 

48 457µm 140 178µm Eutectic 6.3mm SQ PB18 236 FC48D6.3E457 25 

88 204µm 107 102µm Eutectic 5.08mm SQ PB08 340 FC88G5.08E204 36 

112 152µm 85 88µm Eutectic 5.08mm SQ PB06 340 FC112K5.08E152 36 

317 254µm 119 102µm Eutectic 5.08mm SQ FA10 340 FC317G5.08E254 36 

1268 254µm 119 102µm Eutectic 10.2mm SQ FA10 81-85 FC1268G10E254 49 

2853 254µm 119 102µm Eutectic 15.0mm SQ FA10 28 FC2853G15E254 25 

5072 254µm 119 102µm Eutectic 20.0mm SQ FA10 18 FC5072G20E254 9 

part numbering system 

FC 48 D 6.3 E 457 

- DC 

Flip Chip 

Die Size 

Bump Pitch 

Daisy Chain 

FC = Standard Flip Chip 

FCW = Bumped Wafer 

FCQ = Quartz Flip Chip 

FCWQ = Quartz Wafer 

FCN = Bumpless Chip 

FCWN = Bumpless Wafer 

In millimeter 

6.3 = 6.3mm SQ 

10 x 15 = 10mm x 15mm 

Bump Material 

in µm 

(1000m = 1.0µm) 

Number Bumps 

Actual Count 

E = Eutectic Sn63 

G = Gold over Nickel 

C = Lead Free Sn/Ag/Cu 

A = Aluminum (Bumpless) 

Bump Diameter 

A = 100 x 127µm 

B = 115µm SQ 

C = 160µm 

D = 190µm 

E = 56µm SQ 

H = 105µm SQ 

K = 88µm 

G = 100-135µm 

R = 100µm SQ 

T = 50µm SQ 

I 

N 

F 

O 

Eutectic 63/37 SnPb allows repeatable bump collapse of 25-40µm for a typical 125µm tall bump. Flip Chips are 

available with daisy chain (-DC). For bumped wafers, change prefix of part number to FCW. For bumpless flip chip for 

wire bonding, change suffix to FCN. 

Pb Lead Free available, change “E” to “C” in part number for Sn96.8/Ag2.6/Cu0.6 -SAC266 - Lead Free Eutectic Bumps. 

34

1 15 

304 317 

1 15 

304 317 

1 15 

1 15 

304 317 

304 317 

304 317 

1 15 1 15 

1 15 

304 317 

1 15 

304 317 304 317 304 317 

1 15 1 15 

1 15 

1 15 

304 317 304 317 304 317 

1 15 

304 317 

1 15 

304 317 

1 15 

304 317 

1 15 

304 317 

37 

36 

35 

34 

33 

32 

31 

30 

29 

28 

27 

26 

25 

38 

23 

39 

22 

40 

21 

41 

20 

42 

19 

43 

18 

44 

17 

45 

16 

46 

15 

47 

14 

48 

13 

1 2 3 4 5 6 7 8 9 10 11 12 

FC48 (PB18 - 250x250) 

24 

Flip Chip 

Daisy Chain 

1 28 

112 

29 

85 

56 

84 

57 

FC112 (PB06 -200x200) 

(Bump View) 

1 15 

16 

33 

34 

51 

52 

69 

70 

87 

88 

105 

106 

123 

124 

141 

142 

159 

160 

177 

178 

195 

196 

213 

214 

231 

232 

249 

250 

267 

268 

285 

286 

303 

304 317 

FC317 (FA10-200x200) 

1 15 

1 15 

66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 

67 

44 

68 

43 

69 

42 

70 

41 

71 

40 

72 

39 

73 

38 

74 

37 

75 

36 

76 

35 

77 

34 

78 

33 

79 

32 

80 

31 

81 

30 

82 

29 

83 

28 

84 

27 

85 

26 

86 

25 

87 

24 

88 

23 

1 2 3 4 5 6 7 8 9 10111213141516171819202122 

304 317 

304 317 

1 15 1 15 

FC88 (PB08 - 200x200) 

304 317 304 317 

FC1268 (FA10 - 400x400) 

1 15 

1 15 

1 15 

304 317 

304 317 

304 317 

1 15 

1 15 

1 15 

304 317 

304 317 

304 317 

1 15 1 15 

1 15 

FC5072 (FA10 - 800x800) 

304 317 304 317 304 317 

FC2853 (FA10 - 600x600) 

35

WLP - CSP 

Wafer Level Product 

0.3mm Pitch 

RoHS 

Pb-Free 


I 

N 

F 

O 

nbr Body Ball Ball 

Fig Balls Size Allignment Matrix Substrate XJ1 Qty 

- 4 0.6m Full 2x2 Si WLP4T.3C-DC022D CALL 

- 16 1.2mm Full 4x4 Si WLP16T.3C-DC048D CALL 



1 100 3.0mm Full 10x10 Si WLP100T.3C-DC108D 256 

2 144 3.6mm Ful 12x12 Si WLP144T.3C-DC127D 256 



5 264 6.0mm 6-Row 17x17 Si WLP264T.3C-DC173D 121 




- 1600 12mm Full 40x40 Si WLP1600T.3C-DC407D 36 

Fig.1 Fig.2 

Fig.3 Fig.4 

WLP264T.3C-DC173D 

WLP - Wafer Level CSP. Total package height 0.57mm. Ball diameter is 0.20mm. 

Silicon die with copper pillar design. Additional sizes are available. 

Tape & Reel change “T” to “E” Diced Wafer Tape on Ring = NTR 

Pb 

- Lead Free - All items Pb-Free RoHS with SnAgCu balls. 

36 

0.3mm 

4" Waffle 

Part Number 

WLP100T.3C-DC108D WLP144T.3C-DC127D WLP196T.3C-DC148D WLP256T.3C-DC168D 

Fig.5 

Fig.6 Fig.7 Fig.8 

U 

T 

K J H G F E D 

R 

P N M 

L 

K 

J 

H 

G 

F 

C 

E 

B 

D 

A 

C 

B 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

A 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

Y W 

M 

L 

V U 

K 

T 

R 

J 

H 

G 

P N M 

F 

L 

K 

E 

J 

D 

H 

C 

G 

B 

F 

E 

A 

D 

12 

11 

10 

C 

9 

8 

7 

6 

5 

4 

3 

2 

1 

B 

A 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

P N M L K J H G F E D C B A 

AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 

AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K 

WLP400T.3C-DC208D WLP676T.3C-DC260D WLP900T.3C-DC307D 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

26 

25 

24 

23 

22 

21 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

T 

R 

P N M 

L 

K 

J 

H 

G 

F 

E 

D 

J 

C 

H 

G 

B 

F 

A 

E 

D 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

C 

0.57mm 

0.2mm 

B 

A 

30 

29 

28 

27 

26 

25 

24 

23 

22 

21 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1

WLP - CSP 


0.4mm Pitch 

RoHS 

Pb-Free 







- 64 3.2mm Full 8x8 Si WLP64T.4C-DC088D 256 


2 144 6.0mm 4-Row 13x13 Si WLP144T.4C-DC133D 144 





7 900 12mm Full 30x30 Si WLP900T.4C-DC307D 36 

Fig.1 

Fig.2 

Fig.3 

T 

R 

P N M 

L 


Fig.4 

Fig.5 

K 

J 

H 

G 

F 

E 

K J H G F E D C B A 

D 

C 

B 

A 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

Y W 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

V U 

T 

R 

P N M 

L 

K 

WLP256T.4C-DC168D WLP400T.4C-DC208D WLP676T.4C-DC260D 


I Silicon die with copper pillar design. Additional sizes are available. 

N Tape & Reel change “T” to “E” Diced Wafer Tape on Ring = NTR 

F 

0.4mm 

O 

Pb - Lead Free - All items Pb-Free RoHS with SnAgCu balls. 

J 

H 

G 

WLP144T.4C-DC133 

Fig.6 

F 

E 

D 

N M L 

C 

B 

A 

K 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

J 

H G F 

37 

E D C B 

AF AE 

AD AC 

A 

AB AA 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

Y W 

V U 

T 

R 

P N M 

L 

K 

J 

H 

G 

F 

E 

P N M 

D 

C 

B 

A 

L 

26 

25 

24 

23 

22 

21 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

K 

J 

H 

G 

F 

E 

4" Waffle 

Part Number 


Fig.7 

AK AJ 

D 

C 

AH AG 

B 

AF AE 

A 

AD AC 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

AB AA 

Y W 

V U 

T 

R 

P N M 


L 

K 

J 

H 

G 

F 

E 

D 

C 

B 

A 

30 

29 

28 

27 

26 

25 

24 

23 

22 

21 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

0.61mm 

0.25mm

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

AT 

AU 

AV 

AW 

AY 

40 39 38 37 36 35 34 33 

32 31 

30 29 

28 

27 26 

25 24 

23 

22 

21 20 19 18 

17 16 15 14 13 12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AQ 

AR 

AT 

AU 

AV 

AW 

AY 

BA 

BB 

BC 

BD 

45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

BGA - CSP 

Ball Grid Array 

0.4mm Pitch 

RoHS 

Pb-Free 




1 97 5mm Full 10x10 BT CSP97T.4C-DC107 624 

2 360 10mm 5-Row 23x23 BT BGA360T.4C-DC235 250 

3 400 10mm Full 20x20 BT BGA400T.4-DC209 240/250 

4 625 12mm Full 25x25 BT BGA625T.4-DC259 189 



7 2025 21mm Full 45x45 BT LBGA2025T.4-DC459 60 

10 9 8 7 6 5 4 

CSP97T.4C-DC107 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

BGA360T.4C-DC235 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

BGA400T.4-DC209 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

BGA625T.4-DC259 

BGA900T.4-DC309 

BGA1600T.4-DC409 

LBGA2025T.4-DC459 

I 

N 

F 

O 

BGA - FR4 and BT Substrate. Ball diameter is 0.25mm. 

For Internal Die, add suffix -D to end of part number 

Depopulatted “perimeter” rows are available. 

0.4mm 

Pb - Lead free option: Add “C” after pitch in part number for SnAgCu balls. 

38 

1.25mm 

0.25mm

WLP - CSP 


0.5mm Pitch 

RoHS 

Pb-Free 


I 

N 

F 

O 





- 36 3.0mm Ful 6x6 Si WLP36T.5C-DC067D 256 









Fig.1 

Fig.2 

Fig.3 

Fig.4 

H G F E D C B A 


Silicon die with copper pillar design. Additional sizes are available. 

Tape & Reel change “T” to “E” Diced Wafer Tape on Ring = NTR 

Pb 

8 

7 

6 

5 

4 

3 

2 

1 

K J H G F E D C B A 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

- Lead Free - All items Pb-Free RoHS with SnAgCu balls. 

39 

4" Waffle 

Part Number 


Fig.5 

Fig.6 

Fig.7 

Fig.8 

T R P N M L K J H G F E D C B A 

Y W V U T R P N M L K 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

J 

H 

G 

F 

E 

D 

C 

B 

A 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 


M 

L 

K 

J 

H G 

F 

E 

D 

C 

B 

A 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

P N M 

AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 

AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K 

0.5mm 

26 

25 

24 

23 

22 

21 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

L 

K 

J 

H 

G 

F 

E 

D 

C 

J 

H 

B 

G 

A 

F 

E 

14 

13 

12 

11 

10 

D 

9 

8 

7 

6 

5 

4 

3 

2 

1 

C 

B 

A 

30 

29 

28 

27 

26 

25 

24 

23 

22 

21 

20 

19 

18 

17 

16 

15 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

0.64mm 

0.3mm

CSP 


0.5mm Pitch 

RoHS 

Pb-Free 


nbr Body Ball ball 

Fig Balls Size Allignment Height Matrix Substrate XJ1 Qty 

1 6 1.5 x 1.0mm Full 0.65mm 3 x 2 Si CSP6E7A.5-DC023 Reel 

2 40 5mm 2-Row 1.24mm 8 x 8 BT CSP40T.5-DC082 624 




6 96 8mm 2-Row 1.24mm 14 x 14 Pi fBGA96T.5-DC144 360 


8 228 12mm 3-Row 1.1mm 22 x 22 BT LBGA228T.5-DC222 189 

9 288 12mm 4-Row 1.1mm 22 x 22 BT LBGA288T.5-DC221 189 

10 484 12mm Full 1.1mm 22 x 22 BT LBGA484T.5-DC229 189 

11 2025 25mm Full 1.8mm 45 x 45 BT LBGA2025T.5-DC459 44 

- 625 15mm Full 1.3mm 25x25 BT BGA625T.5-DC259 126 




1.25mm 

0.5mm 

0.30mm 

I 

N 

F 

O 

CSP - BT substrate. Total package height 1.25mm. Ball diameter is 0.3mm. 

For Internal Die, add suffix -D to end of part number 

Pb 

- Lead free option: Add “C” after pitch in part number for SnAgCu balls. 

40

Ball View 

CSP 


0.5mm Pitch 

A 

B 

fig. 1 

3 2 1 

CSP6E7A.5-DC023 

A 

B 

C 

D 

E 

F 

G 

H 

fig. 2 

8 7 6 5 4 3 2 

CSP40T.5-DC082 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

fig. 3 

10 9 8 7 6 5 4 3 2 


1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

fig. 4 

10 9 8 7 6 5 4 3 2 


1 

fig. 5 

fig. 6 

fig.7 

fig. 8 

22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

12 11 10 

9 

8 

7 


6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

14 13 12 11 10 

9 8 7 6 5 4 3 

fBGA96T.5-DC144 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

14 13 12 11 10 

9 8 7 6 5 4 3 2 1 

CSP132T.5-DC145 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

LBGA228T.5-DC222 

fig. 9 

fig. 10 

fig. 11 

45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 


22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 


2 

1 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AQ 

AR 

AT 

AU 

AV 

AW 

AY 

BA 

BB 

BC 

BD 

LBGA2025T.5-DC459 

41

BGA & CSP 


RoHS 

Pb-Free 

0.65~0.8mm Pitch 


nbr Body Ball ball 

Fig Balls Size Pattern Pitch Matrix Substrate XJ1 Qty 

1A 46 6 x 7mm Full 0.75mm 6 x 8 BT BGA46T.75-DC24 160 

1C 48 6 x 7mm Full 0.75mm 6 x 8 BT BGA48T.75-6x8 160 

2 36 6mm Full 6 x 6 BT BGA36T.8-DC069 608 

1B 48 8 x 9mm Full 6 x 8 FR4 LBGA48T.8-DC689 297 





7 112 10mm 4-Row 0.8mm 11 x 11 FR4 LBGA112T.8-DC114 184 

8 144 12mm Full 12 x 12 FR4 LBGA144T.8-DC128 189 

9 144 12mm 4-Row 13 x 13 FR4 LBGA144T.8-DC134 168/198 

10 208 15mm 4-Row 17 x 17 BT BGA208T.8-DC170 126 

11 280 17mm 5-Row 19 x 19 FR4 LBGA280T.8-DC195 90 

12 532 23mm 7-Row 26 x 26 FR4 LBGA532T.8-DC266 60 


14 2025 40mm Full 45 x 45 BT LBGA2025T.8-DC459D 21 

- 336 15mm 6-Row 0.65mm 20x20 FR4 BGA336T.65-DC203D 126 

15 2025 32.5mm Full 0.65mm 45 x 45 BT LBGA2025T.65DC459D 24 

fig. 1A 

fig. 1C 

Ball View 

fig. 1B 

fig. 2 

A 

B 

C 

D 

E 

F 

G 

H 

6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

6 

5 

4 

3 

2 

1 

BGA46T.75-DC24 

BGA48T.75-6x8 



I 

N 

F 

O 

BGA - Near CSP dimensions on rigid BT substrate with molding compound. 

Eutectic Sn63 solder balls 0.46mm diameter. (0.75mm Pitch is 0.3mm ball diameter) 

LBGA -FR4 features near CSP dimensions with unencapsulated body. 

Eutectic Sn63 solder balls 0.46mm diameter. 

Pb 

-Lead free option: Add “C” after pitch in part number for SnAgCu balls. 

BGA and LBGA 

0.8 

1.4mm Max 

42

BGA & & CSP 



BALL VIEW 

fig. 3 

7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 


A 

B 

C 

D 

E 

F 

G 

H 

8 7 6 5 

fig. 4 


4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

fig. 5 

9 8 7 6 5 4 3 2 1 


A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

fig. 6 

10 9 8 7 6 5 4 3 2 1 

BGA100T.8-DC109 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

11 10 

fig. 7 

9 8 7 6 5 4 3 2 1 


A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

12 11 10 

fig. 8 

9 8 7 6 5 4 3 


2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

13 12 

11 

10 

fig. 9 fig. 10 

9 

8 


7 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

17 

16 

15 

14 13 12 11 10 9 8 7 6 5 4 3 2 1 


T+ T- 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

1 

T+ 

2 

3 

4 5 6 

1 

2 

3 

4 5 6 7 8 9 10 1112 

13 14 15 1617 

1 2 3 4 5 6 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

19 18 

17 

16 

15 

fig. 11 

14 13 12 11 10 9 8 7 6 5 4 3 2 1 


fig. 12 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 


fig. 13 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 


43 

A 

B 

C 

D 

E 

fig. 14~15 

F 

G 

45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

H 

A 

B 

J 

C 

D 

K 

E 

L 

F 

G 

M 

H 

J 

N 

K 

P 

L 

M 

R 

N 

P 

T 

R 

T 

U 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AQ 

AR 

AT 

AU 

AV 

AW 

AY 

BA 

BB 

BC 

BD 

LBGA2025T.8-DC459 

LBGA2025T.65-DC459 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U

BGA 

Plastic Ball Grid Array 

1.0mm Pitch 

RoHS 

Pb-Free 


nbr Body Ball Center Ball 

Fig Balls Size Pattern Ball Matrix XJ1 Standard XJ1 Unencapsulated Qty 

1 81 10mm Full Array NA 9 x 9 BGA81T1.0-ISO - 250 

2 100 11mm Full Array NA 10 x 10 BGA100T1.0 - 176 

3 144 13mm Full Array NA 12 x 12 BGA144T1.0 LBGA144T1.0-DC128 160/168 

4 160 15mm 4-Row NA 14 x 14 BGA160T1.0-DC147A - 126 

5 192 17mm 4-Row NA 16 x 16 BGA192T1.0-DC160A - 90 

6 196 15mm Full Array NA 14 x 14 BGA196T1.0-DC149A - 126 

7 208 17mm 4-Row 4 x 4 16 x 16 BGA208T1.0-DC164A - 90 

8 256 17mm Full Array NA 16 x 16 BGA256T1.0-DC169A - 90 

9 288 23mm 4-Row NA 22 x 22 BGA288T1.0-DC221 - 60 

10 324 23mm 4-Row 6 x 6 22 x 22 BGA324T1.0-DC224 - 60 


12 400 21mm Full Array NA 20 x 20 - LBGA400T1.0-DC209 60 

13 484 23mm Full Array NA 22 x 22 - LBGA484T1.0-DC229A 60 


15 676 27mm Full Array NA 26 x 26 BGA676T1.0-DC269 - 40 



18 1600 42.5mm Full Array NA 40 x 40 - LBGA1600T1.0-DC409 12 


- 10,000 115mm Full Array NA 100 x 100 - LBGA10000T1.0-BUS 4 

BGA 

1.0mm 

LBGA 

1.0mm 

1.66~2.0mm 

Ref 

2.1mm Max 

A 

B 

C 

D 

E 

F 

G 

H 

J 

Fig. 1 

9 8 7 6 5 4 3 2 1 

BGA81T1.0-ISO 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

Fig. 2 

10 9 8 7 6 5 4 3 2 1 

BGA100T1.0 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

12 11 10 9 

Fig. 3 

8 7 6 5 4 3 2 1 

LBGA144T1.0-DC128 

I 

N 

F 

O 

BGA - Standard BGA plastic packages should be baked at 125˚C for 24 hours prior to assembly to prevent delamination 

and the “popcorn” phenomena during the assembly process. Solder balls are eutetic Sn63 SnPb 25mil (0.63mm) 

LBGA- Unencapsulated profile laminate Ball Grid Arrays offer the lowest cost when placement practice is the primary 

concern. Includes daisy chain laminate substrate with 25mil (0.63mm) Sn63. 

Pb - Lead Free Option: Add “C” after pitch in part number for SnAgCu balls. 

44

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

AT 

AU 

AV 

AW 

AY 

40 39 38 37 36 35 34 33 

32 31 30 29 

28 27 26 25 24 

23 22 21 20 19 18 

17 16 15 14 13 12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

AT 

AU 

AV 

AW 

AY 

BA 

BB 

BC 

BD 

44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

Fig. 4 

14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

BGA160T1.0-DC147A 

BGA 


A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

16 15 14 13 12 11 

Fig. 5 

10 

1.0mm Pitch 

9 

BGA192T1.0-DC160A 

8 

7 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

14 

13 12 

11 

10 

Fig. 6 

9 

8 

7 

6 

Ball View 

BGA196T1.0-DC149A 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

16 15 14 13 12 11 

Fig. 7 

10 

9 

BGA208T1.0-DC164A 

8 

7 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

16 15 14 13 12 11 

Fig. 8 

10 

9 

BGA256T1.0-DC169A 

8 

7 

6 

5 

4 

3 

2 

1 

Fig. 9 

22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

BGA288T1.0-DC221 

Fig. 10 

22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

BGA324T1.0-DC224 

Fig. 11 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

BGA388T1.0-DC264 

Fig. 12 

Fig. 13 

Fig. 14 

Fig. 15 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

20 

19 18 

17 16 15 14 

13 12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

LBGA400T1.0-DC209 

LBGA484T1.0-DC229A 

LBGA672T1.0-DC268 

BGA676T1.0-DC269 

Fig. 16 

Fig. 17 

Fig. 18 

Fig. 19 

30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

LBGA900T1.0-DC309 

LBGA1156T1.0-DC349 

45 

LBGA1600T1.0-DC409 

LBGA1936T1.0-DC449

BGA 


1.27mm Pitch 

RoHS 

Pb-Free 


nbr Body Ball Center Ball 

Fig Balls Size Pattern Ball Matrix XJ1 Standard Unencapsulated Qty 

1 208 23mm 4-Row -0- 17 x 17 BGA208T1.27-DC170 - 60 


3 256 27mm 4-Row -0- 20 x 20 BGA256T1.27-DC200 - 40 

4 256 21mm Full -0- 16 x 16 - LBGA256T1.27-DC61 60 


6 352 35mm 4-Row -0- 26 x 26 BGA352T1.27-DC70 - 24 

7 357 25mm Full NA 19 x 19 - LBGA357T1.27-DC73 24 


9 1225 45mm Full -0- 35 x 35 - LBGA1225T1.27-DC359 12 

Side View 

Molded Top 

BGA 

2.1~2.3mm 

(ref) 

Laminate 

1.27mm 

LBGA 

2.1mm Max 

Laminate 

1.27mm 

I 

N 

F 

O 


and the “popcorn” phenomena during the assembly process. Solder balls are eutetic Sn63/Pb37 30mil (0.75mm) 

LBGA - Laminate Ball Grid Arrays offer the lowest cost when placement practice is the primary concern. 

Includes daisy chain laminate with 30mil (0.75mm) Sn63/Pb37 balls for soldering at 210˚C. 

Pb - Lead Free available. SnAgCu = Add “C” after pitch in part number. 

46

Ball View 

Fig. 1 

BGA 


1.27mm Pitch 

Fig. 2 

Fig. 3 

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

BGA208T1.27-DC170 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

BGA217T1.27-DC172 

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

BGA256T1.27-DC200 

Fig. 4 

Fig. 5 

Fig. 6 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

LBGA256T1.27-DC61 

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

BGA272T1.27-DC202 

1 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

BGA352T1.27-DC70 

Fig. 7 

Fig. 8 Fig. 9 

35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 

19 18 17 16 15 1413 12 11 10 9 8 7 6 5 4 3 2 1 1 

A 

B 

A 

A 

C 

B 

D 

B 

E 

C 

C 

F 

D 

G 

D 

E 

H 

F 

J 

E 

K 

G 

L 

F 

H 

M 

G 

J 

N 

P 

K 

H 

R 

L 

T 

J 

M 

U 

V 

K 

N 

W 

P 

Y 

L 

R 

AA 

M 

T 

AB 

AC 

U 

AD 

N 

V 

AE 

P 

W 

AF 

AG 

R 

Y 

AH 

AA 

AJ 

T 

AB 

AK 

AL 

U 

AC 

AM 

AD 

AN 

V 

AE 

AP 

W 

AF 

AR 

LBGA357T1.27-DC73 

BGA388T1.27-DC72 

47 

LBGA1225T1.27-DC359

CBGA 

Ceramic Ball Grid Array 

1.27mm Pitch 

1.7mm 

max 

height 

RoHS 

Pb-Free 


nbr ball Ball Low Temp 210˚C High Temp 320˚C 

Fig Balls Body Size Pattern Matrix XJ1 62/36/2 SnPbAg XJ1 10/90 SnPb Qty 

1 121 15mm Full Grid 11 x 11 CBGA121T1.27L-DC5 CBGA121T1.27-DC5 126 

2 196 18.5mm Full Grid 14 x 14 CBGA196T1.27L-DC11 CBGA196T1.27-DC11 84 


4 304 21 x 25mm Full Grid 16 x 19 CBGA304T1.27L-DC63 CBGA304T1.27-DC63 55 



7 625 32.5mm Full Grid 25 x 25 - CBGA625T1.27-DC81 24 

8 1089 42.5mm Full Grid 33 x 33 - CBGA1089T1.27-DC339 12 

Fig. 1 Fig. 2 

11 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

14 13 12 11 10 

9 

8 

7 6 

5 

4 

3 

2 

1 

CBGA121T1.27-DC5 

(Ball View) 

CBGA196T1.27-DC11 

(Ball View) 

I 

N 

F 

O 

Ceramic Ball Grid Arrays are not sensitive to moisture and do not require baking prior to assembly. 

Ball diameter is 30 mils (0.75mm). Standard ball material is Sn10/Pb90 for high temperature soldering 

at 320˚C to ceramic substrate. For low temperature soldering at 210˚C to laminate substrate, 

specify Sn62/Pb36/Ag2 solder balls by adding -L to part number. Caution advised CTE mismatch > 25mm. 

Pb Lead free available with SnAgCu balls. Add“C” after pitch in part number 

48

CBGA - Ceramic Ball Grid Array - 1.27mm Pitch 

Fig. 3 

(Ball View) 

Fig. 4 

16 15 

14 

13 12 11 10 

9 

8 

7 6 

5 

4 

3 

2 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

19 18 17 

16 15 14 

13 12 11 10 

9 8 

7 6 5 

4 3 2 

1 

CBGA256T1.27-DC61 

CBGA304T1.27-DC63 

Fig. 5 

Fig. 6 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

19 18 

17 16 15 14 13 12 11 10 

9 8 

7 6 

5 4 3 

2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

20 19 18 17 16 

15 14 13 

12 11 10 

9 8 

7 6 5 4 3 2 

1 

CBGA361T1.27-DC71 

CBGA400T1.27-DC21 

Fig. 7 

Fig. 8 

25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

CBGA625T1.27-DC81 

49 

33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

CBGA1089T1.27-DC339

CCGA 

COLUMN GRID ARRAY 

1.0 ~ 1.27mm PITCH 

Pb90/Sn10 

Plain 

Pb80/Sn20 

Cu Wrap 

Daisy Chain 

Visit www.CCGA.co 

Ceramic Substrate 

Daisy Chain 


copper 

nbr Body pad wrap 

Fig Pads Size Pitch Matrix Alloy Column XJ1 Qty 

CCGA - Pb80/Sn20 Columns 

1 484 23mm 1.0mm 22x22 Pb80/Sn20 YES CCGA484T1.0-DC225D 1 

2 624 32.5mm 1.27mm 25x25 Pb80/Sn20 YES CCGA624T1.27-DC254D 1 





7 1752 45mm 1.0mm 42x42 Pb80/Sn20 YES CCGA1752T1.0-DC427CN 1 

CLGA - Without Columns 

2 624 32.5mm 1.27mm 25x25 Ni/Au PAD CLGA624T1.27-DC254D 1 

4 1152 35mm 1.0mm 34x34 Ni/Au PAD CLGA1152T1.0-DC346D 1 



7 1752 45mm 1.0mm 42x42 Ni/Au PAD CLGA1752T1.0-DC427CN 1 

Fig. 1 

Fig. 2 

Fig. 4 

Fig. 5 

CCGA484T1.0-DC225D 




I 

N 

F 

O 

CCGA - Daisy chain Ceramic Column Grid Arrays are available with three types of pin constructions: 

Pb80/Sn20 solder column with copper wrapping provides reliable safety-net in case of cracking in column. 

Pb90/Sn10 straight solder column without copper wrap is basic IBM style pin construction. 

Micro-Coil Springs - Invented by NASA. Tiny Be-Cu (Beryllium Copper) springs absorb extreme shock. 

50

BGA 


1.5mm Pitch 

RoHS 

Pb-Free 



fig Balls Size Pattern Matrix XJ1 Qty 

1 169 23mm Full Array 13 x 13 BGA169T1.5-DC10 60 

2 225 27mm Full Array 15 x 15 BGA225T1.5-DC15 40 

BGA Daisy Chain Patterns (Ball View) - Illustrations Not To Scale 

Fig. 1 

Fig. 2 

13 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

1 

15 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

1 

BGA169T1.5-DC10 

BGA225T1.5-DC15 

Side View 

BGA 

2.1~2.3mm 

(ref) 

1.5mm 

I 

N 

F 

O 


and the “popcorn” phenomena during the assembly process. Solder balls are eutetic 63/37 SnPb 30mil (0.75mm) 

Pb - Lead Free Available: Add “C” after pitch in part number for SnAgCu balls. 

51

BGA 

Maximum Ball Count 

Rows 

Matrix 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 

6x6 20 32 36 

7x7 24 40 49 

8x8 28 48 60 64 

9x9 32 56 72 80 81 

10x10 36 64 84 96 100 

11x11 40 72 96 112 120 121 

12x12 44 80 108 128 140 144 

13x13 48 88 120 144 160 168 169 

14x14 52 96 132 160 180 192 196 

15x15 56 104 144 176 200 216 224 225 

16x16 60 112 156 192 220 240 252 256 

17x17 64 120 168 208 240 264 280 288 289 

18x18 68 128 180 224 260 288 308 320 324 

19x19 72 136 192 240 280 312 336 352 360 361 

20x20 76 144 204 256 300 336 364 384 396 400 

21x21 80 152 216 272 320 373 392 416 432 440 441 

22x22 84 160 228 288 340 384 420 448 468 480 484 

23x23 88 168 240 304 360 408 448 480 504 520 528 529 

24x24 92 176 252 320 380 432 476 512 540 560 572 576 

25x25 96 184 264 336 400 456 504 544 576 600 616 624 625 

26x26 100 192 276 352 420 480 532 576 612 640 660 672 676 

27x27 104 200 288 368 440 504 560 608 648 680 704 720 728 729 

28x28 108 208 300 384 460 528 588 640 684 720 748 768 780 784 

29x29 112 216 312 400 480 552 616 672 720 760 792 816 832 840 841 

30x30 116 224 324 416 500 576 644 704 756 800 836 864 884 896 900 

31x31 120 232 336 432 520 600 672 736 792 840 880 912 936 952 960 961 

32x32 124 240 348 448 540 624 700 768 828 880 924 960 988 1008 1020 1024 

33x33 128 248 360 464 560 648 728 800 864 920 968 1008 1040 1064 1080 1088 1089 

34x34 132 256 372 480 580 672 756 832 900 960 1012 1056 1092 1120 1140 1152 1156 

35x35 136 264 384 496 600 696 784 864 936 1000 1056 1104 1144 1176 1200 1216 1224 1225 

36x36 140 272 396 512 620 720 812 896 972 1040 1100 1152 1196 1232 1260 1280 1292 1296 

37x37 144 280 408 528 640 744 840 928 1008 1080 1144 1200 1248 1288 1320 1344 1360 1368 1369 

38x38 148 288 420 544 660 768 868 960 1044 1120 1188 1248 1300 1344 1380 1408 1428 1440 1444 

39x39 152 296 432 560 680 792 896 992 1080 1160 1232 1296 1352 1400 1440 1472 1496 1512 1520 1521 

40x40 156 304 444 576 700 816 924 1024 1116 1200 1276 1344 1404 1456 1500 1536 1564 1584 1596 1600 

41x41 160 312 456 592 720 840 952 1056 1152 1240 1320 1392 1456 1512 1560 1600 1632 1656 1672 1680 1681 

42x42 164 320 468 608 740 864 980 1088 1188 1280 1364 1440 1508 1568 1620 1664 1700 1728 1748 1760 1764 

43x43 168 328 480 624 760 888 1008 1120 1224 1320 1408 1488 1560 1624 1680 1728 1768 1800 1824 1840 1848 1849 

44x44 172 336 492 640 780 912 1036 1152 1260 1360 1452 1536 1612 1680 1740 1792 1836 1872 1900 1920 1932 1936 

45x45 176 344 504 656 800 936 1064 1184 1296 1400 1496 1584 1664 1736 1800 1856 1904 1944 1976 2000 2016 2024 2025 

52

eWLP 

EMBEDDED CSP DIE 

0.3 ~ 0.4mm PITCH 

Epoxy 

Pi 

Si 

P 

Cut Away View 

H 

RoHS 

Pb-Free 


(H) 

nbr Die (P) Pad Pad Die 

Fig Pads Size Pitch Matrix Diameter Thickness XJ1 Qty 

1 

2 

3 

4 

5 

6 

7 

4 

16 

36 

64 

100 

144 

196 

0.56mm 

1.16mm 

1.76mm 

2.36mm 

2.96mm 

3.56mm 

4.16mm 

0.3mm 

2x2 

4x4 

6x6 

8x8 

10x10 

12x12 

14x14 

0.15mm 

200um 

and 

360um 

eWLP4T.3-DC022 







400 

400 

225 

100 

100 

100 

49 

1 

2 

3 

4 

5 

6 

7 

4 

16 

36 

64 

100 

144 

196 

0.76mm 

1.56mm 

2.36mm 

3.16mm 

3.96mm 

4.76mm 

5.56mm 

0.4mm 

2x2 

4x4 

6x6 

8x8 

10x10 

12x12 

14x14 

0.20mm 

200um 

and 

360um 








625 

100 

100 

100 

49 

64 

36 

I 

N 

F 

O 

Fig. 4 

F E D C B A 

6 

5 

4 

3 

2 

1 

Fig. 1 

B A 

eWLP4 

2 

1 

Fig. 5 

K J H G F E D C B 

A 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

Fig. 2 

eWLP16 

eWLP64 

eWLP100 

eWLP144 

eWLP - New generation of thin CSP silicon die with copper (Cu) posts without surface treatment. 

Application is embedding die inside PC boards. 

Die thickness: 200um or 360um. Available die face up and face down. 

Packaging available: Waffle Pack, T&R and Wafer on UV Tape and Ring. 

D 

C 

53 

B 

A 

4 

3 

2 

1 

Fig. 6 

M L K J H G F E D C B A 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

Fig. 3 

F E D C B A 

6 

5 

4 

3 

2 

1 

eWLP36 

Fig. 7 

P N M L K J H G F E D C B A 

14 

13 

12 

11 

10 

9 

8 

7 

6 

5 

4 

3 

2 

1 

eWLP196

Leadless QFN 

RoHS 

Pb-Free 


Body Nbr Lead Tape Info 

Size SQ Leads Pitch Width Pitch Qty Qty 

QFN 

2mm 6 0.5mm DFN6E7A.5 Reel DFN6B.5 Bulk 


2mm 6 0.65mm 8mm 8mm DFN6E7A.65 Reel DFN6B.65 Bulk 


3mm 10 0.5mm DFN10T.5 490 DFN10M.5 121 

3mm 12 0.5mm QFN12T.5 490 QFN12M.5 121 

4mm 12 0.65mm QFN12T.65 490 QFN12M.65 91 

3mm 16 0.5mm QFN16T.5 490 QFN16M.5 121 

4mm 16 0.65mm QFN16T.65 490 QFN16M.65 91 

5mm 16 0.8mm QFN16T.8 490 QFN16M.8 73 

4mm 20 0.5mm 12mm 8mm QFN20T.5 490 QFN20M.5 91 

4mm 24 0.5mm QFN24T.5 490 QFN24M.5 91 

6mm 24 0.8mm QFN24T.8 490 QFN24M.8 61 

5mm 28 0.5mm QFN28T.5 490 QFN28M.5 73 

5mm 32 0.5mm QFN32T.5 490 QFN32M.5 73 

6mm 28 0.65mm QFN28T.65 490 QFN28M.65 61 


7mm 32 0.65mm QFN32T.65 260 QFN32M.65 42 


7mm 44 0.5mm QFN44T.5 260 QFN44M.5 52 

8mm 44 0.65mm QFN44T.65 260 QFN44M.65 46 

7mm 48 0.5mm QFN48T.5 260 QFN48M.5 42 


8mm 56 0.5mm QFN56T.5 260 QFN56M.5 37 

9mm 64 0.5mm QFN64T.5 260 QFN64M.5 33 

10mm 68 0.5mm QFN68T.5 168 QFN68M.5 30 


12mm 80 0.5mm QFN80T.5 189 - - 

I 

N 

F 

O 

Bottom View of Pads 

DFN - Dual Side 

QFN 

Perimeter lead CSP utilize lead frame in an epoxy molded plastic case. Offered with daisy chain, add -DE to end 

of part number. Available in tubes, trays and on reels. 

Standard Lead Plating 85Sn/15Pb. 

Pb Lead Free. Suffix -TIN = Sn100 G = Ni-Au, “F” = NiPdAu 

54 

PART NUMBER 

Options 

Standard 

Daisy Chain 

Isolated 

Lead Free 

Lead Free 

Lead Free 

Suffix 

Blank 

-DE 

-ISO 

-TIN (Sn100) 

-F (NiPdAu) 

-G (NiAu)

Daisy Chain 

(Top View) 

1 

1 

1 

1 

1 

6L 

8L 

10L 

12L 

16L 

1 

1 

1 

1 

20L 

24L 

28L 

32L 

1 

1 

1 

1 

40L 

44L 

48L 

52L 

1 

1 

1 

1 

56L 

64L 

68L 

72L 

55

Open Cavity M-QFN 

Attach Your Die 

See details pages 152-155 

Cavity 

Bottom 

RoHS 

Pb-Free 

Ordering Information 

Attach die here 

Body Nbr Lead Die Pad Size Lid Cover 

Size SQ Leads Pitch mm Part Number Part Nbr (optional) 

Open Cavity 

3mm 8 0.65mm 1.4 SQ M-QFN8W.65 B-LID3-BLACK 















TOP VIEW 

A 

D 

0.175 

6° 

SIDE VIEW 

0.635 

PITCH 

BOTTOM VIEW 

W 

E 

Die 

Pad 

E 

Die Pad 

Pad 

I 

N 

F 

O 

A 

Die Pad 

0.175 

TYP 

Open cavity. Attach and wire bond your own die. 

Wire bondable. Applications: MEMS, RF Microwave. Fabless prototype, Socket probing 

Visit www.MirrorSemi.com for drawings 

0.840 

56 

D4 

D 

L

DIP 

Dual Inline Package 

RoHS 

Pb-Free 

TopLine 


C case Length Case Length 

Nbr Leads inch metric XN1 Qty 

300 mil Wide Body 

2 .100 2.54mm DIP2M3 200 

8 .360” 9.1mm DIP8M3 50 

14 .760” 19.3mm DIP14M3 25 

16 .760” 19.3mm DIP16M3 25 

18 .890” 22.6mm DIP18M3 21 

20 .960” 24.1mm DIP20M3 18 

24 1.25” 31.7mm DIP24M3 15 

28 1.35” 34.5mm DIP28M3 14 

600 mil Wide Body 

24 1.25” 31.7mm DIP24M6 15 

28 1.45” 36.8mm DIP28M6 13 

32 1.65” 41.9mm DIP32M6 11 

40 2.05” 52.0mm DIP40M6 9 

48 2.40” 60.9mm DIP48M6 9 

SDIP 70mil Pitch 

I 

N 

F 

O 

32 .4” x 1.10” 10.16 x 27.8mm SDIP32M4 16 

42 .6” x 1.45” 15.24 x 36.8mm SDIP42M6 14 

52 .6” x 1.81” 15.24 x 46.0mm SDIP52M6 11 

56 .3” x 2.06” 15.24 x 52.3mm SDIP56M6 9 

64 .75” x 2.27” 19.05 x 57.6mm SDIP64M7.5 9 

N 15 14 13 12 11 10 9 

1 2 3 4 5 

6 7 8 

Daisy Chain 



TopLine supplies DIP Plastic Dual Inline Packages with lead pitch of 0.100” (2.54mm). Also available with Ceramic 

Case on special order, by adding “CER” prefix to front of part number. SDIP packages have lead pitch of 0.07” 

(1.778mm). For completely isolated (no internal connections) add -ISO to end of part number. 

Pb For Lead Free option, add -TIN to end of part number. 

57 

PART NUMBER 




Isolated -ISO 

Lead Free -TIN (Sn100)

TO 

Transistor 

RoHS 

Pb-Free 


material 

Case lead XT1 Qty XT1 Qty XT1 Qty 

Metal Solder TO5 25 - - - - 




Plastic Solder TO92 100 - - - - 

Plastic Solder TO92-.2” 100 - - TO92T-.2” 2000 


Plastic Solder TO220-3 - TO220M-3 50 - - 

Metal Cu-Kovar TO254 - - - - - 

Metal Cu-Kovar TO257 - - - - - 

Pb 

For Lead Free 

add -TIN to end 

of part number. 

TO5 (1.25” lead length) 

TO39 (.75” lead length) 

TO18 TO75 6 Lead 

TO99 8 Lead 

2.54mm 

(.1”) 

1.27mm 

(.050”) 

5.08mm 

(.2”) 

I 

N 

F 

O 

TO92 

TO92T-.2 

TO220 

TO254 

TO257 

58

Solder Terminals 

For Hand Soldering Proficiency 

IPC COMPLIANT 


XM0 XM0 XM0 XM0 

Terminal Type pn qty pn qty pn qty pn qty 

Bifurcated 103005 5 103025 25 103100 100 103999 1000 

Gold Cup 104005 5 104025 25 104100 100 104999 1000 

Hook 105005 5 105025 25 105100 100 105999 1000 

Pierced 106005 5 106025 25 106100 100 106999 1000 

Turret 107005 5 107025 25 107100 100 107999 1000 

20 AWG Wire Black 108020 5FT 108120 100 FT 108520 1000 FT 108920 5000 FT 

22 AWG Wire Red 108022 5FT 108122 100 FT 108522 1000 FT 108922 5000 FT 

24 AWG Wire Yellow 108024 5FT 108124 100 FT 108524 1000 FT 108924 5000 FT 

26 AWG Wire Blue 108026 5FT 108126 100 FT 108526 1000 FT 108926 5000 FT 

Terminal Holder 109000 1 - - - 

Kit of Above 102000 1 - - - - - - 

Kit without Terminal Holder 101000 1 - - - - - - 

Bifurcated 

Terminal 

Brass 

Turret 

Terminal 

Brass 

Gold Cup 

Terminal 

Brass 

Pierced 

Terminal 

Brass 

Hook 

Terminal 

Copper 

Terminal 

Holder 

SnPb 

SnPb 

Au-Ni 

SnPb 

SnPb 

FR4 

I 

N 

F 

O 

IPC style terminals for hand soldering proficiency. 

Also available in kit form 

59

Axial Lead Components 

CF - Resistor 

RoHS 

Pb-Free 


+ 

DO - Diode 

Size 

Inch 

.062” x .145” 1/8 Watt Size 0.5mm Epoxy CF18 100 CF18A 5000 

.090” X .250” 1/4 Watt Size 0.6mm Epoxy CF14 100 CF14A 5000 

.140” X .375” 1/2 Watt Size 0.6mm Epoxy CF12 100 CF12A 2500 

.180” x .562” 1 Watt Size 0.8mm Epoxy CF100 100 CF100A 1K 

Glass Case 

Size 

metric 

Dia x L Dia x L Lead Dia. Body XA1 Qty XA1 Qty 

.070” X .154” 1.78 X 3.9mm .020” Glass DO35 100 DO35A 5000 

.107x.205” 2.72 x 5.2mm .031” Glass DO41-GLASS 100 DO41A-GLASS 2500 

Molded Case 

.107” x .205” 2.72 x 5.2mm .031” Molded DO41 100 DO41A 2500 

.209” x .374” 5.3 x 9.5mm .051” Molded DO201AD 100 DO201AD-A 1200 

Radial Lead Components 


Lead Space 

Case Size 

Inch Metric Inch Metric XR1 Qty XR1 Qty XR1 Qty 

.2” SQ 5mm SQ - - NR1 100 NR1A 2000 

.2” x .28” 5 x 7mm - - EH5x7 100 EH5x7A 2000 

.1” 2.5mm .2” x .6” 5 x 15mm RS6M 35-40 RS6 300 Call Call 

.2” x .8” 5 x 20mm RS8M 25-30 RS8 200 Call Call 

.2” x 1.0” 5 x 26mm RS10M 20-24 RS10 150 Call Call 

.2” SQ 5mm - CK05 100 CK05T 2000 

.2” SQ 5mm - NR2 100 NR2A 2000 

.3” SQ 7.60mm - CK06 100 CK06T 1500 

.2” 5.7mm .2 x .31 5 x 8mm - DD2 100 DD2T 1000 

.20 x .43 5 x 11mm - EH5x11 - 100 EH5X11A 1000 

NR 

.06 x .15 1/8w - - CFR18 100 CFR18-AVI 2000 

CK05 CK06 DD2 

EH 

RS 

CFR 

I 

N 

F 

O 

Pb 

Lead Free Option: Sn100 add -TIN to end of part number. 

60 

+ +

Waffle Trays 

for Bare Die 

WP 

Series 

WP = Waffle 

Pack 

2 - 

Tray Size 

2 = 2" SQ 

4 = 4" SQ 

5.0 x 5.0 x 0.8 

Pocket Dimension (mm) 

Length x Width x Depth of Tray Bottom 

(blank if bottom tray) 

B 

Type 

B = Black 

Option 

Material 

Blank = Black (standard) 

A = Amber 

N = Natural 

Cover Suffix 

COVER = Standard Black Cover 

Clip Holds Covers + Bottom 

CLIP1 = Single Clip Holds Tray + Cover 

CLIP2 = Clip Pair Holds Tray + Cover 

CLIP5 = Clip Pair Holds 5 Trays + Cover 

CLIP10 = Clip Pair Holds 10 Trays + Cover 

Insert 

INSERT-PAPER = Rice Paper 

INSERT-TYVEK = White 

Accessories 

LABEL-BLANK = Unprinted Label (Roll 1000) 

LABEL-PP = Preprinted Form Roll (Roll 500) 

Waffle Tray Capacity (example)* 

Pocket 2” Square WP2 4” Square WP4 

Size Sq Matrix Pockets Matrix Pockets 

1mm Sq 20 x 20 400 30 x 30 900 

2mm Sq 10 x 10 100 29 x 30 870 

3mm Sq 10 x 10 100 16 x 16 256 

4mm Sq 8 x 8 64 14 x 14 196 

5mm Sq 7 x 7 49 12 x 12 144 

6mm Sq 5 x 5 25 11 x 11 121 

7mm Sq 5 x 5 25 9 x 9 81 

8mm Sq 4 x 4 16 8 x 8 64 

9mm Sq 4 x 4 16 8 x 8 64 

10mm Sq 3 x 3 9 7 x 7 49 

12mm Sq 3 x 3 9 6 x 6 36 

13mm Sq 3 x 3 9 6 x 6 36 

14mm Sq 3 x 3 9 5 x 5 25 

15mm Sq 2 x 2 4 5 x 5 25 

17mm Sq 2 x 2 4 4 x 4 16 

19mm Sq 2 x 2 4 4 x 4 16 

21mm Sq 2 x 2 4 3 x 3 9 

*other sizes available 

61

Matrix Trays 

For BGA 


JEDEC Size 

136mm x 316mm 

I 

N 

F 

O 

Tray Ordering Information 


Component Components matrix 

Size per Tray Row Column XZ1 

5 x 5mm 576 16 x 36 BGATRAY5mm-16x36 







8 x 8mm 348 12 x 29 BGATRAY8mm12x29 






















37.5 x 37.5mm 21 3 x 7 BGATRAY37.5mm-3x7 





6 x 7mm 160 10 x 16 BGATRAY6x7-10x16 


7 x 9mm 325 13 x 25 BGATRAY7x9mm-13x25 

14 x 22mm 84/96 7 x 12 6 x 14 8 x 12 BGATRAY14x22-6x14 


Specify minimum temperature rating: 50˚C, 75˚C, 125˚C, 130˚C, 140˚C, 150˚C or 180˚C 

62

Matrix Trays 

for QFP & QFN 

JEDEC Size 

136mm x 316mm 


Component Component Components Matrix 

Body Size height per Tray Column x Row XZ1 

QFP Tray 

10mm Sq. 2.0mm 96 6 x 16 QTRAY10mm-6x16 

14mm Sq. 2.0-2.7mm 84 6 x 14 QTRAY14mm-6x14 

14 x 20mm 2.7mm 66 6 x 11 QTRAY14x20mm-6x11 




LQFP Tray 

7mm Sq. 250 10 x 25 LQTRAY7mm-10x25 



14mm Sq. 1.4mm 90 6 x 15 LQTRAY14mm-6x15 

14 x 20mm 72 6 x 12 LQTRAY14x20mm-6x12 




TQFP Tray 

5mm Sq. 360 12 x 30 TQTRAY5mm-12x30 



12mm Sq. 1.0mm 119 7 x 17 TQTRAY12mm-7x17 


14 x 20mm 72 6 x 12 TQTRAY14x20mm-6x12 


QFN Tray 

3mm Sq. 490 14 x 35 QFNTRAY3mm-14x35 



6mm Sq. 0.9mm 490 14 x 35 QFNTRAY6mm-14x35 




I 

N 

F 


O Specify minimum temperature rating at time of ordering: 50˚C, 75˚C, 125˚C, 130˚C, 140˚C, 150˚C or 180˚C 

63

Matrix Trays 

for TSOP & PLCC 

JEDEC Size 

136mm x 316mm 


Component component Components Matrix 

Size height Per Tray Row x Column XZ1 

Type 1 (Including Leads) 

8 x 13.4mm 234 13 x 18 TTRAY8x13.4mm-13x18 

10 x 14mm 160 10 x 16 TTRAY10x14mm-10x16 

8 x 20mm 1.0-1.2mm 156 12 x 13 TTRAY8x20mm-12x13 




Type II (Body Size) 

.4” x .725” (10.16 x 18.4mm) 1.0-1.2mm 135 9 x 15 T2TRAY10x18.4-9x15 

.4” x .825” (10.16 x 20.95mm) 117 9 x 13 T2TRAY10x21-9x13 

.4” x .875” (10.16 x 22.22) 108 9 x 12 T2TRAY10x22-9x12 

tray for j-lead, plcc, lcc and clcc 

Component Component Components Matrix 

Size height Per Tray Row x Column XZ1 

I 

N 

F 

O 

PLCC32 4.4mm 128 8 x 16 PLCC32TRAY-8x16 


PLCC44 3.6mm 84 6x14 PLCC44TRAY6x14 




64

Kit 

Part Numbering 

System 

WebCode XK1 

926 

Series 

900 = QFP Lead Template 

901 = FC176 Flip Chip 




905 = CBGA Ceramic Substrates 

906 = FC96 Ceramic 

907 = FC96 Lamanate 

908 = FC48 Ceramic 


910 = Beginner Throughhole 


912 = Recertification Mix Tech 

913 = Multilayer Throughhole 

914 = Mixed Technology 2 

915 = Multipurpose Throughhole 

916 = Multipurpose Throughhole 

917 = BGA121, 352, 400 (obsolete) 

918 = Unassigned * 

919 = Phillips Machine 

920 = Challenger 1 (see 928) * 

921 = µBGA TV46 

922 = TV74 (obsolete) 

923 = TV188 (obsolete) * 

924 = Beginners SMD 

925 = SMD Introductory 

926 = Practical Mixed Technology 

927 = Unassigned 

928 = Challenger 2 

929 = Jumbo Chip Set * 

930 = Advanced w/o QFP256 

931 = Advanced w/QFP256 

932 = µBGA TV62 

933 = Custom * 

934 = µBGA TV208 

935 = Stencil Eval. w/TQFP168 

936 = Stencil Evaluation 

937 = Econo I - BGA 

938 = Econo II - Mixed 

939 = Econo III - Mixed 

940 = Monster (see 948) * 

941 = Mydata * 

942 = Intertronic 2001 

943 = TQFP168 (obsolete) 

944 = Rework 2 Practice 

945 = PCMCIA 

946 = Universal BGA 1.27/1.5mm 

947 = BGA256/272/292/352/388 

948 = Monster 2 * 

949 = 0201/0402 Chip 

950 = SMTA Saber 

951 = CBGA 

952 = B52 CRET Cleanliness 

953 = Visual BGA & Flip Chip 

954 = HP Saber Alloy Test 

955 = DIE KIT * 

956 = CLGA 

957 = CBGA196/625 * 

958 = LBGA1089/1225 

959 = 2D Matrix & Bar Codes 

960 = Machine Diagnostic * 

961 = Fiducial Comparator 

962 = 28mm QFP Assortment 

963 = Universal BGA .5~.8mm 

964 = 0402/0603 Chip 


966 = BGA169/225 6L 

967 = BGA169/225 

968 = 0805/1206 Chip 

969 = Mixed Technology 1 

970 = Display Boards 

971 = Label for 970 * 

972 = Parts for Display 

973 = CCGA1089/CCGA1274* 

974 = eBGA1600/eBGA1936 

975 = QFN Daisy Chain 

976 = BGA256 1.0mm/SBGA560 

977 = Metcal * 


979 = NASA Training 

980 = 01005 / 0201 Chip 

981 = Universal BGA 1.0/0.8mm 

982 = QFP208 Lead Free 

983 = 0805/1206 Lead Free 

984 = 0402/0603 Lead Free 

985 = Unassigned 

986 = Lead Free Multicomponent 

999 = Special/Custom * 

9603 = TSOP32 * 

9613 = BQFP132 * 

65 

025 

Specifications 

000 = Single Pack Kit (Hand Solder) 

001 = Standard PC Board 

002 = Lead Free Tin Plated Board 

003 = Populated PC Board 

004 = X, Y, Theta Parts Placement ASCII File 

005 = Gerber File For Solder Paste Stencil 

006 = Immersion Silver Board (Lead Free) 

007 = Polyimide Board 

008 = OSP Copper Board Entek (Lead Free) 

009 = Ni Au PC Board 

010 = Kit Of 10 

025 = Kit Of 25 

050 = Kit Of 50 

100 = Kit Of 100 

Lead Free (RoHS) Pb-Free Kits: 

2XX = Tin (Sn) Board 

6XX = Silver (Ag) Board 

8XX = OSP (Cu) Board 

9XX = Gold (Ni-Au ENIG) Board 

XX = Quantity of Kits 

9616 = QFP160 * 

9618 = Rotational Test 

9621 = QFP208 

9625 = QFP256 

* = Not Shown in Catalog 

See www.topline.tv

FR-4 (Standard) 

Epoxy-glass FR-4 is standard for most kits. 

Most Boards are double sided. Tg = 140˚C. 

FR4 (High Temp) 

High Temp (Tg = 170˚C ~ 180˚C) is used for 

Lead Free boards. 

Polyimide (Optional) 

For high temperatures during assembly or burnin. 

Polymide Tg is 270˚C. 

BT (Optional) 

Bismaleimide Triazine available special order. 

Copper Thickness 

Usually 1.0 oz. of copper. 

Hot Air Solder Leveling (Sn63) 

Hot air solder leveling (HASL) during board 

fabrication gives boards a controlled plating 

flatness which assures coplanarity for fine pitch 

components. 

Liquid Photo Imageable Solder Mask 

Liquid photoimageable (LPI) soldermask with 

Sanwa Chemical SPSR-950. Taiyo PSR4000 

AUS5 is available special order. 

X,Y Theta: (Accessory) 

Component placement data for pick and place 

machines. Free download. 

Gerber Data: (Accessory) 

For solder paste stencil. Free download. 

Lead-Free (Optional) 

Available in 4 finishes: 

Sn100 - Immersion (White) Tin 

Au (ENIG) Ni - Immersion Gold 

Ag - Immersion Silver 

OSP - ENTEK 106 Copper 

General Kit 

Information 

66 

Global Fiducials 

A minimum of two global fiducials are located 

diagonally opposed as far apart as possible. 

Local Fiducials 

Used to locate the position of an individual. 

General 

Kits are supplied with enough components for 

one side of the board only. 

OSP (Optional) 

Organic Solder Preservative over bare copper 

such as ENTEK106 is available special order. 

RoHS 

RoHS Banned Substances 

Maximum Limit 

Substance (ppm ) 

Cadmium (Cd) 100 

Lead (Pb) 1000 

Mercury (Hg) 1000 

Hexavalent Chromium (Cr 6+) 1000 

Polybrominated Biphenyls (PBB) 1000 

Polybrominated Diphenyl Ethers (PBDE) 1000 

Pb-Free 

About RoHS: 

The European Union has adopted Directive 

2002/95/EC – the Restriction of Hazardous 

Substances (RoHS) in electrical and electronic 

equipment. This legislation bans the 

use of lead, mercury, cadmium, hexavalent 

chromium, polybrominated biphenyls (PBB) 

or polybrominated diphenyl ethers (PBDE) 

in electrical and electronic devices after 

July 1, 2006 with certain exemptions.

Lead Free Boards 

RoHS Compatible 

TopLine offers Lead Free boards with 4 popular finishes compatible with RoHS. 

Comparison of Lead Free Finishes 

Description Advantages Concerns 

Sn Immersion Tin • Low Cost • Potential Whisker 

(also known as White Tin) • Widely Accepted • Microscopic Voids 

• Re-workable 

• Good Flatness 

• Good Shelf Life 

Ag Immersion Silver • Low Cost • Shelf Life 

• Widely Accepted • Tarnishing 


• Excellent Flatness 

• Excellent Wetting 

OSP Organic Solderability • Low Cost • Shelf Life 

Cu Preservative • Widely Accepted • Degrades with Temperature 

Entek CU106 or CU56 • Re-workable • Handling Sensitivity 

• Excellent Flatness • Flex Sensitive 

Ni-Au Electroless Nickel • Widely Accepted • Added Cost 

Immersion Gold • Excellent Flatness • Difficulty with rework 

(Also known as ENIG) • Very Long Shelf Life • More brittle solder joints 

Comparison of Standard Finishes (with Pb) 

Description Advantages Concerns 

Sn/Pb Hot Air Solder Level • Low Cost • Flatness (Coplanarity) 

(also known as HASL) • Widely Accepted • Paste Misprints 


• Not RoHS Compatible 

• Good Shelf Life 

67

Chip Shooter Kit 

01005 and 0201 Chips 

With Daisy Chain 

Top Side of Board 

Put your machine to the test with TopLine’s 

new 01005/0201 kits. Double sided board 

has 2000 pads for 0201 chips on the front 

side and 3000 pads for 01005 chips on 

the back side. Components are supplied 

on 2mm pitch tape. Kit can be used for 

placement, soldering or epoxy dispenser 

testing. Many test points for continuity 

testing. 

Bottom Side of Board 

Pad Dimensions (mm) 

0.12 

01005 

0.23 

0.20 

0.152 

0201 

0.356 

0.305 

Actual Size: 4” x 5.5” (100 x 140mm) 

Features 

LPI Solder Mask 

FR4 Board .062” thick 

Double Sided 

Tooling Holes .125” 

Fiducial Marks 

68


01005 and 0201 Chips 

With Daisy Chain 

Kit Ordering Information 

Manual Assembly 

Machine Run Machine Run 

Component 

order Order Order Order Order 

number Number Number Number Number 

tape 980200 980203 980206 980210 980225 

pitch 1 Kit 3 Kits 6 Kits 10 Kits 25 Kits 

Board 

- 1 3 6 10 25 

01005 Chip 2mm 3,000 9,000 18,000 30,000 75,000 

0201 Chip 2mm 2,000 6,000 12,000 20,000 50,000 

Lead Free (Pb-Free) Option 

Spare 1 3 6 10 25 

Description Board Kit Kits Kits Kits Kits 

Lead Free 

Sn – Tin 980002 980200 980203 980206 980210 980225 

Au – Gold 980009 980900 980903 980906 980910 980925 

Free Solder Paste Gerber + Parts Placement download www.topline.tv/GerbersFree.cfm 

NOTE: 50 and 100 KITS ALSO AVAILABLE 

69

Flip Chip Kits 

FLIP CHIP KIT 

Laminate FR4 board for placement 

and daisy chain continuity testing 

after assembly. 

Each board has coupon sites for 

mounting 10 flip chips. 

Laminate board features 

multifunctional high temperature 

FR4 board (Tg = 170˚C) 

© 1998 TopLine Tel:1-714-898-3830 • Fax: 1-714-891-0321 

Plating Options: 

Ni-Au Standard 

Cu-OSP Available 

Board Thickness: 

.031” - 0.78mm FC317 

.062” - 1.57mm FC48~FC220 

Note 

Gerber Data is only available for 

laminate boards. 

Actual Size: 3.25” x 5.5” (83 x 140mm) 

70

Flip Chip Kits 



and 

Machine Run 

order order order order 

number number number number 

902000 903000 909000 911000 

Contents 1 Kit 1 Kit 1 Kit 1 Kit 

Laminate FR4 Board 1 1 1 1 

FC48 457µm 0 0 25 0 

FC88 204µm 36 0 0 0 

FC112 152µm 0 0 0 36 

FC317 254µm 0 36 0 0 


Description FC48 FC88 FC317 FC112 

Lead Free Kit 

Gold Board + SnAgCu Flip Chip 909900 902900 903900 911900 

Spare Gold Board 909001 902001 903001 911001 

Standard Kit 

Gold Board + SnPb Flip Chip 909000 902000 903000 911000 


71

® 

® 

® 

® 

® 

® 

® 

® 

® 

® 

BGA46 

0.75mm Test kit 

BGA TEST BOARD 

9 8 7 6 5 4 3 

10 

2 

1 

11 

12 

23 

22 

21 

20 

24 

19 

16 17 18 

13371T1A-# 

15 

14 

13 

12 

Test board for 0.75mm pitch BGA46 chip scale 

components. Each board has 10 coupons 

which allow continuity testing of individual 

components as well as series test of all 10 

components. 

13 

14 

15 

16 17 18 

19 

13371T1A-# 

24 

23 

22 

21 

20 

2 

1 


9 8 7 6 5 4 3 

11 

10 

Parts are supplied in trays. 

Pad 

Diameter 


9 8 7 6 5 4 3 

10 

2 

1 

11 

12 

24 

13 

23 

22 

14 

21 

23 

22 

21 

20 

24 

2 

1 

19 

16 17 18 

13371T1A-# 

15 

11 

12 

13 

14 

10 

Bump Site 

Fiducial 

.012” (.3mm) 

.040” (1.0mm) 

15 

16 17 18 

19 

13371T1A-# 

20 


9 8 7 6 5 4 3 

BGA46 TEST BOARD 


9 8 7 6 5 4 3 

10 

11 

12 

13 

14 

10 

11 

15 

16 17 18 

19 

13371T1A-# 

2 

1 

24 

23 

22 

21 

20 


9 8 7 6 5 4 3 

2 

1 

24 

23 

22 

21 

20 

2 

1 

16 17 18 19 

13371T1A-# 

15 


9 8 7 6 5 4 3 

24 

23 

22 

21 

20 

16 17 18 19 

13371T1A-# 

15 

11 

12 

13 

14 

10 

13 

14 

® 

12 

13 

14 

10 

11 

15 

16 17 18 

19 

13371T1A-# 

24 

23 

22 

21 

20 


9 8 7 6 5 4 3 

2 

1 

2 

1 


9 8 7 6 5 4 3 

24 

23 

22 

21 

20 

16 17 18 19 

13371T1A-# 

15 

11 

12 

10 

13 

14 

Features 

Electroless Nickel Immersion Gold Plated 


FR4 Board .03” (0.76mm) 

Single Sided, 1/2 oz. copper 


12 

12 

13 

14 

24 

23 

22 

21 

2 

1 

11 

10 

15 

16 17 18 

19 

13371T1A-# 

20 


9 8 7 6 5 4 3 

Actual Size 2.75” x 6.5” (70 x 165mm) 

72

BGA46 

0.75mm Test kit 


Component 


Machine Machine Run Run 


order Order Order Order Order Order order Order 

number Number Number Number Number Number Number 

921000 921010 921025 921050 

pitch 1 Kit 10 Kits 25 Kits 50 Kits 

Board 1 10 25 50 

Board 

BGA46 0.75mm 10 100 250 500 

TEST BOARD 

9 8 7 6 5 4 3 

10 

11 

12 

2 

1 

- 

Test 

H6 

H1 

T+ 

13 

14 

15 

16 17 18 

19 

24 

23 

22 

21 

20 

+ 

A6 

A1 

T- 

Single PCB Test Coupon 

After Mounting to Test Board 


Spare 1 10 25 50 100 


Lead Free 

Gold Board + SnAgCu BGA 921001 921900 921910 921925 921950 921999 

Standard 

Gold Board + SnPb BGA 921001 921000 921010 921025 921050 921100 


73

Universal CSP Kit 


CSP Universal Placement 

TopLine’s Universal CSP Kits provide 

pads capable of mounting 0.5mm, 

0.75mm and 0.8mm pitch without 

daisy chain. Includes fiducial marks 

for vision equipment. 

© 2000 TopLine PN963001 Rev A 

P = 0.5mm 8 x 8 P = 0.5mm 10 x 10 

P = 0.5mm 12 x 12 P = 0.5mm 14 x 14 

P = 0.75mm 6 x 8 

Uses soldermask defined pads. 

Pad Geometry 

Pad Ball 

Dia. Dia. Pitch 

0.26mm 0.3mm 0.5mm 

0.26mm 0.3mm 0.75mm 

0.38mm 0.46mm 0.8mm 

P = 0.8mm 7 x 7 P = 0.8mm 8 x 8 

www.TopLineDummy.com 

P = 0.8mm 9 x 9 P = 0.8mm 10 x 10 

P = 0.8mm 12 x 12 P = 0.8mm 14 x 14 

Features 


FR4 Board .062” 

Double Sided 

Tooling Holes 

Actual Size 4” x 5.5” (100 x 140mm) 

74

Universal CSP Kit 




Machine Run 

order order order 

number number Number 

963000 963010 963025 

Component pitch 1 Kit 10 Kits 25 Kits 

Board 1 10 25 

CSP 0.5mm 4 40 100 

CSP 0.75mm 4 40 100 

CSP 0.8mm 4 40 100 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 963002 963200 963210 963225 963250 963299 

Ag – Silver 963006 963600 963610 963625 963650 963699 

Cu – OSP 963008 963800 963810 963825 963850 963899 

Au – Gold 963009 963900 963910 963925 963950 963999 

Standard 

SnPb – HASL 963001 963000 963010 963025 963050 963100 


75

Universal BGA Kit 

0.8/1.0mm Pitch 

© 1999 TopLine P/N 981001 Rev A 

BGA Universal Placement 

1.0mm pitch 

Ø 19mil Ø 20mil Ø 21mil 

TopLine’s Universal BGA kits are 

convenient to use. Includes nondaisy 

chain BGA components 

for 1.0mm and 0.8mm pitch for 

placement and solder practice. 

Soldermask defined pads with 

varying aperatures from 16mil to 

24mil diameter. 

www.TopLineDummy.com 


0.8mm pitch 


Features 



Double Sided 

Tooling Holes 



76





Machine Run 

order order Order 

number number Number 

981000 981010 981025 


Board 981001 0.8/1.0mm 1 10 25 

BGA 1.0mm 4 40 100 

BGA 0.8mm 4 40 100 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 981002 981200 981210 981225 981250 981299 

Ag – Silver 981006 981600 981610 981625 981650 981699 

Cu – OSP 981008 981800 981810 981825 981850 981899 

Au – Gold 981009 981900 981910 981925 981950 981999 

Standard 

SnPb – HASL 981001 981000 981010 981025 981050 981100 


77

Fine Pitch BGA 

with Daisy Chain Test 

0.8mm - 1.0mm Pitch 

www.TopLine Dummy.com ©2000 TopLine PN998101 Rev A 

TM 

BGA672 & BGA100 

T+ T- T+ T- T+ T- 

A1 A1 A1 

U1 U2 U3 

A1 A1 A1 

U4 U5 U6 

BGA672 P=1.0mm 

T+ T- T+ T- T+ T- 

A1 

A1 

A1 

U7 U8 U9 

BGA100 P=0.8mm 

Actual Size 4” x 5.5 (100 x 140mm) 

TopLine makes practicing with Fine 

Pitch Ball Grid Array technology 

accessible and affordable. Each 

board supports BGAs with 0.8mm 

and 1.0mm grid patterns and daisy 

chain test points to verify proper 

placement. 

T+ T- 

1 2 3 4 5 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 

BGA672 

after assembly 

T+ T- 

1 2 3 4 5 6 7 8 9 10 

BGA100 

after assembly 

Features 



Single Sided 



78

Fine Pitch BGA 


0.8mm - 1.0mm Pitch 



Machine Run 

Component 



998102 998110 998125 998150 998100 


Board 

1 10 25 50 100 

BGA100 0.8mm 2 20 50 100 200 

BGA672 1.0mm 2 20 50 100 200 

Kits are supplied with only 2 BGAs for each daisy chain portion of PC Board. 

Soldermask Defined Pads 

Pitch Pad Dia. Ball Dia. 

0.8mm 0.38mm 0.46mm 

1.0mm 0.508mm 0.63mm 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 998107 998200 998210 998225 998250 998299 

Ag – Silver 998106 998600 998610 998625 998650 998699 

Cu – OSP 998108 998800 998810 998825 998850 998899 

Au – Gold 998109 998900 998910 998925 998950 998999 

Standard 

SnPb – HASL 998101 998102 998110 998125 998150 998100 


79

BGA256 

Daisy Chain Kit 

1.0mm Pitch 

TM 

BGA256 1.0mm Pitch 

Test board for 1.0mm pitch BGA256 

Full Array with daisy chain. 

Bottom side of board is for SBGA560 

(not shown). 

www.topline.tv P/N 976001 BOTTOM REV A 

T+ T- 

T+ T- 

T+ T- 

T+ T- 

T+ T- 

T+ T- 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

1 2 3 4 5 6 

Features 


Single Sided 



7 

8 

T+ 

T- 

9 10 11 12 13 14 15 16 

BGA256T1.0-DC169A 

After Mounting 


80

BGA256 


1.0mm Pitch 



Machine Run 

Component 

Board 



ball 976000 976010 976025 976050 976100 


1 10 25 50 100 

BGA256 1.0mm 6 60 150 300 600 

Kits are supplied with BGAs for one side of PC Board. 


Component Pitch Pad Dia. Ball Dia. 

BGA256 1.0mm 0.63mm 0.6mm 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 976002 976200 976210 976225 976250 976299 

Ag – Silver 976006 976600 976610 976625 976650 976699 

Cu – OSP 976008 976800 976810 976825 976850 976899 

Au – Gold 976009 976900 976910 976925 976950 976999 

Standard 

SnPb – HASL 976001 976002 976010 976025 976050 976100 


81

BGA1600/1936 


1.0mm Pitch 

TM 


Top Side 

Board 

T+ T- 

www.topline.tv P/N 974001 TOP REV A 

BGA1600 40 x 40 

T+ T- 

BGA1600 40 x 40 


www.topline.tv P/N 974001 BOTTOM REV A 

TM 

Bottom Side 

Board 


T+ T- 

BGA1936 44 x 44 

T+ T- 

BGA1936 44 x 44 

82

BGA1600/1936 


1.0mm Pitch 


Manual Manual Assembly Assembly 

OR 

Machine Run 

order Order Order Order Order Order 

number Number Number Number Number Number 

974000 974600 974900 974021 974621 974921 

1 Kit 1 Kit 1 Kit 1 Kit 1 Kit 1 Kit 

Contents Sn Pb Balls L lead Free SnAgCu Balls 

BGA1600 2 2 0 2 2 0 

BGA1936 2 0 2 2 0 2 

Board Sn-Tin 1 1 1 1 1 1 

Select the kit that matches your requirements 



BGA1600/1936 1.0mm 0.635mm 0.6mm 

T+ T- 

T+ T- 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

AT 

AU 

AV 

AW 

AY 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

AT 

AU 

AV 

AW 

AY 

BA 

BB 

BC 

BD 

BGA1600T1.0-DC409 


BGA1936T1.0-DC449 


Optional Accessories 

Parts Placement Data 

X,Y,Theta ASCII File 

Order Number 974004 

Solder Paste Artwork 

Gerber File 

Order Number 974005 

Board Order Number 

Sn - Tin 974002 

Ag - Silver 974006 

Cu - OSP 974008 

Au - Gold 974009 

83

Universal BGA 



TM 

Universal BGA 

Daisy Chain 

Top Side 

Board 

www.TopLineDummy.com ©1999 TopLine PN947001T Rev A 

BGA196-DC149 

1.0mm 

BGA256/272/292 

DC200/202/204 

1.27mm 

BGA352/388 

DC70/72 

1.27mm 


BGA196-DC149 

1.0mm 

BGA256/272/292 

DC200/202/204 

1.27mm 

BGA352/388 

DC70/72 

1.27mm 

www.TopLineDummy.com ©1999 TopLine PN947001B Rev A 

TM 

BGA225-DC15 

1.5mm 

Universal BGA 

Daisy Chain 

BGA352/388/420/456/480/516 

Universal 1.27mm 

DC70/72/85/90 

BGA225-DC15 

1.5mm 

3 3 2 2 1 1 4 4 5 5 6 6 3 3 2 2 1 1 4 4 5 5 6 6 

Bottom Side 

Board 

84

Universal BGA 





Machine Run 



947000 947010 947025 947050 947100 

Component 

Board 

1 10 25 50 100 

BGA196 1.0mm 2 20 50 100 200 


BGA256 1.27mm 2 20 50 100 200 

BGA352 1.27mm 2 20 50 100 200 

Kits are supplied with BGAs for top side of PC Board. 



BGA196 1.0mm 0.508mm 0.63mm 

others 1.27~1.5mm 0.61mm 0.75mm 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 947002 947200 947210 947225 947250 947299 

Ag – Silver 947006 947600 947610 947625 947650 947699 

Cu – OSP 947008 947800 947810 947825 947850 947899 

Au – Gold 947009 947900 947910 947925 947950 947999 

Standard 

SnPb – HASL 947001 947000 947010 947025 947050 947100 


85

BGA256/BGA272 

1.27mm Pitch 

TM 

BGA 1.27mm 

TopLine offers a low cost BGA kit 

for placement and rework practice. 

Popular BGA256/BGA272 without 

daisy chain. Use for hand solder 

or machine assembly 

A1 

A1 

BGA 256/272 BGA 256/272 

PN 937001 

©2003 TopLine 

Features 

FR4 Board 

Double Sided 

Tooling Holes 


LPI Soldermask 

Pad Site .030” dia. 

Actual Size 2.75” x 4.0” (70 x 100mm)) 

86

BGA256/BGA272 

1.27mm Pitch 


Manual Assembly or 

Machine Run 

937000 937010 937020 937040 937080 


Component ball Number Number Number Number Number 

Selection pitch 1 Kit 10 Kits 20 Kits 40 Kits 80 Kits 

Board 1 10 20 40 80 

BGA256/BGA272 1.27mm 2 20 40 80 160 


Spare 1 10 20 40 80 


Lead Free 

Sn – Tin 937002 937200 937210 937220 937240 937280 

Ag – Silver 937006 937600 937610 937620 937640 937680 

Cu – OSP 937008 937800 937810 937820 937840 937880 

Au – Gold 937009 937900 937910 937920 937940 937980 

Standard 

SnPb – HASL 937001 937000 937010 937020 937040 937080 


87

BGA169 & BGA225 


1.5mm Pitch 

PN967001 

 

T1+ T2+ T3+ T4+ T5+ 

T1- T2- T3- T4- T5- 


T1+ T2+ T3+ T4+ T5+ 

T1- T2- T3- T4- T5- 

TopLine makes practicing with Ball 

Grid Array technology accessible 

and affordable. Each board supports 

four BGAs with 1.5mm grid pattern 

and daisy chain test points to verify 

proper placement. 

Double sided board incorporates 

“two front side” design so only one 

solder paste stencil is needed. 

Fax 1-714-891-0321 © 1998 TopLine 

1 1 

BGA225 

1.5mm Pitch 

T1+ T2+ T3+ T4+ T5+ T6+ T7+ 

T1- 

BGA225 

1.5mm Pitch 

T1+ T2+ T3+ T4+ T5+ T6+ T7+ 

T2- T3- T4- T5- T6- T7- 

T1- 

T2- T3- T4- T5- T6- T7- 

1 

Ph 1-714-898-3830 

1 1 

BGA169 

1.5mm Pitch 

BGA169 

1.5mm Pitch 

Features 



Double Sided 




88

BGA169 & BGA225 


1.5mm Pitch 


Component 

Manual 

Assembly 

Assembly 

Machine Run 



967000 967012 967025 967050 967100 


Board 

1 12 25 50 100 

BGA 169 1.5mm 2 25 50 100 200 

BGA 225 1.5mm 2 25 50 100 200 

1+ 2+ 3+ 4+ 5+ 6+ 7+ 

1- 2- 3- 4- 5- 6- 7- 

1+ 2+ 3+ 4+ 5+ 

1- 2- 3- 4- 5- 

A 

1 15 

A 

15 

1 

A 

N 

N 

A 

1 

1 

R 

R 

BGA169 

After Mounting To Test Board 

BGA225 



Spare 1 12 25 50 100 


Lead Free 

Sn – Tin 967002 967200 967212 967225 967250 967299 

Ag – Silver 967006 967600 967612 967625 967650 967699 

Cu – OSP 967008 967800 967812 967825 967850 967899 

Au – Gold 967009 967900 967912 967925 967950 967999 

Standard 

SnPb – HASL 967001 967000 967012 967025 967050 967100 


89


1.27mm & 1.5mm Pitch 

www.TopLineDummy.com ©1999 TopLine PN946001T Rev A 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

TM 

8 

BGA Universal Placement 


1.27mm Pitch 

7 

6 

5 

4 

3 

2 

1.5mm Pitch 


1 

26 

25 

24 

23 22 

21 20 

19 18 

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

8 7 6 5 4 3 2 1 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

A 

A 

B 

B 

B 

C 

C 

C 

D 

D 

D 

E 

E 

E 

F 

F 

F 

G 

G 

G 

H 

H 

H 

J 

J 

J 

K 

K 

K 

L 

L 

L 

M 

M 

M 

N 

N 

N 

P 

P 

P 

R 

R 

R 

TopLine’s Universal BGA Kits are 

economical. Includes non-daisychain 

BGA components. Kit has 

1.27mm and 1.5mm pitch for 

placement and solder practice. 

Pad Geometries 

Pad Ball 

Dia. Dia. Pitch 

23mil 30mil 1.5 mm 

23mil 30mil 1.27mm 

Top Side- 

Soldermask defined pads 

Bottom Side- 

Etched defined pads 

Features 



Double Sided 

Tooling Holes 

90


1.27mm & 1.5mm Pitch 



Machine Run 

order O order Order 

number N number Number 

946000 946010 946025 


Board 946001 1.27/1.5mm 1 10 25 

BGA169 or BGA225 1.5mm 4 40 100 

BGA256 or BGA352 1.27mm 4 40 100 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 946002 946200 946210 946225 946250 946299 

Ag – Silver 946006 946600 946610 946625 946650 946699 

Cu – OSP 946008 946800 946810 946825 946850 946899 

Au – Gold 946009 946900 946910 946925 946950 946999 

Standard 

SnPb – HASL 946001 946000 946010 946025 946050 946100 


91

LBGA1225 


1.27mm Pitch 

TM 

LBGA1225 

Experiment with large size Ball 

Grid Arrays. Kit comes consits 

of PC Board with daisy chain and 

matching 45mm square LBGA 

Component with 1225 solder balls. 

www.TopLineDummy.com ©2000 TopLine PN958001 Rev B 

A1 

A1 

T+ T- 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

T+ T- 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

Top Side: 

35 x 35 matrix LBGA1225 

Bottom Side: LBGA1089 

33 x 33 matrix: Not Shown 

T+ T- 

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

P 

R 

T 

U 

V 

W 

Y 

AA 

AB 

AC 

AD 

AE 

AF 

AG 

AH 

AJ 

AK 

AL 

AM 

AN 

AP 

AR 

Soldermask defined 

pad diameter 0.6mm 

Features 

LBGA1225-DC359 




Double Sided 

Tooling Holes 



92

LBGA1225 


1.27mm Pitch 



Machine Run 

order O order order 

number N number Number 

958000 958012 958024 


Board 958001 1 12 24 

LBGA1225 1.27mm 2 24 48 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 958002 958200 958210 958225 958250 958299 

Ag – Silver 958007 958600 958610 958625 958650 958699 

Cu – OSP 958008 958800 958810 958825 958850 958899 

Au – Gold 958009 958900 958910 958925 958950 958999 

Standard 

SnPb – HASL 958001 958000 958010 958025 958050 958100 


93

Ceramic CBGA Kit 

1.27mm Pitch 

TM 

Ceramic CBGA 

TopLine’s Ceramic Ball Grid Array. 

Kit includes one PC board and 

6-different CBGAs. 

New Rev “B” design is daisy chain, 

double sided with same land 

patterns on both sides of board. 

www.TopLineDummy.com ©1999 TopLine PN951001T Rev B 

A1 

CBGA121 

A1 

CBGA256 

T+ T- 

A1 

CBGA361 

A1 

A1 

A1 

CBGA196 

CBGA304 

CBGA625 

Features 



Double Sided 




94

Ceramic CBGA Kit 

1.27mm Pitch 


Manual Manual Assembly Assembly 

Machine Machine Run Run 

Component 

Board 

order Order Order Order Order Order Order Order 

number Number Number Number Number Number Number 

951000 951010 951012 951025 


1 10 12 25 

CBGA121 11 x 11 1.27mm 1 10 12 25 

CBGA196 14 x 14 1.27mm 1 10 12 25 

CBGA256 16 x 16 1.27mm 1 10 12 25 

CBGA304 21 x 25 1.27mm 1 10 12 25 

CBGA361 19 x 19 1.27mm 1 10 12 25 

CBGA625 25 x 25 1.27mm 1 10 12 25 


Spare 1 10 12 25 

Description Board Kit Kits Kits Kits 

Lead Free 

Sn – Tin 951002 951200 951210 951212 951225 

Ag – Silver 951006 951600 951610 951612 951625 

Cu – OSP 951008 951800 951810 951812 951825 

Au – Gold 951009 951900 951910 951912 951925 

Standard 

SnPb – HASL 951001 951000 951010 951012 951025 


95

Lead Free Kit 

Multicomponents 

TM 

Practice Lead free assembly using 

fine-pitch components. 

www.TopLineDummy.com ©1999 TopLine PN986001 Rev A 

BGA196-DC149 

1.0mm 

BGA256/272/292 

DC200/202/204 

1.27mm 

BGA225 

1.5mm 

0402 

0603 

0805 

1206 

QFP208 .5mm 

PC Board Features 



Double Sided 



Assembly Methods 

Machine Run 

Hand Solder 

Rework 


96

Lead Free Kit 

Multicomponents 



Machine Run 

Component 



986000 986010 986024 986050 986100 


Board 

1 10 24 50 100 

BGA196 1.0mm 1 10 24 50 100 

BGA225 1.5mm 1 10 24 50 100 

BGA256 1.27mm 1 10 24 50 100 

QFP208 0.5mm 1 10 24 50 100 

0402 10 100 250 500 1000 

0603 10 100 250 500 1000 

0805 10 100 250 500 1000 

1206 10 100 250 500 1000 


Spare 1 10 24 50 100 


Lead Free 

Sn – Tin 986002 986200 986210 986224 986250 986299 

Ag – Silver 986006 986600 986610 986624 986650 986699 

Cu – OSP 986008 986800 986810 986824 986850 986899 

Au – Gold 986009 986900 986910 986924 986950 986999 


97

Large 

Machine Run Kit 

Actual Size: 9” x 7.875” (228.6mm x 200mm) 

Features 

Single Sided 

Black LPI Soldermask 

Very High Density 

0201 Chips 

98

Large 

Machine Run Kit 


Machine Run 

Board 10 25 50 100 

LQFP168 6 0.3mm 0 0 0 0 

QFP256 1 0.4mm 10 24 48 96 

TQFP48 2 0.5mm 25 50 100 200 

TQFP44 1 0.8mm 10 25 50 100 

LQFP80 4 0.4mm 40 100 200 400 

TSOP32 12 0.5mm 120 300 600 1,200 

FLIP CHIP 48 4 457µm 0 0 0 0 

µBGA46 4 0.75mm 40 100 200 400 

BGA169 4 1.5mm 40 100 180 360 

PLCC44 1 1.27mm 10 25 50 100 

PLCC84 1 1.27mm 10 25 50 100 

SOL28 2 1.27mm 20 50 100 200 

SSOP20 4 0.65mm 40 100 200 400 

SOT323 87 3,000 3,000 3,000 6,000 

SOT23 39 3,000 3,000 3,000 6,000 

SOT89 8 100 200 400 800 

0201 600 5,000 15,000 30,000 60,000 

0402 700 10,000 20,000 40,000 80,000 

0603 500 5,000 15,000 25,000 50,000 

0805 300 5,000 10,000 15,000 30,000 

1206 200 5,000 10,000 15,000 20,000 

99 

order Order Order Order 

number Number Number Number 

per 919010 919025 919050 919100 

Component Board Pitch 10 Kit 25 Kits 50 Kits 100 Kits 


Spare 10 25 50 100 

Description Board Kits Kits Kits Kits 

Lead Free 

Sn – Tin 919002 919210 919225 919250 919299 

Ag – Silver 919006 919610 919625 919650 919699 

Cu – OSP 919008 919810 919825 919850 919899 

Au – Gold 919009 919910 919925 919950 919999 

Standard 

SnPb – HASL 919001 919010 919025 919050 919100 

Free Solder Paste Gerber + Parts Placement download www.topline.tv/GerbersFree.cfm

Challenger 2 Kit 

Intermediate SMD 

PN928001 

Fax 1-714-891-0321 © 1998 TopLine 

1 

QFP44 - .8mm 

5020 Crystal 

SOL 20 

Challenger 2 

A 

B 

0805 

1206 

MINI MELF 

Tantalum 

T1+ T2+ T3+ T4+ T5+ T6+ T7+ 

T1- 

T2- T3- T4- T5- T6- T7- 

BGA169 

C 

D 

SOT323 

1812 

TSOP32-T1 

1210 

Inductor 

1812 

SO 14 

MELF 

1210 

0603 

SOM 16 

AL CAP 

0402 

PLCC 20 

SOT 23 

SOT 

89 

 

6.3mm 4mm 

SOT Pot. 

223 D PAK 

The new Challenger 2 Kit gives 

you a wide selection of 33 different 

SMD packages. Includes BGA 

with daisy chain continuity test, 

fine-pitch components and many 

discrete components. Double-sided 

board incorporates “two-front-side” 

design so only one solder paste 

stencil is needed. 

Put your machine to the test with the 

new Challenger 2 Kit. 

1+ 2+ 3+ 4+ 5+ 6+ 7+ 

1- 2- 3- 4- 5- 6- 7- 

1 

A 

BGA169 After Mounting 

N 

N 

Ph 1-714-898-3830 

PLCC 68 

QFP100 

.65mm 

QFP208 .5mm 

Features 



Double Sided 




100

Challenger 2 Kit 

Intermediate SMD 



Machine Run 



928000 928010 928025 928050 928100 

Component 


Board 1 10 25 50 100 

TSOP32 0.5mm 1 10 25 50 100 

QFP208 0.5mm 1 10 25 50 100 

QFP100 0.65mm 1 10 25 50 100 

QFP44 0.8mm 1 10 25 50 100 

PLCC20 1.27mm 1 10 25 50 100 

PLCC68 1.27mm 1 10 25 50 100 

SO14 1.27mm 1 10 25 50 100 

SOM16 1.27mm 1 10 25 50 100 

SOL20 1.27mm 1 10 25 50 100 

BGA169 1.5mm 1 10 25 50 100 

SOT23 3 30 75 150 400 

SOT89 2 20 50 100 200 

SOT223 1 10 25 50 100 

SOT323 2 20 50 100 200 

DPAK 1 10 25 100 100 

Crystal 1 10 25 100 100 

Tantalum A & B 1 ea. 10 ea. 25 ea. 50 ea. 100 ea. 

Tantalum C & D 1 ea. 10 ea. 25 ea. 100 ea. 100 ea. 

Aluminum Cap 4mm & 6.3mm 1 ea. 10 ea. 25 ea. 100 ea. 100 ea. 

0402 & 0603 Chip 10 ea. 100 ea. 250 ea. 500 ea. 1000 ea. 

0805 & 1206 Chip 10 ea. 100 150 500 1000 

1206 mini MELF 6 60 150 500 500 

1210 Chip 6 60 25 50 250 

1210 Inductor 1 10 25 50 100 

1812 Chip 1 10 25 50 100 

1812 Inductor 1 10 25 50 100 

Potentiometer 1 10 25 50 100 

2308 MELF 2 20 50 100 200 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 928002 928200 928210 928225 928250 928299 

Ag – Silver 928006 928600 928610 928625 928650 928699 

Cu – OSP 928008 928800 928810 928825 928850 928899 

Au – Gold 928009 928900 928910 928925 928950 928999 

Standard 

SnPb – HASL 928001 928000 928010 928025 928050 928100 


101

Daisy Chain 

BQFP100 JEDEC 

QFP208 

BQFP100 JEDEC 

QFP208 

MATRIX 11 x 11 

.020 WAVE TEST 


SO16 

TSOP32 

SIR TEST SOL20 

BGA169 




SO16 

TSOP32 


BGA169 

SO16 

PLCC68 

QFP100 EIAJ 

TM 

DPAK (TO252) 

TM 

SO16 

PLCC68 

QFP100 EIAJ 

DPAK (TO252) 

BQFP100 JEDEC 

QFP208 

BQFP100 JEDEC 

QFP208 




SO16 

TSOP32 


BGA169 




SO16 

TSOP32 


BGA169 

SO16 

PLCC68 

QFP100 EIAJ 

TM 

DPAK (TO252) 

TM 

SO16 

PLCC68 

QFP100 EIAJ 

DPAK (TO252) 

SABER 4-Board Array 

Advanced Mixed 

Technology 

SMTA SABER 

IPC-SM-782A Version 

BQFP100 JEDEC 

QFP208 




SCREEN TEST 

SO16 

PLCC68 

TM 

Screen 

Test 

0402/1210 

Chips & SOT's 

The SABER Board has helped 

many SMTA members to define and 

refine their surface mount assembly 

processes. The SABER Board 

is used by mainstream surface 

mount manufacturers throughout 

the industry to test capabilities such 

as component placement accuracy, 

cleanliness (SIR-surface insulation 

resistance), solder paste screening, 

solder joint integrity, wave soldering 

and component placement speed 

(chip shooting). The SABER Board is 

supplied as a snap-apart, four board 

panelized array. 

Actual Panel Size: 

8” x 11” (200 x 280mm) 

SO16 

SMTA SABER 


SMTA SABER 


TSOP32 

SCREEN TEST 

SCREEN TEST 

SIR TEST 

SOL20 

SIR Test* 

BGA169 

QFP100 EIAJ 

SMTA SABER 


SMTA SABER 


DPAK (TO252) 

SCREEN TEST 

SCREEN TEST 

QFP208 

1+ 1- 

2+ 2- 

3+ 3- 

4+ 4- 

13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

BGA169 

102 

D 

E 

7- 7+ 

F 

G 

H 

J 

K 

L 6- 6+ 

M 

N 

5- 5+ 

7+ 

7- 

6+ 6- 

5+ 5- 

13 12 11 10 9 8 7 6 5 4 3 2 1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

1- 1+ 

2- 2+ 

3- 3+ 

4- 4+ 

BGA After Mounting 

(Top Side) 

Features 

LPI Solder 


Double Sided 



4-Board Routed Array

Saber 4-Board Array 

Advanced Mixed Technology 


*BQFP100 only in SnPb Kit 


Machine Run 



950000 950012 950024 950048 950096 

Component pitch 4 Kits 12 Kits 24 Kits 48 Kits 96 Kits 

SABER Array 1 Array 3 Arrays 6 Arrays 12 Arrays 24 Arrays 

QFP208 0.5mm 4 12 25 50 100 

TSOP32 0.5mm 4 12 25 50 100 

QFP100 0.65mm 4 12 25 50 100 

BQFP100* 25mil 4 12 25 50 100 

BGA169 1.5mm 4 12 25 50 100 

PLCC68 1.27mm 4 12 25 50 100 

SO16 1.27mm 12 50 100 200 300 

SOL20 1.27mm 4 12 50 50 100 

DPAK 1.27mm 10 25 50 100 200 

SOT23 1.27mm 100 300 500 1000 3000 

0402/0603/0805/1206 Chip - 100 500 1000 2000 5000 

1210 Chip - 100 200 500 1000 1000 

DIP14 ~ 20 100mil 8 25 50 100 200 


Spare 1 10/12 24/25 48/50 96/100 


4-Board Array 

Sn – Tin 950002 950200 950212 950224 950248 950296 

Ag – Silver 950006 950600 950612 950624 950648 950696 

Cu – OSP 950008 950800 950812 950824 950848 950896 

Au – Gold 950009 950900 950912 950924 950948 950996 

Standard 

SnPb – HASL 950001 950000 950012 950024 950048 950196 

Single (1-up) 

Sn – Tin 950013 950201 950210 950225 950250 950299 

Ag – Silver 950016 950601 950610 950625 950650 950699 

Cu – OSP 950018 950801 950810 950825 950850 950899 

Au – Gold 950007 950901 950910 950925 950950 950999 

Standard 

SnPb – HASL 950003 950011 950010 950025 950050 950100 

103 

Free Solder Paste Gerber + Parts Placement download www.topline.tv/GerbersFree.cfm

Stencil Evaluation Kit 

 


DAISY CHAIN 

T1+ T2+ T3+ T4+ T5+ 

We supply the board and 

components. You provide the 

stencil. All kits include a ball grid 

array with daisy chain test and 

0.4mm pitch QFP256. 

PN935001 

T1- T2- T3- T4- T5- 

Fax 1-714-891-0321 © 1998 TopLine 

QFP 256 

.4mm 

TSOP32 

.5mm 

MINI MELF 


QFP100 .65mm 

1+ 2+ 3+ 4+ 5+ 

1- 2- 3- 4- 5- 

1 15 

A 

R 

BGA225 


QFP 208 

.5mm 

Ph 1-714-898-3830 

0402 

SCREEN TEST 

PATTERN 

SOL 20 

0603 

D PAK 

PLCC 44 

FEATURES 



Double Sided 




104




Machine Run 

Component 



936000 936010 936025 936050 936100 

pitch 1 Kit 10 Kit 25 Kits 50 Kits 100 Kits 

Board 

1 10 25 50 100 

LQFP168 0.3mm 0 0 0 0 0 

QFP256 0.4mm 1 10 25 50 100 

QFP208 0.5mm 1 10 25 50 100 

TSOP32 0.5mm 1 10 25 50 100 

QFP100 0.65mm 1 10 25 50 100 

BGA225 1.5mm 1 10 25 50 100 

PLCC44 50mil 1 10 25 50 100 

SOL20 50mil 1 10 25 50 100 

DPAK 1 10 25 50 100 

0402 chip 10 100 250 500 1000 

0603 chip 10 100 250 500 1000 

mini Melf 6 60 150 300 600 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 935002 936200 936210 936225 936250 936299 

Ag – Silver 935006 936600 936610 936625 936650 936699 

Cu – OSP 935008 936800 936810 936825 936850 936899 

Au – Gold 935009 936900 936910 936925 936950 936999 

Standard 

SnPb – HASL 935001 936000 936010 936025 936050 936100 


105

Rework 1 

Practice Kit 

Rework Practice 

This Rework Practice Kit is designed 

for all skill levels. Includes fine-pitch 

components often found in real 

world rework situations. 

PN 965001 

SO 14 

Fax 1-714-891-0321 © 1997 TopLine 

BQFP 132 

0805 (2012) 

SO 14 

TSOP 32 

SOM 16 

PLCC 68 

1206 (3216) 

QFP100 

Ph 1-714-898-3830 

QFP 208 

PLCC 44 

PLCC 44 

SOL 20 

PLCC 20 

SOT 23 

PLCC 20 

Features 



Double Sided 




106

Rework 1 

Practice Kit 



Machine Run 

Component 



965000 965010 965026 965050 965100 


Board 

1 10 25 50 100 

QFP208 0.5mm 1 10 25 50 100 

TSOP32 0.5mm 1 10 25 50 100 

QFP100 0.65mm 1 10 25 50 100 

BQFP132* 25mils 1 10 25 50 100 

PLCC20 50mils 2 25 50 100 200 

PLCC44 50 mils 2 25 50 100 200 

PLCC68 50mils 1 10 25 50 100 

SO14 50mils 2 25 50 100 200 

SOM16 50mils 2 25 50 100 200 

SOL20 50mils 2 25 50 100 200 

SOT23 10 100 500 500 500 

0805 Chip 10 100 500 500 1000 

1206 Chip 10 100 250 500 1000 

*BQFP132 only in SnPb Kits 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 965002 965200 965210 965225 965250 965299 

Ag – Silver 965006 965600 965610 965625 965650 965699 

Cu – OSP 965008 965800 965810 965825 965850 965899 

Au – Gold 965009 965900 965910 965925 965950 965999 

Standard 

SnPb – HASL 965001 965000 965010 965025 965050 965100 


107

Rework 2 

Practice Kit 

Surface Mount Kit 

PLCC28 

PLCC28 SOL20 

PLCC68 SOT89 SOT89 PLCC68 

PLCC20 PLCC20 

SOT23 0402 0402 SOT23 

1206 

0805 

0805 Tant B 

2225 Tant D 

SO14 

QFP80 SOL20 

QFP80 

© 1998 TopLine Tel: 1-714-898-3830 • Fax: 1-714-891-0321 PN#944501 

Topline provides this kit for rework 

practice. Kit contains popular 

components including fine pitch 

Quad Flat Pack. For manual 

assembly only. 

Features 



Double Sided 




108

Rework 2 

Practice Kit 



Machine Run 



944500 944510 944525 944550 

Component pitch 1 Kit 10 Kits 25 Kits 50 Kits 

Board 1 10 25 50 

QFP80 0.8mm 2 20 50 100 

PLCC20 1.27mm 2 20 50 100 

PLCC28 1.27mm 2 20 50 100 

PLCC68 1.27mm 2 20 50 100 

SO14 1.27mm 6 60 150 300 

SOL20 1.27mm 6 60 150 300 

0402 Chips 6 60 150 300 

0805 Chips 8 80 200 400 

1206 Chips 12 120 300 600 

2225 Cap 2 20 50 100 

Tantalum 3528 B-Case 2 20 50 100 

Tantalum 7343 D-Case 2 20 50 100 

SOT23 4 40 100 400 

SOT89 4 40 100 200 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 944502 944200 944210 944225 944250 944299 

Ag – Silver 944506 944600 944610 944625 944650 944699 

Cu – OSP 944508 944800 944810 944825 944850 944899 

Au – Gold 944509 944900 944910 944925 944950 944999 

Standard 

SnPb – HASL 944501 944500 944510 944525 944550 944599 


109

Rework 3 

Practice Kit 

QFP 100 

QFP 208 

QFP 100 

This Rework Practice Kit is available 

populated and unassembled. Includes 

fine-pitch components often found in real 

work situations. 

1210 

TSOP 

32 

SOT23 

SOL20 

SOJ28 

SOLJ20/26 

1210 

PLCC20 

PLCC68 

PLCC68 

© ©2000 TopLine PN 978001 977001 Rev B 

0805 

TSOP 

32 

Features 

LPI Soldermask 


Single Sided 

Tooling Holes 



110

Rework 3 

Practice Kit 



Machine Run 



978000 978010 978025 978050 978100 

Component 

Board 

1 10 25 50 100 

QFP208 0.5mm 1 10 25 50 100 


QFP100 0.65mm 2 20 50 100 200 

TSOP32 0.5mm 2 20 50 100 200 

PLCC20 50mil 2 20 50 100 200 

PLCC68 50mil 2 20 50 100 200 

SOL20 50mil 4 40 100 200 400 

SOJ28 50mil 2 20 50 100 200 

*SOJ20/26 50mil 2 20 50 100 200 

SOT23 4 50 100 200 400 

0805 4 50 100 200 400 

1210 8 100 200 400 800 

*SOJ20/26 only in SnPb Kits 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 978002 978200 978210 978225 978250 978299 

Ag – Silver 978006 978600 978610 978625 978650 978699 

Cu – OSP 978008 978800 978810 978825 978850 978899 

Au – Gold 978009 978900 978910 978925 978950 978999 

Standard 

SnPb – HASL 978001 978000 978010 978025 978050 978100 


111

SMT Introductory Kit 

Surface Mount Technology 

The SMD Introductory Kit includes 

a wide range of popular easy-tohandle 

components. 

SOJ24 

FLAT CHIPS 

Features 



Double Sided 



Actual Size: 4” x 5.5” (100mm x 140mm) 

Rev B 

112

SMT Introductory Kit 

Surface Mount Technology 



Machine Run 

Component 



925000 925010 925025 925050 925100 


Board 1 10 25 50 100 

Board 

QFP100 0.65mm 1 10 25 50 100 

SO14 50mils 1 10 25 50 100 

SOM16 50mils 1 10 25 50 100 

SOL20 50mils 1 10 25 50 100 

PLCC20 50mils 1 10 25 50 100 

PLCC68 50mils 1 10 25 50 100 

SOT23 3 30 75 250 300 

SOT89 2 20 50 100 200 

SOT143 1 10 25 50 100 

SOT223 1 10 25 50 100 

DPAK 1 10 25 50 100 

Tantalum-A 1 10 25 50 100 

Tantalum-B 1 10 25 50 100 

Tantalum-C 1 10 25 50 100 

Tantalum-D 1 10 25 50 100 

MELF 2 20 50 100 200 

mini-MELF 6 60 300 300 600 


0805 Chip 10 100 250 500 1000 

1206 Chip 10 100 250 500 1000 

1210 Chip 10 100 250 500 1000 

1812 Chip 2 20 50 100 200 

2225 Chip 1 10 25 50 100 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 925002 925200 925210 925225 925250 925299 

Ag – Silver 925006 925600 925610 925625 925650 925699 

Cu – OSP 925008 925800 925810 925825 925850 925899 

Au – Gold 925009 925900 925910 925925 925950 925999 

Standard 

SnPb – HASL 925001 925000 925010 925025 925050 925100 


113

Practical 

Mixed Technology 

Kit 

TM 

A low-cost, mixed technology kit for 

rework and solder practice. Includes 

simple-to-handle components. 

Excellent for beginners. Can also be 

used for medium speed assembly. 

Features 



Double Sided 



Plated Throughholes 


114

Practical 

Mixed Technology Kit 



Machine Run 

Component 



926000 926010 926025 926050 926100 


Board 

1 10 25 50 100 

QFP100 0.65mm 1 10 25 50 100 

QFP44 0.80mm 1 10 25 50 100 

QFP64 1.00mm 1 10 25 50 100 

PLCC20 50mils 2 25 50 100 200 

PLCC44 50mils 2 25 50 100 200 

PLCC68 50mils 2 25 50 100 200 

SOM16 50mils 2 25 50 100 200 

DIP14~18 100mils 1 10 25 50 100 

SOT23 10 50 500 500 500 

0805 Chip 10 100 500 500 1000 

1206 Chip 10 100 250 500 1000 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 926002 926200 926210 926225 926250 926299 

Ag – Silver 926006 926600 926610 926625 926650 926699 

Cu – OSP 926008 926800 926810 926825 926850 926899 

Au – Gold 926009 926900 926910 926925 926950 926999 

Standard 

SnPb – HASL 926001 926000 926010 926025 926050 925100 


115

Mixed Technology 1 Kit 

Mixed Technology Kit 

Experiment with mixed technology. 

Combines easy-to-handle SMD 

components plus plenty of 

throughhole components on100mil 

grid. 

PN 969601 

Fax 1-714-891-0321 © 1998 TopLine 

PLCC 68 

PLCC 20 

A 

B 

Tantalum 

MINI MELF 

C 

D 

MELF 

SOT 23 SOT 89 SOT 143 SOT 223 

0805 (2012) 

1206 (3216) 

QFP100 

1210 (3225) 

.65mm 

Pot. 

1812 

(4532) 

SOL 20 

SOM 16 

SO 14 

D PAK 

2225 

(5664) 

Ph 1-714-898-3830 

Plated Through holes 

Features 



Double Sided 





116

Mixed Technology 1 

Kit 



Machine Run 

Component 



969600 969610 969625 969650 969699 


Board 1 10 25 50 100 

QFP100 Board 

0.65mm 1 10 25 50 100 

SO14 50mils 1 10 25 50 100 

SOM16 50mils 1 10 25 50 100 

SOL20 50mils 1 10 25 50 100 

PLCC20 50mils 1 10 25 50 100 

PLCC68 50mils 1 10 25 50 100 

DIP14~20 100mils 4 40 100 200 400 

SOT23 & SOT89 3 30 75 150 300 

SOT143 1 10 25 50 100 

SOT223 1 10 25 50 100 

DPAK 1 10 25 50 100 

Tantalum-A 1 10 25 50 100 

Tantalum-B 1 10 25 50 100 

Tantalum-C 1 10 25 50 100 

Tantalum-D 1 10 25 50 100 

MELF 2 20 50 100 200 

mini-MELF 6 60 150 300 600 


0805 Chip 10 100 250 500 1000 

1206 Chip 10 100 250 500 1000 

1210 Chip 10 100 250 500 1000 

1812 Chip 2 20 100 100 200 

2225 Chip 1 10 25 50 100 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 969602 969200 969210 969225 969250 969299 

Ag – Silver 969606 969700 969710 969725 969750 969799 

Cu – OSP 969608 969800 969810 969825 969850 969899 

Au – Gold 969609 969900 969910 969925 969950 969999 

Standard 

SnPb – HASL 969601 969600 969610 969625 969650 969699 


117


Mixed Technology 2 

The mixed technology 2 kit provides 

plenty of plated throughholes as 

well as BGA and an easy-to-solder 

QFP. 

PN 914001 

T+ 

DAISY CHAIN 

Fax 1-714-891-0321 © 1998 TopLine 

QFP80 

AXIAL RESISTORS 

DIP16 

RADIAL CAPACITORS 

DIP16 

T- 

BGA169 

SOT23 

SO14 

T+ T- 

1 

A 

B 

C 

D 

E 

F 

G 

H 

J 

K 

L 

M 

N 

2 

3 

4 

5 

6 

7 

8 

9 10111213 

Ph 1-714-898-3830 

DIODES 

SO8 

SO8 

PLCC20 

1210 

0805 

0603 

PLCC20 

Features 

BGA169 



FR4 Board .062” (standard) 

Single Sided 





118




Machine Run 

Component 



914000 914010 914025 914050 914100 


Board 

1 10 25 50 100 

QFP80 0.8mm 1 10 25 50 100 

BGA169 1.5mm 1 10 25 50 100 

SO8 1.27mm 2 25 50 100 200 

SO14 1.27mm 2 25 50 100 200 

PLCC20 50mil 2 25 50 100 200 

SOT23 4 40 100 200 400 

1210 Chip 6 60 150 300 600 

0805 Chip 10 100 250 500 1000 

0603 Chip 10 100 250 500 1000 

Throughhole Components 

DIP16 100mil 3 30 75 150 300 

1/4W Resistor .50” 6 60 150 300 600 

DO35 Diodes .50” 4 40 200 200 400 

Ceramic Cap .20” 5 50 250 250 500 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 914002 914200 914210 914225 914250 914299 

Ag – Silver 914006 914600 914610 914625 914650 914699 

Cu – OSP 914008 914800 914810 914825 914850 914899 

Au – Gold 914009 914900 914910 914925 914950 914999 

Standard 

SnPb – HASL 914001 914000 914010 914025 914050 914100 


119


0201 and 0402 Chips 

Rev B with Daisy Chain 

Top Side of Board 

www.TopLineDummy.com ©2009 TopLine PN949001T Rev B 

TM 

0201 Chips 

1 5 10 15 20 25 30 

1 

www.TopLineDummy.com ©2009 TopLine PN949001B Rev B 

TM 

5 

10 

15 

20 

25 

30 

35 

40 

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 

45 

1 

2 

3 

50 

4 

5 

55 

6 

7 

8 

60 

9 

10 

65 

11 

12 

13 

70 

14 

15 

16 

17 

18 

19 

20 

21 

22 

23 

24 

25 

26 

27 

28 

29 

30 

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 


120 

Put your machine to the test with TopLine’s 

new 0201/0402 kits. Double sided board 

has 2000 pads for ultra-miniature 0201 

chips on the front side and 1000 pads for 

0402 chips on the back side. Components 

are supplied on 2mm pitch tape. Kit can 

be used for placement, soldering or epoxy 

dispenser testing. Rev B has test points for 

continuity testing. 

Bottom Side of Board 

0402 Chips 


Rev-B 

Features 

0.20 

0201 

0.23 

0402 


FR4 Board .062” thick 

Double Sided 



0.430 

0.660 

0.46 

0.660



Zero Ohm Daisy Chain 



Machine Run Machine Run 

Component 



tape 949000 949010 949025 949050 949100 


Board 

- 1 10 25 50 100 

0201 Chip 2mm 2000 15,000 45,000 100,000 200,000 

0402 Chip 2mm 1000 10,000 25,000 50,000 100,000 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 949002 949200 949210 949225 949250 949299 

Ag – Silver 949006 949600 949610 949625 949650 949699 

Cu – OSP 949008 949800 949810 949825 949850 949899 

Au – Gold 949009 949900 949910 949925 949950 949999 

Standard 

SnPb – HASL 949001 949000 949010 949025 949050 949100 


121




TopLine has thousands of zer-ohm 

0402 and 0603 resistors for your 

machine to place. 0402 chips are 

supplied on tape with 2mm pitch and 

the 0603 chips with 4mm pitch tape. 

Double sided board has 460 pads 

for 0402 chip and 350 pads for 0603 

chip per side. 1600 pads total! 

This kit can be used for placement, 

soldering or epoxy dispenser testing. 


Rev-A 

0.50 

0603 

0.76 

1.0 

0.25 

0402 

0.51 

0.77 

Features 

LPI Solder MaskFR4 Board .062” 

Double Sided 




122





Machine Run 



Component 964000 964010 964025 984050 964100 

1 Kit 10 Kits 25 Kits 50 Kits 100 Kits 


Board 1 10 25 50 100 

0402 Chip Resistor 1000 10,000 20,000 40,000 80,000 

0603 Chip Resistor 1000 10,000 15,000 30,000 60,000 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 964002 964200 964210 964225 964250 964299 

Ag – Silver 964006 964600 964610 964625 964650 964699 

Cu – OSP 964008 964800 964810 964825 964850 964899 

Au – Gold 964009 964900 964910 964925 964950 964999 

Standard 

SnPb – HASL 964001 964000 964010 964025 964050 964100 


Note: 984001 is now 964002 

123



PN 968001 

Fax 1-714-891-0321 © 1998 TopLine 

300x 0805 Resistors 

300x 1206 Resistors 

Speed Kit 

Put your machine to the test . 

This Kit is a low cost way for you 

to measure the component per 

hour (CPH) rating of pick & place 

machines. Use to benchmark 

and compare the performance of 

different machines. 

Each side has land patterns for 300 

each 0805 and 1206. Total of 1200 

pads on the board. 

This kit can be used for placement, 

soldering or epoxy dispenser testing. 


Rev-A 

0.64 

0805 

1.77 

1.4 

1.65 

Ph 1-714-898-3830 

Features 

1206 



Double Sided 



1.65 

1.65 


124




Machine Run 



968000 968010 968025 968050 968100 

Component 1 Kit 10 Kit 25 Kits 50 Kits 100 Kits 

Kit 

Board 1 10 25 50 100 

0805 Chip Resistor 300 3,000 7,500 15,000 30,000 

1206 Chip Resistor 300 3,000 7,500 15,000 30,000 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 968002 968200 968210 968225 968250 968299 

Ag – Silver 968006 968600 968610 968625 968650 968699 

Cu – OSP 968008 968800 968810 968825 968850 968899 

Au – Gold 968009 968900 968910 968925 968950 968999 

Standard 

SnPb – HASL 968001 968000 968010 968025 968050 968100 


Note: 983001 is now 968002 

125

Advanced SMD Kit 

for the Expert 

PN 930001 

Advanced Kit 

Put your machine through its 

paces with the Advanced SMD 

Kit. Includes a wide selection of 

fine-pitch parts from 0.4mm pitch. 

All components are packaged on 

tape and reel for machine run. Also 

available single packed for manual 

assembly. 

Fax 1-714-891-0321 © 1998 TopLine 

QFP 256 

.4mm 

TSOP32 

.5mm 

LQFP100 .5mm 

QFP 120 

.8mm 

QFP100 .65mm 

QFP 208 

.5mm 

LQFP144 .5mm 

Ph 1-714-898-3830 

QFP 160 

.65mm 

QFP64 1.0mm 

BQFP100 25Mil 

Features 



Double Sided 



Actual Size: 4” x 5.5 (100 x 140mm) 

126

Advanced SMD Kit 

for the Expert 



Machine Run 

Component 



931000 931010 931024 931048 931096 


Board 

1 10 24 48 96 

QFP256 0.4mm 1 10 24 48 96 

QFP208 0.5mm 1 10 24 48 96 

LQFP144 0.5mm 1 10 24 48 96 

LQFP100 0.5mm 1 10 24 48 96 

TSOP32 0.5mm 1 10 24 48 96 

QFP100 0.65mm 1 10 24 48 96 

*BQFP100 25.0mil 1 10 24 48 96 

QFP160 0.65mm 1 10 24 48 96 

*QFP120 0.8mm 1 10 24 48 96 

QFP64 1.0mm 1 10 24 48 96 

*BQFP100 and QFP120 only in SnPb Kit 


Spare 1 10 24 48 96 


Lead Free 

Sn – Tin 930002 931200 931210 931224 931248 931296 

Ag – Silver 930006 931600 931610 931624 931648 931696 

Cu – OSP 930008 931800 931810 931824 931848 931896 

Au – Gold 930009 931900 931910 931924 931948 931996 

Standard 

SnPb – HASL 930001 931000 931010 931024 931048 931100 


127

28mm QFP 

Assortment Kit 

0.4mm to 0.8mm Pitch 

PN 962001 

28mm QFP Assortment 

Try them all. We give you four 

different lead pitches: 0.4mm, 

0.5mm, 0.65mm and 0.8mm. 

Experience the differences in levels 

as you progress to 0.4mm pitch. 

Fax 1-714-891-0321 © 1997 TopLine 

QFP 256 .4mm 

QFP 160 .65mm 

Ph 1-714-898-3830 

QFP 208 .5mm 

QFP 120 .8mm 

Features 



Double Sided 




128

28mm QFP 

Assortment Kit 

0.4mm to 0.8mm Pitch 



Machine Run 

Component 



962000 962012 962024 962048 962096 


Board 

1 12 24 48 96 

QFP256 0.4mm 1 12 24 48 96 

QFP208 0.5mm 1 12 24 48 96 

QFP160 0.65mm 1 12 24 48 96 

*QFP120 0.80mm 1 12 24 48 96 

*QFP120 only in SnPb Kit 


Spare 1 12 24 48 96 


Lead Free 

Sn – Tin 962002 962200 962212 962224 962248 962296 

Ag – Silver 962007 962600 962612 962624 962648 962696 

Cu – OSP 962008 962800 962812 962824 962848 962896 

Au – Gold 962009 962900 962912 962924 962948 962996 

Standard 

SnPb – HASL 962001 962000 962012 962024 962048 962096 


129

QFP256 Kit 

0.4mm Pitch 

4X QFP256 

P= .4mm /15.7Mil 

Be on the cutting edge with 0.4mm 

(15.7Mil) pitch. It’s guaranteed to 

push vision and soldering equipment 

to its limits. 

Fax 1-714-891-0321 © 1998 TopLine 

PN962501 

QFP 256 QFP 256 

Ph 1-714-898-3830 

QFP 256 QFP 256 

Features 



Double Sided 




130

QFP256 Kit 

0.4mm Pitch 


Component 

Manual 

Assembly 

Machine Run 



962500 962512 962524 962548 962596 


Board 

1 12 24 48 96 

QFP256 0.4mm 4 48 96 192 384 


Spare 1 12 24 48 96 


Lead Free 

Sn – Tin 962502 962520 962521 962522 962525 962529 

Ag – Silver 962507 962560 962561 962562 962565 962569 

Cu – OSP 962508 962580 962581 962582 962585 962589 

Au – Gold 962509 962590 962591 962592 962595 962599 

Standard 

SnPb – HASL 962501 962500 962512 962524 962548 962596 


131

QFP208 Kit 

0.5mm Pitch 

4X QFP208 

P= .5mm /19.7Mil 

Practice assembling 0.5mm (19.7Mil) 

pitch. The QFP208 is a very popular 

package. Components are provided 

on tape and reel. 

Fax 1-714-891-0321 © 1998 TopLine 

PN 962101 

QFP 208 

QFP 208 

Ph 1-714-898-3830 

QFP 208 

QFP 208 

Features 



Double Sided 




132

QFP208 Kit 

0.5mm Pitch 


Component 

Manual 

Assembly 

Machine Run 



962100 962112 962124 962148 962196 


Board 

1 12 24 48 96 

QFP208 0.5mm 4 48 96 192 384 


Spare 1 12 24 48 96 


Lead Free 

Sn – Tin 962102 962120 962121 962122 962125 962129 

Ag – Silver 962107 962160 962161 962162 962165 962169 

Cu – OSP 962108 962180 962181 962182 962185 962189 

Au – Gold 962109 962190 962191 962192 962195 962199 

Standard 

SnPb – HASL 962101 962100 962112 962124 962148 962196 


Note: 982001 is now 962102 

133

Rotational Placement 

Kit 

Tests Accuracy to ± 0.5° 

PN 961801 

0° 

Rotational Test 

45° 

Be on target! Some problems do 

not become evident until you start 

rotating components. TopLine’s 

Rotational Placement Kit is designed 

to test the rotational accuracy on 

your system to ±0.5°. 

Fax 1-714-891-0321 © 1998 TopLine 

-22.5° 

0° 

22.5° 

-45° 

-67.5° 

-90° 

-112.5° 

-135° 

45° 

67.5° 

90° 

112.5° 

135° 

-157.5° 180° 

157.5° 

Ph 1-714-898-3830 

22.5 ° 

90 ° 

Features 



Double Sided 




134

Rotational Placement 

Kit 

Tests Accuracy to ± 0.5° 


Manual 

Assembly 

Machine Run 


Component 


961800 961806 961812 961825 


Board 

1 6 12 25 

TSOP32 0.5mm 8 50 100 200 

SO16 1.27mm 8 50 100 200 

1206 Chips 60 300 750 1500 


Spare 1 12 25 50 


Lead Free 

Sn – Tin 961802 - 961821 961822 961824 

Ag – Silver 961807 - 961861 961862 961864 

Cu – OSP 961808 - 961881 961882 961884 

Au – Gold 961809 - 961891 961892 961894 

Standard 

SnPb – HASL 961801 961800 961812 961825 961850 


135

QFN DAISY CHAIN KIT 

3 ~ 12mm 

PITCH 0.4 ~ 0.65mm 

This kit provides a wide variety of 

daisy chain bottom terminal QFN 

components 8 ~ 80pins for solder 

practice and continuity testing. Pitch 

0.4mm to 0.65mm provides 

advanced and easy to handle 

combinations. Component size 

3mm to 12mm covers the full range 

of package sizes. Large ground pads 

present a challenge for correct solder 

paste deposition and reflow. Test 

terminals T1-T2-T3 provide easy 

method to verify zero ohm continuity 

testing after assembly and reflow. 


Features 



Double Sided 



136

QFN DAISY CHAIN KIT 

3 ~ 12mm 

PITCH 0.4 ~ 0.65mm 


Component 

Manual 

Assembly 

Machine Run 



975200 975205 975210 975225 


Board 1 5 10 25 

QFN 16L 3x3mm 0.5mm 2 10 20 50 

QFN 16L 4x4mm 0.65mm 2 10 20 50 

QFN 20L 4x4mm 0.5mm 2 10 20 50 

QFN 24L 4x4mm 0.5mm 2 10 20 50 

QFN 24L 5x5mm 0.65mm 2 10 20 50 

QFN 28L 5x5mm 0.5mm 2 10 20 50 

QFN 32L 5x5mm 0.5mm 2 10 20 50 

QFN 40L 6x6mm 0.5mm 2 10 20 50 

QFN 48L 7x7mm 0.5mm 2 10 20 50 

QFN 56L 7x7mm 0.4mm 2 10 20 50 

QFN 56L 8x8mm 0.5mm 2 10 20 50 

QFN 64L 9x9mm 0.5mm 2 10 20 50 

QFN 72L 10x10mm 0.5mm 2 10 20 50 

QFN 80L 12x12mm 0.5mm 2 10 20 50 

* Note: All QFN are Lead-Free (Pb-Free) 


Spare 1 5 10 25 


Lead Free 

Sn – Tin 975002 975200 975205 975210 975225 

Ag – Silver 975006 - - - 975625 

Cu – OSP 975008 - - - 975825 

Au – Gold 975009 975900 975905 975910 975925 

Standard 

SnPb – HASL 975001 975000 975005 975010 975025 


137

Beginners 

Throughhole Kit 

BEGINNERS KIT © 1998 

Oscillator 

+ 

U1 

U2 

U3 

TM 

The beginners Throughhole Kit 

is a low-cost, entry level kit for 

practicing with a wide range of 

components. Total of 24 easy-toidentify 

components are provided 

in kit. 

LX0 

C1 

LX2 

C2 C3 F1 

K 

R9 

C4 

+ 

R1 R2 R3 R4 R5 R6 R7 R8 

R10 

D1 

-9V - 9V 

A B C D E F G H 

R11 

Inductor 

L1 

Q1 

+ 

Features 


Single Sided 




138

Beginners 






board 910000 910010 910025 910050 910100 

Component Location 1 Kit 10 Kits 25 Kits 50 Kits 100 Kits 

Board 1 10 25 50 100 

Oscillator LX0 1 10 25 50 100 

Crystal LX2 1 10 25 50 100 

Radial Aluminum Cap C1 1 10 25 50 100 

Ceramic Capacitor C2 1 10 25 50 100 

Film Capacitor C3 1 10 25 50 100 

Axial Aluminum Cap C4 1 10 25 50 100 

Axial Inductor L1 1 10 25 50 100 

Resistor Network SIP6 R9 1 10 25 50 100 



SAW Filter SIP5 F1 1 10 25 50 100 

Transistor TO92 Q1 1 10 25 50 100 

Rectifier DO35/DO41 D1 1 10 25 50 100 

Integrated Circuit DIP16 U1 1 10 25 50 100 



Resistor 1/8 W R1-4 4 40 100 200 400 

Resistor 1/4 W R5-8 4 40 100 200 400 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 910003 910200 910210 910225 910250 910299 

Ag – Silver 910006 910600 910610 910625 910650 910699 

Cu – OSP 910008 910800 910810 910825 910850 910899 

Au – Gold 910009 910900 910910 910925 910950 910999 

Standard 

SnPb – HASL 910002 910000 910010 910025 910050 910100 


139

Multipurpose 


PN 915001 

Multi Purpose Board 

We supply the board and a wide 

assortment of components. This 

board has room for at least 200 

different components. You decide 

where to insert the components. 

Kits are available for machine or 

manual insertion. 

Fax 1-714-891-0321 © 1998 TopLine 

Ph 1-714-898-3830 

Features 


Double Sided 


920 Plated Throughholes 

Hole Pitch 0.10-inch 


140

Multipurpose 




Machine Run 

order Order Order Order Order Order 

number Number Number Number Number Number 

916000 916025 916050 916100 915050 915100 

Component 1 Kit 25 Kits 50 Kits 100 Kits 50 Kits 100 Kits 

Board 1 25 50 100 50 100 

8-PIN DIP 5 100 200 400 200 400 

14-PIN DIP 5 100 200 400 200 400 

16-PIN DIP 5 100 200 400 200 400 

20-PIN DIP 5 50 100 200 100 200 

SIP Resistor Network 10 100 200 400 200 400 

Oscillator 2 40 100 200 100 200 

Radial Capacitor 10 250 500 1000 500 1000 

1/8 W Axial Resistor 50 1000 2500 5000 2500 5000 




Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 915002 916200 916210 916225 916250 916299 

Ag – Silver 915006 916600 916610 916625 916650 916699 

Cu – OSP 915008 916800 916810 916825 916850 916899 

Au – Gold 915009 916900 916910 916925 916950 916999 

Standard 

SnPb – HASL 915001 916000 916010 916025 916050 916100 


141

Econo Kit II 

Mixed Technology for 

Soldering Certification 

TM 

0805 

TopLine offers an economical, mixed 

technology kit with fine pitch. 

This kit is used by employment 

agencies for soldering certification. 

TQFP100 P = 0.5mm 

U1 

DIP14 

U2 

1206 

U3 

U4 

U5 

SO14 

U6 

Features 



Single Sided 




142

Econo Kit II 




Component 

Manual 

Machine Run 


Assembly 



938000 938010 938025 938050 938100 


Board 

1 10 25 50 100 

LQFP100 0.5mm 2 20 50 100 200 

SO14 50mil 2 20 50 100 200 

DIP14 100mil 2 20 50 100 200 

0805 Chip 2 20 50 100 250 

1206 Chip 2 20 50 100 250 

Note: Kits of 10, 25, 50 and 100 are bulk packed 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 938002 938200 938210 938225 938250 938299 

Ag – Silver 938006 938600 938610 938625 938650 938699 

Cu – OSP 938008 938800 938810 938825 938850 938899 

Au – Gold 938009 938900 938910 938925 938950 938999 

Standard 

SnPb – HASL 938001 938000 938010 938025 938050 938100 


143

Econo Kit III 



PN 939001 Rev C 

U1 

CR1 

+ 

R3 R4 R5 

0805 

R6 R7 R8 

1206 

TM 

R1 

R2 

C1 

U2 

ECONO 3 

+ 

U4 

U3 

DIP16 

PLCC44 

QFP100 

©2003 TopLine 

TopLine offers an economical, 

mixed technology kit with popular 

components including fine pitch. 

This kit is used by employment 

agencies for soldering certification 

of assemblers. 

Features 



Single Sided 



Tooling Holes 

Actual Size: 2” x 3” (50mm x 76mm) 

144

Econo Kit III 




Component 

Manual 

Assembly 

Manual Assembly Machine Run 



939000 939010 939025 939050 939100 

pitch 1Kit 10 Kits 25 Kits 50 Kits 100 Kits 

Board 

1 10 25 50 100 

QFP100 0.65mm 1 10 25 50 100 

PLCC44 1.27mm 1 10 25 50 100 

SO16 1.27mm 1 10 25 50 100 

DIP16 2.54mm 1 10 25 50 100 

0805 Chip 3 30 75 150 300 

1206 Chip 3 30 75 150 300 

MELF 1 10 25 50 100 

1/4W resistor .5 inch 2 20 50 100 200 

AL CAP .2 inch 1 10 25 50 100 

Note: Kits of 10, 25, 50 and 100 are bulk packed 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 939002 939200 939210 939225 939250 939299 

Ag – Silver 939006 939600 939610 939625 939650 939699 

Cu – OSP 939008 939800 939810 939825 939850 939899 

Au – Gold 939009 939900 939910 939925 939950 939999 

Standard 

SnPb – HASL 939001 939000 939010 939025 939050 939100 


145

Econo IV 


Recertification Kit 

PN 912001 ©1999 

R1 

R2 

R3 

R4 

TM 

U1 

R6 

R5 

Recertification 

C2 C3 C4 

0805 

R11 R12 R13 

1206 

R10 

R9 

R8 

R7 

Q1 

C1 

D1 

D2 

The Econo IV Kit offers an 

economical mixed technology kit 

with simple components. 

This kit is used for soldering 

re-certification of assemblers. 

Features 



Single Sided 


Tooling Holes 

Actual Size: 

2” x 3” (50 x 76mm) 

146

Econo IV 


Recertification Kit 


Component 

Manual 

Manual 

Assembly 

Machine Run 

Assembly 



912000 912010 912025 912050 912100 

pitch 1Kit 10 Kits 25 Kits 50 Kits 100 Kits 

Board 

1 10 25 50 100 

DIP16/18 IC 1 10 25 50 100 

TO-5 Transistor 1 10 25 50 100 

CK05 Capacitor 1 10 25 50 100 

DO-35 Diode 2 20 50 100 200 

0805 Chip SMD 3 30 75 150 300 

1206 Chip SMD 3 30 75 150 300 

1/4 W Resistor Axial Lead 10 100 250 500 1000 

Note: Kits of 10, 25, 50 and 100 are bulk packed. 


Spare 1 10 25 50 100 


Lead Free 

Sn – Tin 912002 912200 912210 912225 912250 912299 

Ag – Silver 912006 912600 912610 912625 912650 912699 

Cu – OSP 912008 912800 912810 912825 912850 912899 

Au – Gold 912009 912900 912910 912925 912950 912999 

Standard 

SnPb – HASL 912001 912000 912010 912025 912050 912100 

147

12 Layer Lead Free 


Daisy Chain 

RoHS 

Pb-Free 

A+ B+ C+ D+ 

12-layer board designed with heat 

dissipating (thermal relief) inner 

layers, makes this board a challenge 

to solder. Boards available in 

4 Lead Free finishes. 

16 

22 

BOARD PLATING (Pb Free): 

Sn100 – White Tin (Immersion Tin) 

Ag - Immersion Silver 

Cu - OSP (Entek 106) 

Au - Gold Ni-Au (ENIG) 

(Electroless Nickel, Immersion Gold) 

26 

32 

36 

40 

48 

52 

DAISY CHAIN 

DIP14 

Zero Ohm 1⁄4 W Resistors 

Go, No-Go Test Points 

PLATED HOLES 

Throughhole barrels with thermal 

relief are connected to all 10 

inner layer copper ground planes 

for soldering capillary test. 

10 holes with graduating sizes: 

.016”- .062” (0.4mm ~1.6mm) 

57 

62 

A- B- C- D- 

TM 

913001 BOTTOM REV B 

Actual Size: 4.0” x 5.5” (100 x 140mm) 0.10” (2.5mm) thick 

FEATURES 


FR4 Board 0.10” (2.5mm) Thick 

Tg = 175˚C 12 Layer 

Copper ground plane inner layers 

Tooling Holes 

Fiducials Marks 

450 Plated Holes 

Thermal Relief Wagon Wheel 

Side View 

Component (top) 

10x Inner Layers 

Solder (bottom) 

148 

Inner Layer PTH

12 Layer Lead Free 


Daisy Chain 


Machine Run 



913216 913232 913248 913264 913296 

Component notes 16 Kits 32 Kits 48 Kits 64 Kits 96 Kits 

*Board Sn100 16 32 48 64 96 

DIP14 Daisy Chain Test 256 512 768 1024 1536 

DIP14 Non Daisy Chain 64 128 192 256 384 

1/4 W Resistors Zero Ohm 320 640 960 1280 1920 

Connector 120 Pin 16 32 48 64 96 

AMP 1-5145154-2 

*Note: Contact TopLine for combination kits with assortment of finishes: Sn, Ag, OSP, Au 


Spare 16 32 48 64 96 

Description Board Kits Kits Kits Kits Kits 

Lead Free 

Sn – Tin 913002 913216 913232 913248 913264 913296 

Ag – Silver 913007 913616 913632 913648 913664 913696 

Cu – OSP 913008 913816 913832 913848 913864 913896 

Au – Gold 913009 913916 913932 913948 913964 913996 


149

NASA Solder Training 


The NASA kit includes a wide 

assortment of legacy throughhole and 

SMT components including flat packs and 

solder terminals. 


Features 

FR4 Board .062” SnPb HASL 

Double Sides 


Plated Throuhholes 

Without Solder Mask 

KIT CONTENTS 

Item Ref Part Type or Description 

1 U1, U2 DIP 14L (.3x.75) 

2 U3, U4 DIP 16L (.3x.75) 

3 U5, U6 FP 14L (Flat Pack) 

4 U7, U8 FP 16L (Flat Pack) 

5 U9, U10 TO-99 

6 Q1, Q2 TO-5 

7 Q3, Q4 TO-18 

8 D1, D2 DO-35 

9 C1, C2, C3, C4 CK05/CK06 (Molded Capacitor) 

10 C5, C6 KK4 (Disc Capacitor) 

11 C7, C8 CS2 (B-Case Tantalum) 

12 R1, R2 RC05 1/8W Resistor (.015 wire) 

13 R3. R4 RC05 1/8W Resistor (.015 wire) 


15 R7, R8 RC07 1/4W Resistor 


17 R11, R12 RC20 1/2W Resistor 

18 E11-E16 Bifurcared Terminals .094 collar 

19 E17-E22 Turret Terminals 0.125 collar 

KIT ORDERING INFO 

Tin-Lead PWB ORDER ORDER ORDER 

with components NUMBER NUMBER NUMBER 

for customer to 979000 979010 979025 

hand assemble 1 Kit 10 Kits 25 Kits 

Spare PWB Order Number 979001 

150

Non Collapsible Solder Ball 

Sn96.5Ag3.5 with Cu & Elastomer Core 

Dia copper Solder part 

D Core Cu S number 

Plastic Core 

Ni 

80um 60um 3um 7um NN2-SOL-80-3C7SA 












Cu 

CORE 

Cu 

Ni Barrier Layer 

SnAg Solder 

Ni Dope 

D 

APPLICATIONS: 

DIMENSIONALLY STABLE. SOLDERABLE. DURABLE. 

USE TO SUPPORT & INTERCONNECT MODULES TO MOTHER BOARD. 

NON-COLLAPSIBLE TOP MOUNTED BGA/CSP (PoP) PACKAGE. 

SOLDERABLE SPACER/STANDOFF. FR4, GLASS, CERAMIC, BT 

S 

Solder 

CCGA SOLDER COLUMNS 

column 

Figure Diameter Length Materials 

1 0.020” 0.087” Pb90/Sn10 

0.51mm 2.21mm 

*NASA 

2 

0.020” 0.087” 

0.51mm 2.21mm 

0.020” 0.100” 

0.51mm 2.54mm 

0.022” 0.087” 

0.56mm 2.21mm 

Pb80/Sn20 

Cu Wrap 

0.022” 0.100” 

0.56mm 2.54mm 

3 0.020” 0.050” Be Cu 

0.51mm 1.27mm Micro-Coil 

Spring 

Fig. 1 

Fig. 2 

Fig. 3 

Pb90/Sn10 Pb80/Sn20 

Be Cu 

Plain 

Cu Wrap 

Spring 

* Licensed from NASA under U.S. Patent Application Serial No. 13/800,692 

151

RoHS 

Pb-Free 



Open Tool Packages 

Visit www.MirrorSemi.com 


Cavity 

Bottom 


Body D/E Nbr Lead Die Pad Cavity Package Tray 

Size SQ Leads Pitch mm Part Number XH1 Qty 

3mm 8 0.65mm 1.4 SQ M-QFN8W.65 100 

3mm 12 0.5mm 1.4 SQ M-QFN12W.5 100 

3mm 16 0.5mm 1.4 SQ M-QFN16W.5 100 

4mm 16 0.65mm 2.4 SQ M-QFN16W.65 64 

4mm 20 0.5mm 2.4 SQ M-QFN20W.5 64 

4mm 24 0.5mm 2.4 SQ M-QFN24W.5 64 

5mm 32 0.5mm 3.4 SQ M-QFN32W.5 36 

5mm 40 0.4mm 3.4 SQ M-QFN40W.4 36 

6mm 40 0.5mm 4.4 SQ M-QFN40W.5 25 

6mm 48 0.4mm 4.4 SQ M-QFN48W.4 25 

7mm 48 0.5mm 5.4 SQ M-QFN48W.5 81 

8mm 56 0.5mm 6.0 SQ M-QFN56W.5 64 

9mm 64 0.5mm 7.0 SQ M-QFN64W.5 49 

10mm 72 0.5mm 8.0 SQ M-QFN72W.5 49 

12mm 80 0.5mm 9.0 SQ M-QFN80W.5 36 

TOP VIEW 

A 

D 

0.175 

6° 

SIDE VIEW 

0.635 

PITCH 

BOTTOM VIEW 

W 

E 

Die 

Pad 

E 

Die Pad 

Pad 

I 

N 

F 

O 

A 

Die Pad 

0.175 

TYP 

Open cavity. Attach and wire bond your own die. 

Wire bondable. Applications: MEMS, RF Microwave. Fabless prototype, Socket probing 


0.840 

152 

D4 

D 

L



Cavity 

Bottom 

RoHS 

Pb-Free 




Body D/E Nbr Lead Die Pad Cavity Package Flat Lid 

Size SQ Leads Pitch mm Part Number Part Nbr (optional) 

3mm 20 0.4mm 1.4 SQ M-QFN20W.4 T-LID3-BLACK 





























153

Dome Lids for M-QFN 

Covers for Tall Die 

RoHS 

Pb-Free 


D / E 

Body Sheilded lcp ceramic glass 

Size SQ aluminum black al 2 

O 3 

clear 

3mm Z-CAP3-ALUM L-CAP3-BLACK C-CAP3-WHITE G-CAP3-GLASS 









SERIES (C) CAVITY ___H___ 

L-CAP 0.6~2.0mm 1.0~3.0mm 

G-CAP 0.60mm 1.1mm 

Z-CAP 1.0mm 1.6mm 

C-CAP 0.6mm 1.0mm 

Top View 

Side View 

Cavity 

(C) 

Bottom View 

D 

Cavity 

D 

E 

H 

E 

I 

N 

F 

O 

Add a dome lid to cover an M-QFN to extend the head room over tall die. 

Available in a variety of materials. Custom sizes are readily available. 


154

Flat Lids for M-QFN 

RoHS 

Pb-Free 

D /E Pre-Form Pre-Form 


Body Adhesive adhesive Non-Adhesive Non-Adhesive Non-Adhesive 

Size SQ black black glaSS WHITE BLACK 

3mm B-LID3-BLACK C-LID3-BLACK G-LID3-GLASS T-LID3-WHITE T-LID3-BLACK 









Top View Side View Bottom View 

D 

E 

H 

I 

N 

F 

O 

ADHESIVE LID THICK 

MATERIAL PREFORM SERIES H 

BT None T-LID BLACK 0.2mm 

BT Yes B-LID BLACK 0.3mm 

CERAMIC Yes C-LID-BLACK 0.35mm 

RO-4003C None T-LID WHITE 0.2mm 

GLASS None G-LID GLASS 0.63mm 


155

RoHS 

Pb-Free 

Silicon Test Die 

For Bonding Practice 

Daisy Chain & Isolated 


Die pad nbr tray part 

Fig. Circuit Size Size pads Qty Number 

Fig. 1 Daisy Chain 1.0x1.0mm 60x160µm 8 Pair 100 TD8-1.0-DC 



Fig. 4 Isolated 1.0x1.0mm 60µm SQ 16 100 TD16-1.0-ISO 



Fig. 7 Differential Pair 1.0x1.0mm 60x160µm 2 + GND 100 TD2-1.0-DIF 



Fig. 10 Fully Plated 1.0x1.0mm 900µm SQ 1 100 TD1-1.0-BUS 



Not to Scale 

Fig. 1 

TD8-1.0DC 

Fig. 2 

TD16-2.5-DC 

Fig. 3 

TD24-4.0-DC 

I 

N 

F 

O 

Die Material is Silicon (Si) 250um (10mil) thick. 

Metallization 1.0um Aluminum (Al) over 0.75µm SiO 2 

Wire bondable with Gold (Au) or Aluminum (Al) wire. 

Applications: Wire Bonding Practice or for RF / impedance characterization trials. 

156

RoHS 

Pb-Free 

Fig. 4 

TD16-1.0-ISO 

Silicon Test Die 

For Bonding Practice 

Outline Drawings 


Not to Scale 

Fig. 5 

TD32-2.5-ISO 

Fig. 6 

TD48-4.0-ISO 

Fig. 7 

TD2-1.0-DIF 

Fig. 8 

TD2-2.5-DIF 

Fig. 9 

TD2-4.0-DIF 

Fig. 10 

TD1-1.0-SUS 

Fig. 11 

TD1-2.5-BUS 

Fig. 12 

TD1-4.0-BUS 

157

International Distributors 

Europe 

Benelux, Belgium, Netherlands 

Rotec 

Tel + 32 (0) 14.44.50.00 

E-mail info@rotec.be 

www.rotec.be 

Denmark 

ETRONIX 

Tel + 46-(0)173-30927 

E-mail Goran.Berg@etronixAB.se 

www.etronixAB.se 

Finland 

Uptech Finland 

Tel + 358-40-5479 338 

E-mail jarno.pyoria@uptech.fi 

France 

Peri-Cles 

Tel + 33-01-6055.50.15 

E-mail peri-cles@orange.fr 

www.peri-cles.com 

France 

ATOO electronics 

Tel + 33-02-99.08.01.90 

E-mail info@atoo-electronics.com 

www.atoo-electronics.com 

Germany 

Factronix 

Tel + 49-8153-90664-0 

E-mail office@factronix.com 

www.factronix.com 

Germany 

Weidinger 

Tel + 49-(0)8141/3636-0 

E-mail info@weidinger.eu 

www.weidinger.eu 

Ireland 

IPT Limited 

Tel + 353-21-4317201 

E-mail eileenc@ipt.ie 

www.iptelectronics.com 

Italy (North) 

CepeItalia 

Tel +39-02-4073747 

E-mail info@cepeitalia.eu 

Italy (South) 

CEPE Forniture 

Tel +39-075.95.61.86 

E-mail cepeelettronica@virgilio.it 

Norway 

ETRONIX 

Tel + 46-(0)173-30927 



Poland 

Semicon 

Tel + 48-22-615-6431 

E-mail info@semicon.com.pl 

www.semicon.com.pl 

Russia 

Ostec Enterprise 

Tel +7 (494) 788-4444 

E-mail Alexander.Votintsev@ostec-smt.ru 

Russia 

New Technologies 

Tel +7 (812) 448-53-24 

E-mail mail@tecnew.ru 

www.tecnew.ru 

Spain 

Necten 

Tel + 34-091-694-2409 

Tel + 34-093-751-0097 

E-mail necten@necten.com 

Sweden 

ETRONIX 

Tel + 46-(0)173-30927 



Switzerland 

Hilpert 

Tel + 41-56-483-2525 

E-mail office@hilpert.ch 

www.hilpert.ch 

United Kingdom 

Kaisertech 

Tel + 44-023-8065-0065 

E-mail sales@kaisertech.co.uk 

www.kaisertech.co.uk 

Turkey 

Esman Elektronik 

Tel + 90-216-516-02 20 

E-mail esman@esmanelektronik.com 

158

International Distributors 

Asia & Pacific 

Africa 

Australia 

Machinery Forum (VIC) 

Melbourne (Head Office) 

Tel + 61-3-9497-3633 

E-mail 

machinery@machineryforum.com.au 

Australia 

Machinery Forum (NSW) 

Sydney 

Tel + 61-2-9638-1566 

E-mail 

machinery@mafosyd.com.au 

China and Hong Kong 

GELEC 

Tel + 852-2919-8383 

E-mail electronics@gelec.com.hk 

www.gelec.com.hk 

China and Hong Kong 

Borison Electronics 

Tel + 852-268-70948 

E-mail hongkong@borison.com 

www.borison.com 

China-Shanghai 

Jamron 

Tel + 86-21-51097866 

E-mail info@jamron.com 

www.jamron.com 

China Shanghai 

Dou Yee 

Tel + 86-21-5899 4619 

E-mail chinkc@douyee.com.cn 

India 

EMST Technologies 

Tel + 91-20-3250 1000 

E-mail contact@emsoline.com 

Israel 

G-Suit 

Tel + 972-3-634 4474 

E-mail sassi@gsuit.co.il 

Japan 

ADY 

Tel + 81-06-6397-0412 

E-mail ADY@TopLine.tv 

www.ADY-JP.com 

Korea 

Jin Trading 

Tel + 82-031-499-5633 

E-mail jeong6651@naver.com 

www.jtco.co.kr 

Malaysia 

Dou Yee 

Tel + 65-6444-2678 

E-mail marketing@douyee.com 

www.douyee.com 

Singapore 

Dou Yee 

Tel + 65-6444-2678 



Thailand 

Dou Yee 

Tel + 65-6444-2678 



Taiwan 

Zinby 

Tel + 886-2-8228-0880 

E-mail zinby1@giga.net.tw 

South Africa 

Test & Rework 

Tel +27 -11- 704-6677 

E-mail sales@testandrework.co.za 

Tunisia 

ATOO Electronics 

Tel + 216-71 296 015 

E-mail contact@Atoo-Africa.com 

www.AtooAfrica.com 

Americas 

United States & Canada 

TopLine 

Tel + 1-800-776-9888 

Fax + 1-478-451-3000 

E-mail sales@topline.tv 

www.topline.tv 

Mexico 

TopLine 

Tel + 1-478-451-5000 


Brazil 

Intract 

Tel + 55-11-3392-6222 

E-mail eletro@intract.com.br 

www.intract.com.br 

Argentina 

TopLine 

Tel +1 - 478 - 451-5000 


Chile 

POIROT 

Tel + 56-2-688-4466 

E-mail Luis.Lund@poirot.cl 

159

Universal QFP 

Lead Straightener 

Rework Tool 

TM 

QFP Lead Straightener 

Low cost Universal QFP Lead 

Straightener handles all QFP, TQFP 

and LQFP with pitch of 0.4mm 

to 1.0mm. 

0.4mm Pitch 

0.5mm Pitch 

0.635mm Pitch 

0.65mm Pitch 

0.8mm Pitch 

1.0mm Pitch 

Actual Size: 4” x 5.5” (100 x 140mm) .048" (1.2mm) thick 

©2003 TopLine P/N 900000 REV A Design Patent D512,970 

Complete set includes all 

template patterns. 

Use standard hand tools such as 

dental picks and tweezers to adjust 

leads of QFP to match recessed 

template slots. 

Great for rework and recovery of 

expensive QFP, TQFP and LQFP. 

Also use for incoming inspection. 

Conductive heavy duty stainless 

steel construction - precision 

coplanarity. 

For use on benchtop. 

Lead Count and Pitch 

Includes: 

0.4mm 

64L 

80L 

120L 

128L 

176L 

216L 

256L 

0.5mm 

32L 

48L 

64L 

80L 

100L 

128L 

144L 

160L 

176L 

184L 

208L 

240L 

0.65mm 0.8mm 

52L 32L 

80L 44L 

100L 64L 

144L 80L 

160L 120L 

128L 

0.635mm 

84L 1.0mm 

100L 44L 

132L 52L 

64L 

Order Number: 900000 

Design Patent D512,970 

160

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